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Rogers RO4730G3 2-Layer PCB 20mil PTFE-based ENIG PCB for Antenna Applications
Rogers RO4730G3 2-Layer PCB 20mil PTFE-based ENIG PCB for Antenna Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Rogers RO4730G3 PCB Introduction
Rogers RO4730G3 PCB utilizes hydrocarbon/ceramic/woven glass UL 94 V-0 antenna grade laminate in a 2-layer configuration with 0.6mm thickness. This cost-effective alternative to conventional PTFE-based laminates features ENIG surface finish and green solder mask, providing ideal antenna performance with full compatibility to standard FR-4 processing. RO4730G3 PCB material requires no special through-hole treatments while offering excellent electrical and mechanical properties for cellular base station applications.
2. PCB Construction Details:
Base Material: Rogers RO4730G3
Layer Count: 2 Layers
Board Dimensions: 59.6mm × 40.5mm = 1PCS, ±0.15mm
Minimum Trace/Space: 5/5 mils
Minimum Hole Size: 0.4mm
No Blind Vias
Finished Board Thickness: 0.6mm
Finished Cu Weight: 1oz (1.4 mils)
Via Plating Thickness: 20 μm
Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen: White
Bottom Silkscreen: No
Top Solder Mask: Green
Bottom Solder Mask: No
100% Electrical Test Before Shipment
3. PCB Stackup: 2-Layer Rigid PCB
Copper Layer 1 - 35 μm
Rogers RO4730G3 Core - 0.508 mm (20mil)
Copper Layer 2 - 35 μm
4. PCB Statistics:
Components: 10
Total Pads: 27
Thru Hole Pads: 19
Top SMT Pads: 8
Bottom SMT Pads: 0
Vias: 15
Nets: 2
5. Artwork Format: Gerber RS-274-X
6. Quality Standard: IPC-Class-2
7. Availability: Worldwide
8. RO4730G3 Material Features:
Dielectric Constant: 3.0 ± 0.05 @10GHz
Dissipation Factor: 0.0028 @10GHz
Thermal Coefficient of Dk: 34 ppm/°C
CTE: X-axis 15.9 ppm/°C, Y-axis 14.4 ppm/°C, Z-axis 35.2 ppm/°C
High Tg: >280°C
Thermal Decomposition Temperature: 411°C
Thermal Conductivity: 0.45 W/mK
UL 94 V-0 Rated
9. Material Benefits:
Low Loss Dielectric with Low Profile Foil
30% Lighter than PTFE/Glass
Low Z-axis CTE
Automated Assembly Compatible
Consistent Circuit Performance
Easy Fabrication Process
Lead-free Process Compatibility
RoHS Compliant
10. Typical Applications:
Cellular Base Station Antennas
Wireless Communication Systems
RF Antenna Designs
Telecom Infrastructure
Mobile Network Equipment
Broadcast Antennas
Wireless Access Points