2. Key Features & Benefits

 

Exceptional High-Frequency Performance: Provides tightly controlled dielectric constant (Dk 3.48±0.05 @ 10 GHz) and low dissipation factor (0.0037 @ 10 GHz) for reliable RF signal integrity.

 

Thermal & Mechanical Reliability: Features high Tg (>280°C), low Z-axis CTE (32 ppm/°C), and minimal water absorption (0.06%) to ensure stability in demanding thermal environments.

 

Optimized for Multilayer Construction: CTE closely matched to copper enables excellent dimensional stability, supporting reliable mixed-dielectric stackups and robust plated through-holes.

 

Cost-Effective Microwave Solution: Processes like standard FR-4 without requiring special PTFE handling, reducing fabrication costs while delivering near-PTFE performance.

 

Safety & Compatibility: UL 94 V-0 rated for flammability and compatible with lead-free assembly processes.

 

 

3. Construction & Technical Specifications

 

3. Construction & Technical Specifications

 

Layer Count & Thickness: 4-layer rigid PCB, 0.98mm finished thickness.

 

Base Materials: Rogers RO4350B core + Tg170 FR-4 prepreg and core.

 

Copper Weights: 1oz (35μm) outer layers; 0.5oz (18μm) inner layers.

 

Critical Dimensions: Minimum trace/space of 4/6 mils; minimum hole size of 0.3mm; no blind/buried vias.

 

Surface Finish & Appearance: Immersion gold; green solder mask on both sides; white silkscreen on top and bottom.

 

Quality Assurance: 100% electrical test prior to shipment; IPC-Class-2 quality standard.

 

 

4. PCB Stackup Structure

 

Layer 1: Copper - 35 μm

 

Core: Rogers RO4350B - 0.508 mm (20 mil)

 

Layer 2: Copper - 18 μm

 

Prepreg: FR-4 - 0.2 mm

 

Layer 3: Copper - 18 μm

 

Core: Tg170 FR-4 - 0.102 mm (4 mil)

 

Layer 4: Copper - 35 μm

 

 

5. PCB Assembly Statistics

 

Components: 26

 

Total Pads: 59

 

Through-Hole Pads: 37

 

Top SMT Pads: 22

 

Bottom SMT Pads: 0

 

Vias: 125

 

Nets: 10

 

 

6. Technical & Quality Information

 

Artwork Format: Gerber RS-274-X

 

Quality Standard: IPC-Class-2

 

Availability: Worldwide

 

 

7. Typical Applications

Rogers RO4350B circuit board is designed for high-performance RF and mixed-signal systems, including:

 

Cellular Base Station Antennas and Power Amplifiers

 

Automotive Radar and Advanced Driver-Assistance Systems (ADAS)

 

RF Identification (RFID) Tags and Readers

 

Satellite Communication LNBs and Transceivers

 

Microwave Backhaul and Point-to-Point Radio Equipment

 

Aerospace and Defense Communication Modules

 

 

8. Conclusion

Rogers 4350B high frequency PCB offers an optimized balance of high-frequency performance, thermal reliability, and manufacturing efficiency for advanced RF and multilayer circuit designs. By integrating RO4350B's stable electrical properties with the practical benefits of FR-4 processing, this hybrid board enables cost-effective solutions for telecommunications, automotive, and aerospace applications where signal integrity, thermal management, and structural reliability are essential.

 

 

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.

 

We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !

Visit https://www.bicheng-enterprise.com to learn more.

 

Contact Vicky at v.xie@bichengpcb.com to unlock your PCB’s full potential.