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2-Layer Rogers RO4003C LoPro PCB: 20.7mil Low CTE Circuit Board for High-Frequency Wireless Systems
2-Layer Rogers RO4003C LoPro PCB: 20.7mil Low CTE Circuit Board for High-Frequency Wireless Systems
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1.Rogers RO4003C LoPro PCB Introduction
Rogers RO4003C LoPro PCB utilizes proprietary bonding technology that integrates reverse treated foil with standard RO4003C dielectric material, creating a laminate with reduced conductor loss for enhanced insertion loss performance and superior signal integrity. This 2-layer 0.65mm thick circuit board maintains all the beneficial characteristics of the standard RO4003C laminate system while offering improved high-frequency performance. The hydrocarbon ceramic composition provides cost-effective circuit fabrication compatible with standard FR-4 manufacturing processes, eliminating the need for specialized via preparation and reducing production costs.
2.Material Features
Dielectric Constant: 3.38 ±0.05 at 10 GHz/23°C
Dissipation Factor: 0.0027 at 10 GHz/23°C
Thermal Decomposition Temperature: >425°C
Glass Transition Temperature: >280°C (TMA method)
Thermal Conductivity: 0.64 W/m·K
Z-axis Coefficient of Thermal Expansion: 46 ppm/°C
X-Y Axis CTE: X axis 11 ppm/°C, Y axis 14 ppm/°C (-55 to 288°C)
Lead Free Process Compatible
3.Material Benefits
Lower Insertion Loss for Higher Frequency Designs Exceeding 40 GHz
Reduced Passive Inter-modulation for Base Station Antennas
Improved Thermal Performance Through Lower Conductor Loss
Multilayer PCB Construction Capability
Enhanced Design Flexibility
High Temperature Processing Compatibility
Environmental Compliance
CAF Resistant Properties
4.PCB Construction Details
Base Material: RO4003C Low Profile
Layer Count: 2-Layer
Board Dimensions: 64mm x 68.4mm (1 PC)
Minimum Trace/Space: 5/5 mils
Minimum Hole Size: 0.3mm
Blind Vias: None
Finished Board Thickness: 0.65mm
Finished Copper Weight: 1 oz outer layers
Via Plating Thickness: 20 μm
Surface Finish: Silver Underplating + Gold Plating
Top Silkscreen: White
Bottom Silkscreen: No
Top Solder Mask: Green
Bottom Solder Mask: No
Electrical Test: 100% Tested Prior to Shipment
5.PCB Stackup: 2-Layer Rigid Construction
Copper Layer 1: 35 μm
Rogers RO4003C LoPro Substrate: 20.7mil (0.526mm)
Copper Layer 2: 35 μm
6.PCB Assembly Statistics
Components: 12
Total Pads: 61
Thru Hole Pads: 29
Top SMT Pads: 32
Bottom SMT Pads: 0
Vias: 39
Nets: 2
7.Artwork and Quality Standards
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
8.Typical Applications
Digital Systems: Servers, Routers, and High-Speed Backplanes
Cellular Infrastructure: Base Station Antennas and Power Amplifiers
Satellite Communications: LNB's for Direct Broadcast Satellites
RF Identification Tags
High-Frequency Wireless Systems
9.Conclusion
Rogers RO4003C LoPro PCB delivers excellent high-frequency performance with reduced conductor loss, providing a cost-effective solution for digital, telecommunications, and RF applications that require superior signal integrity and manufacturing efficiency.