2. Key Features & Benefits

 

Precise Dielectric Performance: Achieves a stable dielectric constant (Dk) of 2.20 ±0.04 and an ultra-low dissipation factor of 0.001 @ 10GHz, ensuring minimal signal loss in high-frequency applications.

 

Material Flexibility & Optimized Performance: Offers two copper foil options: F4BM220 with ED copper for standard applications, and F4BME220 with RTF copper for superior Passive Intermodulation (PIM) performance, precise line control, and lower conductor loss in critical RF systems.

 

Enhanced Dimensional & Thermal Stability: Features controlled CTE values (X/Y/Z: 25/34/240 ppm/°C) and low moisture absorption (≤0.08%), providing reliable performance under thermal cycling from -55°C to 288°C.

 

Engineered for Reliability: Exhibits a stable thermal coefficient of Dk (-142 ppm/°C), high-temperature tolerance, and complies with UL 94 V-0 flammability rating for safe use in high-power and aerospace environments.

 

Cost-Effective, High-Frequency Solution: Provides a balance of excellent electrical properties, manufacturability, and competitive pricing, positioning it as a viable substitute for premium imported PTFE laminates.

 

 

3. Construction & Technical Specifications

 

Layer Count & Thickness: Double-sided rigid PCB, 0.6mm finished thickness.

 

Base Material: Wangling F4BM220 PTFE/glass laminate.

 

Board Dimensions: 51mm x 67mm per panel, tolerance ±0.15mm.

 

Copper Specifications: 1oz (35μm) finished copper on outer layers; 20μm via plating thickness.

 

Critical Dimensions: Minimum trace/space of 5/8 mils; minimum hole size of 0.3mm; no blind vias.

 

Surface Finish & Appearance: Immersion gold; no solder mask or silkscreen on either side (top & bottom).

 

Quality Assurance: 100% electrical test prior to shipment; IPC-Class-2 quality standard.

 

 

4. PCB Stackup Structure

 

Layer 1: Copper - 35 μm

 

Core: F4BM220 PTFE/Glass Laminate - 0.5 mm

 

Layer 2: Copper - 35 μm

 

 

5. PCB Assembly Statistics

 

Components: 5

 

Total Pads: 19

 

Through-Hole Pads: 11

 

Top SMT Pads: 8

 

Bottom SMT Pads: 0

 

Vias: 17

 

Nets: 2

 

 

6. Technical & Supply Information

 

Artwork Format: Gerber RS-274-X

 

Quality Standard: IPC-Class-2

 

Availability: Worldwide

 

 

7. Typical Applications

 F4BM220 PCB is designed for precision RF and microwave systems, including:

 

Microwave, RF, and Radar Systems

 

Phase Shifters and Power Dividers

 

Couplers, Combiners, and Feed Networks

 

Phase-Sensitive and Phased Array Antennas

 

Satellite Communications Equipment

 

Cellular Base Station Antennas

 

 

8. Conclusion

Wangling F4BM220 PCB offers a robust, high-performance foundation for advanced microwave and RF circuit designs that demand stable electrical properties, low signal loss, and excellent dimensional reliability. By integrating optimized PTFE/glass composite technology with flexible manufacturing options, it enables enhanced design versatility and cost efficiency for telecommunications, aerospace, and defense applications where precision and durability are paramount.

 

 

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.

 

We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !

Visit https://www.bicheng-enterprise.com to learn more.

 

Contact Vicky at v.xie@bichengpcb.com to unlock your PCB’s full potential.