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M6 and IT180 Hybrid PCB 6-Layer Copper Coin Embedded PCB for 5G and Automotive Radar Applications
M6 and IT180 Hybrid PCB 6-Layer Copper Coin Embedded PCB for 5G and Automotive Radar Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. M6 and IT-180 Hybrid PCB Introduction
This Hybrid PCB is a 6-layer rigid board constructed with a hybrid material set of M6 High Speed material and IT-180, achieving a finished thickness of 1.0mm. It is designed for high-frequency applications such as 5G communication base stations and automotive electronics. The board features a mixed copper weight structure, ENIG surface finish, an embedded copper coin, and all vias are resin filled and capped. It complies with IPC-Class-2 quality standards and undergoes 100% electrical testing prior to shipment.
2. PCB Construction Details:
Base Material: M6 High Speed Material + IT-180
Layer Count: 6 Layers
Board Dimensions: 100mm x 50mm = 1PCS, +/- 0.15mm
Minimum Trace/Space: 4/5 mils
Minimum Hole Size: 0.3mm
No Blind Vias
Finished Board Thickness: 1.0mm
Finished Cu Weight: 1oz/0.5oz Mixed in Inner Layer, 1oz (1.4 mils) Outer Layers
Via Plating Thickness: 20 μm
Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen: White
Bottom Silkscreen: White
Top Solder Mask: Green
Bottom Solder Mask: Green
Copper Coin Embedded in the Center of PCB
All Vias Are Resin Filled and Capped
100% Electrical Test Used Prior to Shipment
3. PCB Stackup: 6-Layer Rigid PCB
Copper Layer Top - 35 μm
R5775G (M6) Core - 0.25 mm, DK 3.61
Copper Layer Inn1 - 18 μm
Prepreg - 1080(64%) X 2 - 0.14mm, DK 3.72
Copper Layer Inn2 - 35 μm
IT-180 Core - 0.1 mm DK 4.17
Copper Layer Inn3 - 35 μm
Prepreg - 1080(64%) X 2 - 0.14mm, DK 3.72
Copper Layer Inn4 - 18 μm
IT-180 Core - 0.1 mm DK 4.17
Copper Layer Bottom - 35 μm
4. PCB Statistics:
Components: 75
Total Pads: 224
Thru Hole Pads: 172
Top SMT Pads: 52
Bottom SMT Pads: 36
Vias: 72
Nets: 15
5. Type of Artwork Supplied: Gerber RS-274-X
6. Quality Standard: IPC-Class-2
- Availability: Worldwide
8. Features of M6 High-Speed Material:
Dielectric Constant of DK 3.4 at 1GHz/23°C, 3.34 at 13GHz
Dissipation Factor of 0.002 at 1GHz/23°C, 0.0037 at 13GHz
X Axis CTE of 16 ppm/°C, Y CTE of 16 ppm/°C, Z CTE of 45 ppm/°C
High Tg Value of >185°C (DSC Method), 210°C (DMA Method)
Thermal Decomposition Temp (Td): 410°C (TGA Method)
Supports 4-30 Layer Multilayer PCB Design
Complies with RoHS and Halogen-Free Requirements
Compatible with Traditional FR-4 Processing Technology
Flammability of UL 94V-0
9. Some Typical Applications:
5G Communication Base Stations: Millimeter-Wave Antennas, Radio-Frequency Front-Ends of AAU
Automotive Electronics: 77GHz Millimeter-Wave Radar, ADAS
Networking & Communications
Aerospace & Defense