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Rogers RO4350B LoPro PCB: Advanced 60.7mil Double-Sided Board for Next-Generation Wireless Communication Systems
Rogers RO4350B LoPro PCB: Advanced 60.7mil Double-Sided Board for Next-Generation Wireless Communication Systems
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1.Rogers RO4350B LoPro PCB Introduction
Rogers RO4350B LoPro PCB represents a significant advancement in high-frequency circuit technology, featuring proprietary bonding that integrates reverse treated foil with RO4350B dielectric substrate. This innovative 2-layer 1.6mm board delivers exceptional signal integrity through reduced conductor loss while maintaining cost-effective manufacturing compatibility with standard FR-4 processes. The unique hydrocarbon ceramic construction eliminates the need for specialized via preparation, making it an ideal choice for high-volume production of sophisticated wireless communication systems.
2.Material Features
Dielectric Constant: 3.48 ±0.05 at 10 GHz/23°C
Dissipation Factor: 0.0037 at 10 GHz/23°C
Thermal Decomposition Temperature: >390°C
Glass Transition Temperature: >280°C (TMA method)
Thermal Conductivity: 0.69 W/m·K
Coefficient of Thermal Expansion: X axis 10 ppm/°C, Y axis 12 ppm/°C, Z axis 32 ppm/°C (-55 to 288°C)
Flammability Rating: UL 94-V0
Lead Free Process Compatible
3.Material Benefits
Enhanced Signal Integrity Through Lower Insertion Loss
Superior Thermal Management with Reduced Conductor Loss
Optimized for Frequencies Beyond 40 GHz Operation
Minimized Passive Inter-modulation for Critical Base Station Applications
Flexible Multi-layer Design Capabilities
Robust High-Temperature Processing Tolerance
Comprehensive Environmental Regulation Compliance
Exceptional CAF Resistance for Long-Term Reliability
4.PCB Construction Details
Base Material: RO4350B Low Profile
Layer Count: 2-Layer
Board Dimensions: 43mm x 56mm (1 PC)
Minimum Trace/Space: 4/6 mils
Minimum Hole Size: 0.3mm
Blind Vias: None
Finished Board Thickness: 1.6mm
Finished Copper Weight: 1 oz outer layers
Via Plating Thickness: 20 μm
Surface Finish: ENEPIG
Top Silkscreen: White
Bottom Silkscreen: No
Top Solder Mask: Green
Bottom Solder Mask: No
Electrical Test: 100% Tested Prior to Shipment
5.PCB Stackup: 2-Layer Rigid Construction
Copper Layer 1: 35 μm
Rogers RO4350B LoPro Substrate: 60.7mil (1.542mm)
Copper Layer 2: 35 μm
6.PCB Assembly Statistics
Components: 11
Total Pads: 51
Thru Hole Pads: 23
Top SMT Pads: 28
Bottom SMT Pads: 0
Vias: 34
Nets: 2
7.Artwork and Quality Standards
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
8.Typical Applications
5G Network Infrastructure and Base Station Systems
High-Speed Digital Processing Equipment
Satellite Communication Receivers
Advanced RF Identification Systems
Mission-Critical Wireless Communication Networks
9.Conclusion
The Rogers RO4350B LoPro PCB establishes a new benchmark for high-frequency circuit performance, combining cutting-edge material technology with practical manufacturing economics to deliver reliable solutions for today's most demanding wireless applications.