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TSM-DS3 2-Layer 30mil Low Loss Thermal Conductive PCB for Phased Array Antennas and Radar Systems
TSM-DS3 2-Layer 30mil Low Loss Thermal Conductive PCB for Phased Array Antennas and Radar Systems
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. TSM-DS3 PCB Introduction
TSM-DS3 PCB utilizes a ceramic-filled reinforced composite material with minimal fiberglass content (approximately 5%), delivering performance that rivals traditional epoxies in large-format complex multilayer applications. This thermally stable material provides industry-leading low loss characteristics (Df = 0.0011 at 10 GHz) while maintaining the manufacturing predictability and consistency of premium fiberglass reinforced epoxies. Specifically engineered for high-power applications, TSM-DS3 laminate features enhanced thermal conductivity (0.65 W/m*K) to effectively dissipate heat from critical components and exhibits exceptionally low coefficients of thermal expansion for superior performance in demanding thermal cycling environments.
2. PCB Construction Details
Specification Category |
Details |
Base Material |
TSM-DS3 |
Layer Count |
2 Layers |
Board Dimensions |
68mm x 126mm (±0.15mm) |
Finished Thickness |
0.8mm |
Copper Weight |
1 oz Outer Layers |
Min. Trace/Space |
5/5 mils |
Min. Hole Size |
0.3mm |
Blind Vias |
None |
Surface Finish |
Immersion Gold |
Solder Mask |
Green (Top), None (Bottom) |
Silkscreen |
White (Top), None (Bottom) |
Electrical Test |
100% |
3. Stackup Structure
2-layer TSM-DS3 PCB configuration employs a TSM-DS3 core with 0.762mm (30mil) thickness, positioned between two 35μm copper layers to create a balanced 0.8mm profile optimized for thermal management and signal integrity.
4. Board Statistics
Components: 42
Total Pads: 114 (78 Thru-Hole, 36 Top SMT)
Vias: 51
Nets: 2
Files: Gerber RS-274-X
Standard: IPC-Class-2
Availability: Worldwide
5. TSM-DS3 Material Features
Dielectric Constant: 3.0±0.05 @ 10GHz
Dissipation Factor: 0.0014 @ 10GHz
Thermal Conductivity: 0.65 W/mK
CTE: X 10/Y 16/Z 23 ppm/°C
Moisture Absorption: 0.07%
Fiberglass Content: ~5%
6. TSM-DS3 Key Benefits
Minimal fiberglass content for enhanced performance
Dimensional stability comparable to epoxy materials
Enables large-format, high-layer-count PCB designs
Consistent and predictable manufacturing yields
Temperature-stable dielectric constant (±0.25%)
Full compatibility with resistive foil materials
7. Typical Applications
RF and Microwave Couplers
Phased Array Antenna Systems
Radar Manifold Assemblies
Millimeter Wave Automotive Antennas
Oil Drilling Electronics
Semiconductor and ATE Testing Equipment