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Rogers RT/duroid 6035HTC Double-Sided PCB 30mil High Thermal Conductivity Circuit Board for Power Amplifiers
Rogers RT/duroid 6035HTC Double-Sided PCB 30mil High Thermal Conductivity Circuit Board for Power Amplifiers
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Rogers RT/duroid 6035HTC PCB Material Properties
Rogers RT/duroid 6035HTC PCB employs advanced ceramic-filled PTFE composites specifically engineered for high-power RF and microwave applications. These high-frequency circuit materials deliver exceptional performance in demanding power environments, featuring thermal conductivity nearly 2.4 times higher than standard RT/duroid 6000 series products. The laminates incorporate both ED and reverse-treated copper foil options with demonstrated long-term thermal stability, ensuring reliable operation under continuous high-power conditions. Rogers' proprietary advanced filler system significantly enhances drillability compared to conventional high-thermal-conductivity laminates using alumina fillers, resulting in reduced manufacturing costs and improved production efficiency.
2. PCB Construction & Specifications
Board Type: Double-Sided Rigid PCB
Base Material: Rogers RT/duroid 6035HTC High-Frequency Laminate
Quality Standard: IPC-Class-2
Board Dimensions: 99.8mm x 61.6mm (±0.15mm)
Finished Thickness: 0.8mm
Copper Weight: 1oz (35μm)
Minimum Trace/Space: 4/6 mils
Minimum Hole Size: 0.3mm
Blind Vias: Not Applicable
Via Plating Thickness: 20μm
Surface Finish: Immersion Gold
Solder Mask: None (Top & Bottom)
Silkscreen: Black (Top), None (Bottom)
Electrical Test: 100% tested prior to shipment
3. PCB Stackup Configuration
Layer 1: Copper - 35μm
Core: RT/duroid 6035HTC Laminate - 0.762mm (30mil)
Layer 2: Copper - 35μm
4. PCB Statistics
Components: 19
Total Pads: 53
Thru Hole Pads: 31
Top SMT Pads: 22
Bottom SMT Pads: 0
Vias: 33
Nets: 2
5. Artwork & Standards
Type of artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-2
Availability: worldwide
6. Material Features
Dielectric Constant: 3.5 ± 0.05 @ 10GHz/23°C
Dissipation Factor: 0.0013 @ 10GHz/23°C
Thermal Coefficient of Dielectric Constant: -66 ppm/°C
Moisture Absorption: 0.06%
Thermal Conductivity: 1.44 W/m/K @ 80°C
CTE Values: X-axis 19 ppm/°C, Y-axis 19 ppm/°C, Z-axis 39 ppm/°C
Flammability Rating: UL 94-V0
Lead-Free Process Compatibility: Yes
7. Performance Benefits
High Thermal Conductivity for efficient heat dissipation
Improved dielectric heat dissipation enables lower operating temperatures
Excellent high-frequency performance characteristics
Reduced insertion loss for enhanced signal integrity
Superior thermal stability of circuit traces
Cost-effective drilling and manufacturing process
Long-term reliability in high-power applications
8. Target Applications
High Power RF and Microwave Amplifiers
Power Amplifiers and Transmitter Systems
RF Couplers and Filter Circuits
Power Combiners and Dividers
Wireless Infrastructure Equipment
Base Station Power Systems
Military and Aerospace Power Electronics
9. Global Availability
This Rogers RT/duroid 6035HTC based PCB solution is available for worldwide manufacturing and distribution, supporting both prototype development and volume production requirements across global telecommunications and defense markets.
10. Quality Assurance
100% electrical testing prior to shipment
IPC-Class-2 quality standards compliance
High-power performance validation
Thermal management verification
Mechanical stability testing