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F4BTMS255 Double-Sided PCB 60mil Immersion Gold PCB for Aerospace and RF Applications
F4BTMS255 Double-Sided PCB 60mil Immersion Gold PCB for Aerospace and RF Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. F4BTMS255 Double-Sided PCB Introduction
This F4BTMS255 PCB is a double-sided rigid board constructed with F4BTMS255 high-frequency material, achieving a finished thickness of 1.6mm. It is specifically designed for demanding applications in aerospace, radar systems, and RF communications. The board features 1oz copper weight, immersion gold surface finish, and undergoes 100% electrical testing to ensure reliability. Compliant with IPC-Class-2 standards, this PCB offers excellent high-frequency performance with stable dielectric characteristics.
2. PCB Construction Details:
Base Material: F4BTMS255
Layer Count: Double Sided
Board Dimensions: 87mm x 80mm = 1PCS, +/- 0.15mm
Minimum Trace/Space: 5/7 mils
Minimum Hole Size: 0.3mm
No Blind Vias
Finished Board Thickness: 1.6mm
Finished Cu Weight: 1oz (1.4 mils)
Via Plating Thickness: 20 μm
Surface Finish: Immersion Gold
Top Silkscreen: White
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
100% Electrical Test Used Prior to Shipment
3. PCB Stackup: 2-Layer Rigid PCB
Copper Layer 1 - 35 μm
F4BTMS255 Core - 1.524 mm (60mil)
Copper Layer 2 - 35 μm
4. PCB Statistics:
Components: 28
Total Pads: 65
Thru Hole Pads: 44
Top SMT Pads: 21
Bottom SMT Pads: 0
Vias: 41
Nets: 2
5. Type of Artwork Supplied: Gerber RS-274-X
6. Quality Standard: IPC-Class-2
7. Availability: Worldwide
8. F4BTMS255 Material Features:
Dielectric Constant (Dk) of 2.55 +/-0.04 at 10GHz
Dissipation Factor of 0.0012 at 10GHz, 0.0013 at 20GHz
CTE X-axis of 15 ppm/°C, CTE Y-axis of 20 ppm/°C, CTE Z-axis of 80 ppm/°C (-55°C to 288°C)
Low Thermal Coefficient of Dk at -92 ppm/°C (-55°C to 150°C)
UL-94 V0 Flammability Rating
Low Moisture Absorption of 0.025%
RTF Low Roughness Copper Foil Standard
Enhanced Dimensional Stability
Improved Thermal Conductivity
9. Some Typical Applications:
Aerospace Equipment, Space and Cabin Equipment
Microwave, RF Circuits
Radar Systems, Military Radar
Feed Networks
Phase-Sensitive Antennas, Phased Array Antennas
Satellite Communications