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F4BTM350 Microwave PCB: 3.1mm 2-Layer Rigid Board with Low Loss and High Thermal Stability
F4BTM350 Microwave PCB: 3.1mm 2-Layer Rigid Board with Low Loss and High Thermal Stability
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1.Wangling F4BTM350 PCB Introduction
Wangling F4BTM350 PCB IntroductionWangling F4BTM350 2-layer rigid PCB is engineered with a proprietary formulation that combines fiberglass cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin, followed by precision pressing processes to meet stringent industry standards. Rooted in the proven F4BM dielectric layer platform, this PCB integrates high-dielectric, low-loss nano-ceramic additives to deliver enhanced performance metrics. It achieves a higher dielectric constant, superior heat resistance, a lower coefficient of thermal expansion (CTE), elevated insulation resistance, and improved thermal conductivity—all while retaining its core low-loss characteristics. A key differentiation lies in copper foil compatibility: the F4BTM350 variant is paired with electrolytic (ED) copper foil, making it an ideal choice for applications without passive intermodulation (PIM) requirements. For scenarios demanding strict PIM performance, precise trace control, and reduced conductor loss, the counterpart F4BTME350, equipped with reverse-treated (RTF) copper foil, is recommended.
2.Features (F4BTM350 PCB)
Dielectric constant (Dk) of 3.5±0.07 at 10GHz
Dissipation factor of 0.0025 at 10GHz
CTE x-axis of 10 ppm/°C, CTE y-axis of 12 ppm/°C, CTE z-axis of 51 ppm/°C (-55°C to 288°C)
Low thermal coefficient of Dk at -60 ppm/°C (-55°C to 150°C)
Moisture absorption of ≤0.05%
Flammability rating of UL-94 V0
Comparative Tracking Index (CTI) >600V, Grade 0
2-layer rigid structure with 1oz outer copper weight
Immersion gold surface finish for superior corrosion resistance
100% electrical testing prior to shipment to ensure functionality
3.Benefits (F4BTM350 PCB)
Stable electrical performance at high frequencies, ensuring signal integrity for microwave applications
Low thermal expansion minimizes dimensional changes under extreme temperature fluctuations, enhancing structural reliability
Low moisture absorption prevents performance degradation in humid environments
UL-94 V0 flammability rating improves safety in high-temperature operating conditions
High CTI value enhances insulation performance, reducing the risk of electrical breakdown
Immersion gold surface finish ensures excellent solderability and long-term reliability
ED copper foil configuration offers cost-effectiveness for non-PIM applications
4.PCB Construction Details
Base material: F4BTM350
Layer count: 2-layer
Board dimensions: 328mm x 84.08 mm per unit, tolerance of +/- 0.15mm
Minimum Trace/Space: 5/7 mils
Minimum Hole Size: 0.4mm
No Blind vias
Finished board thickness: 3.1mm
Finished Cu weight: 1oz (1.4 mils) outer layers
Via plating thickness: 20 μm
Surface finish: Immersion Gold
Top Silkscreen: White
Bottom Silkscreen: No
Top Solder Mask: Black
Bottom Solder Mask: No
100% Electrical test used prior to shipment
5.PCB Stackup
2-layer rigid PCB
Copper_layer_1 - 35 μm
F4BTM350 Core - 3.048 mm (120mil)
Copper_layer_2 - 35 μm
PCB Statistics
Components: 58
Total Pads: 139
Thru Hole Pads: 97
Top SMT Pads: 42
Bottom SMT Pads: 0
Vias: 68
Nets: 2
6.Type of Artwork SuppliedGerber RS-274-X
7.Quality StandardIPC-Class-2
8.AvailabilityWorldwide
9.Typical Applications
Microwave, RF, and radar systems
Phase shifters
Power dividers, couplers, combiners
Feed networks
Phase-sensitive antennas, phased array antennas
Satellite communications
Base station antennas
10.Summary
Wangling F4BTM350 PCB is a high-performance 2-layer rigid circuit board with a 3.1mm thickness, designed for demanding microwave and radar applications. Leveraging a PTFE-based formulation with nano-ceramic fillers, it delivers stable dielectric properties, low loss, and excellent thermal stability. Compliant with IPC-Class-2 quality standards and undergoing 100% electrical testing before shipment, this PCB ensures consistent reliability. Its immersion gold surface finish, precise trace/space specifications, and tailored copper foil configuration make it a cost-effective solution for non-PIM high-frequency systems, with global availability to serve diverse industry needs.
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.
We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !
Visit https://www.bicheng-enterprise.com to learn more.
Contact Vicky at v.xie@bichengpcb.com to unlock your PCB’s full potential.