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Rogers RO4003C Double-Sided 16mil ENIG PCB High-Frequency Circuit Board for RF Communications

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

1. Rogers RO4003C PCB Material Properties

Rogers RO4003C PCB utilizes proprietary woven glass reinforced hydrocarbon/ceramic materials that deliver the exceptional electrical performance of PTFE/woven glass composites while maintaining the excellent manufacturability of standard epoxy/glass substrates. Available in multiple configurations using both 1080 and 1674 glass fabric styles, all RO4003C laminates consistently meet stringent electrical performance specifications. These materials provide tight control over dielectric constant (Dk) and minimize signal loss while employing the same processing methods as conventional epoxy/glass at significantly lower costs than traditional microwave laminates. Unlike PTFE-based microwave materials, RO4003C requires no special through-hole treatments or specialized handling procedures.

 

RO4003C PCBs feature non-brominated composition and demonstrate exceptional thermal performance with a thermal coefficient of expansion (CTE) closely matching copper, ensuring outstanding dimensional stability crucial for mixed dielectric multi-layer board constructions. The material's low Z-axis CTE guarantees reliable plated through-hole integrity even under severe thermal shock conditions. With a glass transition temperature (Tg) exceeding 280°C (536°F), RO4003C substrate maintains stable expansion characteristics throughout the entire circuit processing temperature range.

 

 

2. PCB Construction & Specifications

Board Type: Double-Sided Rigid PCB

Base Material: Rogers RO4003C High-Frequency Laminate

Quality Standard: IPC-Class-2

Board Dimensions: 38.8mm x 52.4mm (±0.15mm)

Finished Thickness: 0.5mm

Copper Weight: 1oz (35μm) all layers

Minimum Trace/Space: 5/5 mils

Minimum Hole Size: 0.2mm

Blind Vias: Not Applicable

Via Plating Thickness: 20μm

Surface Finish: Electroless Nickel Immersion Gold (ENIG)

Solder Mask: None (Top & Bottom)

Silkscreen: Black (Top), None (Bottom)

Electrical Test: 100% tested prior to shipment

 

3. PCB Stackup Configuration

Layer 1: Copper - 35μm

Core: Rogers RO4003C Laminate - 0.406mm (16mil)

Layer 2: Copper - 35μm

 

4. PCB Statistics

Components: 6

Total Pads: 17

Thru Hole Pads: 11

Top SMT Pads: 6

Bottom SMT Pads: 0

Vias: 9

Nets: 2

 

5. Artwork & Standards

Type of artwork supplied: Gerber RS-274-X

Quality standard: IPC-Class-2

Availability: worldwide

 

6. Material Features

Dielectric Constant: 3.38 ± 0.05 @ 10GHz

Dissipation Factor: 0.0027 @ 10GHz, 0.0021 @ 2.5GHz

Thermal Coefficient of Dielectric Constant: +40 ppm/°C

Thermal Conductivity: 0.71 W/m/°K

CTE Values: X-axis 11 ppm/°C, Y-axis 14 ppm/°C, Z-axis 46 ppm/°C

Moisture Absorption: 0.06%

 

7. Performance Benefits

Ideal for multi-layer board (MLB) constructions

FR-4 compatible processing at lower fabrication costs

Designed for performance-sensitive, high-volume applications

Competitively priced for cost-effective RF solutions

Excellent dimensional stability for precise circuit alignment

Reliable plated through-hole quality in thermal shock environments

Stable performance across wide temperature ranges

 

8. Target Applications

Cellular Base Station Antennas and Power Amplifiers

RF Identification (RFID) Tags and Systems

Automotive Radar and Sensor Systems

LNB's for Direct Broadcast Satellites

Wireless Communication Equipment

High-Frequency Test and Measurement Devices

Microwave Radio Systems

 

9. Global Availability

This Rogers RO4003C based PCB solution is available for worldwide manufacturing and distribution, supporting both prototype development and volume production requirements across global telecommunications markets.

 

10. Quality Assurance

100% electrical testing prior to shipment

IPC-Class-2 quality standards compliance

High-frequency performance validation

Thermal reliability testing

Mechanical stability verification

Consistent dielectric performance certification

 

 

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