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Rogers RO4350B Double-Sided 0.5mm ENEPIG PCB High-Frequency Circuit Board for High-power RF Designs
Rogers RO4350B Double-Sided 0.5mm ENEPIG PCB High-Frequency Circuit Board for High-power RF Designs
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Rogers RO4350B PCB Material Properties
Rogers RO4350B PCB utilizes proprietary woven glass reinforced hydrocarbon/ceramic materials that deliver electrical performance approaching PTFE/woven glass composites while maintaining the excellent manufacturability of standard epoxy/glass substrates. These laminates provide precise control over dielectric constant (Dk) and maintain low signal loss characteristics while employing the same processing methods as conventional epoxy/glass substrates. Available at significantly lower costs than traditional microwave laminates, RO4350B PCBs eliminate the need for specialized through-hole treatments or handling procedures required by PTFE-based materials. These UL 94 V-0 rated laminates are specifically engineered for active devices and high-power RF designs, ensuring both safety and reliability in demanding applications.
RO4350B PCBs demonstrate exceptional thermal performance with a thermal coefficient of expansion (CTE) closely matched to copper, providing outstanding dimensional stability essential for mixed dielectric multi-layer board constructions. RO4350B material's low Z-axis CTE ensures reliable plated through-hole integrity even under severe thermal shock conditions. With a glass transition temperature (Tg) exceeding 280°C (536°F), RO4350B laminate maintains stable expansion characteristics throughout the entire circuit processing temperature range, making it ideal for high-temperature manufacturing processes.
2. PCB Construction & Specifications
Board Type: Double-Sided Rigid PCB
Base Material: Rogers RO4350B High-Frequency Laminate
Quality Standard: IPC-Class-2
Board Dimensions: 42.3mm x 30.8mm (±0.15mm)
Finished Thickness: 0.5mm
Copper Weight: 1oz (35μm) outer layers
Minimum Trace/Space: 4/5 mils
Minimum Hole Size: 0.3mm
Blind Vias: Not Applicable
Via Plating Thickness: 20μm
Surface Finish: Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Solder Mask: Green (Top), None (Bottom)
Silkscreen: None (Top & Bottom)
Electrical Test: 100% tested prior to shipment
3. PCB Stackup Configuration
Layer 1: Copper - 35μm
Core: Rogers RO4350B Laminate - 0.422mm (16.6mil)
Layer 2: Copper - 35μm
4. PCB Statistics
Components: 8
Total Pads: 10
Thru Hole Pads: 6
Top SMT Pads: 4
Bottom SMT Pads: 0
Vias: 5
Nets: 2
5. Artwork & Standards
Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: worldwide
6. Material Features
Dielectric Constant: 3.48 ± 0.05 @ 10GHz/23°C
Dissipation Factor: 0.0037 @ 10GHz/23°C
Thermal Conductivity: 0.69 W/m/°K
CTE Values: X-axis 10 ppm/°C, Y-axis 12 ppm/°C, Z-axis 32 ppm/°C
Glass Transition Temperature: >280°C
Water Absorption: 0.06%
Flammability Rating: UL 94 V-0
7. Performance Benefits
Ideal for multi-layer board (MLB) constructions
FR-4 compatible processing at lower fabrication costs
Excellent dimensional stability for precision circuits
Competitively priced for cost-effective RF solutions
Reliable plated through-hole quality in thermal shock environments
Stable performance across wide temperature ranges
UL 94 V-0 rating for enhanced safety in power applications
8. Target Applications
Cellular Base Station Antennas and Power Amplifiers
RF Identification (RFID) Tags and Systems
Automotive Radar and Sensor Systems
LNB's for Direct Broadcast Satellites
Wireless Communication Infrastructure
High-Power RF Transmitter Systems
Microwave Communication Equipment
9. Global Availability
Double-Sided Rogers RO4350B PCB solution is available for worldwide manufacturing and distribution, supporting both prototype development and volume production requirements across global telecommunications and automotive markets.
10. Quality Assurance
100% electrical testing prior to shipment
IPC-Class-2 quality standards compliance
High-frequency performance validation
Thermal reliability testing
Mechanical stability verification
UL 94 V-0 flammability certification
Consistent dielectric performance assurance