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Rogers RO3203 PCB: 2-Layer 10mil High-Frequency Circuit Board for Wireless Applications
Rogers RO3203 PCB: 2-Layer 10mil High-Frequency Circuit Board for Wireless Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1.Rogers RO3203 PCB Introduction
Rogers RO3203 PCB utilizes ceramic-filled PTFE composites reinforced with woven fiberglass to deliver exceptional electrical performance and mechanical stability. This 2-layer 0.35mm thick circuit board extends the RO3000 series with improved mechanical characteristics while maintaining competitive pricing. With a stable dielectric constant of 3.02 and low dissipation factor, Rogers RO3203 material supports high-frequency applications beyond 40 GHz, making it suitable for various wireless communication systems.
2.Material Features
Rogers RO3203 Ceramic-Filled PTFE Composites
Dielectric Constant: 3.02 ±0.04 at 10 GHz/23°C
Dissipation Factor: 0.0016 at 10 GHz/23°C
Thermal Decomposition Temperature: >500°C
Thermal Conductivity: 0.87 W/m·K
Coefficient of Thermal Expansion: X axis 13 ppm/°C, Y axis 13 ppm/°C, Z axis 58 ppm/°C (-55 to 288°C)
Lead Free Process Compatible
Flammability Rating: 94V-0
3.Material Benefits
Woven Glass Reinforcement for Improved Rigidity and Handling
Uniform Electrical and Mechanical Performance for Complex Multi-layer Structures
Low Dielectric Loss for High-Frequency Applications Exceeding 20 GHz
Low In-Plane Expansion Coefficient Matched to Copper
Compatibility with Epoxy Multi-layer Board Hybrid Designs
Excellent Dimensional Stability for High Production Yields
Economic Pricing for Cost-Effective Volume Manufacturing
Surface Smoothness for Finer Line Etching Tolerances
Reliable Surface Mounted Assemblies
4.PCB Construction Details
Base Material: RO3203
Layer Count: 2-Layer
Board Dimensions: 74.57mm x 23.28mm (1 PC)
Minimum Trace/Space: 4/7 mils
Minimum Hole Size: 0.2mm
Blind Vias: None
Finished Board Thickness: 0.35mm
Finished Copper Weight: 1 oz outer layers
Via Plating Thickness: 20 μm
Surface Finish: ENEPIG
Top Silkscreen: White
Bottom Silkscreen: No
Top Solder Mask: Green
Bottom Solder Mask: No
Electrical Test: 100% Tested Prior to Shipment
5.PCB Stackup: 2-Layer Rigid Construction
Copper Layer 1: 35 μm
Rogers RO3203 Substrate: 10mil (0.254mm)
Copper Layer 2: 35 μm
6.PCB Assembly Statistics
Components: 12
Total Pads: 32
Thru Hole Pads: 18
Top SMT Pads: 14
Bottom SMT Pads: 0
Vias: 33
Nets: 2
7.Artwork and Quality Standards
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
8.Typical Applications
Automotive Collision Avoidance Systems
Automotive GPS Antennas
Wireless Telecommunications Systems
Microstrip Patch Antennas for Wireless Communications
Direct Broadcast Satellites
Cable Datalink Systems
Remote Meter Readers
Power Backplanes
LMDS and Wireless Broadband
Base Station Infrastructure
9.Conclusion
Rogers RO3203 PCB provides reliable high-frequency performance with enhanced mechanical stability, offering a cost-effective solution for automotive, telecommunications, and wireless applications requiring consistent electrical characteristics.