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Rogers RO4003C Double-Sided 16mil ENIG PCB High-Frequency Circuit Board for RF Communications
Rogers RO4003C Double-Sided 16mil ENIG PCB High-Frequency Circuit Board for RF Communications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Rogers RO4003C PCB Material Properties
Rogers RO4003C PCB utilizes proprietary woven glass reinforced hydrocarbon/ceramic materials that deliver the exceptional electrical performance of PTFE/woven glass composites while maintaining the excellent manufacturability of standard epoxy/glass substrates. Available in multiple configurations using both 1080 and 1674 glass fabric styles, all RO4003C laminates consistently meet stringent electrical performance specifications. These materials provide tight control over dielectric constant (Dk) and minimize signal loss while employing the same processing methods as conventional epoxy/glass at significantly lower costs than traditional microwave laminates. Unlike PTFE-based microwave materials, RO4003C requires no special through-hole treatments or specialized handling procedures.
RO4003C PCBs feature non-brominated composition and demonstrate exceptional thermal performance with a thermal coefficient of expansion (CTE) closely matching copper, ensuring outstanding dimensional stability crucial for mixed dielectric multi-layer board constructions. The material's low Z-axis CTE guarantees reliable plated through-hole integrity even under severe thermal shock conditions. With a glass transition temperature (Tg) exceeding 280°C (536°F), RO4003C substrate maintains stable expansion characteristics throughout the entire circuit processing temperature range.
2. PCB Construction & Specifications
Board Type: Double-Sided Rigid PCB
Base Material: Rogers RO4003C High-Frequency Laminate
Quality Standard: IPC-Class-2
Board Dimensions: 38.8mm x 52.4mm (±0.15mm)
Finished Thickness: 0.5mm
Copper Weight: 1oz (35μm) all layers
Minimum Trace/Space: 5/5 mils
Minimum Hole Size: 0.2mm
Blind Vias: Not Applicable
Via Plating Thickness: 20μm
Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Solder Mask: None (Top & Bottom)
Silkscreen: Black (Top), None (Bottom)
Electrical Test: 100% tested prior to shipment
3. PCB Stackup Configuration
Layer 1: Copper - 35μm
Core: Rogers RO4003C Laminate - 0.406mm (16mil)
Layer 2: Copper - 35μm
4. PCB Statistics
Components: 6
Total Pads: 17
Thru Hole Pads: 11
Top SMT Pads: 6
Bottom SMT Pads: 0
Vias: 9
Nets: 2
5. Artwork & Standards
Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: worldwide
6. Material Features
Dielectric Constant: 3.38 ± 0.05 @ 10GHz
Dissipation Factor: 0.0027 @ 10GHz, 0.0021 @ 2.5GHz
Thermal Coefficient of Dielectric Constant: +40 ppm/°C
Thermal Conductivity: 0.71 W/m/°K
CTE Values: X-axis 11 ppm/°C, Y-axis 14 ppm/°C, Z-axis 46 ppm/°C
Moisture Absorption: 0.06%
7. Performance Benefits
Ideal for multi-layer board (MLB) constructions
FR-4 compatible processing at lower fabrication costs
Designed for performance-sensitive, high-volume applications
Competitively priced for cost-effective RF solutions
Excellent dimensional stability for precise circuit alignment
Reliable plated through-hole quality in thermal shock environments
Stable performance across wide temperature ranges
8. Target Applications
Cellular Base Station Antennas and Power Amplifiers
RF Identification (RFID) Tags and Systems
Automotive Radar and Sensor Systems
LNB's for Direct Broadcast Satellites
Wireless Communication Equipment
High-Frequency Test and Measurement Devices
Microwave Radio Systems
9. Global Availability
This Rogers RO4003C based PCB solution is available for worldwide manufacturing and distribution, supporting both prototype development and volume production requirements across global telecommunications markets.
10. Quality Assurance
100% electrical testing prior to shipment
IPC-Class-2 quality standards compliance
High-frequency performance validation
Thermal reliability testing
Mechanical stability verification
Consistent dielectric performance certification

