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Rogers RO3210 2-Layer 30mil PCB High-Frequency Ceramic Board for Automotive Radar and Wireless Systems

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

1. Rogers RO3210 PCB Material Properties

Rogers RO3210 PCB utilizes advanced ceramic-filled laminates reinforced with woven fiberglass, delivering exceptional electrical performance and mechanical stability. These high-frequency circuit materials combine the surface smoothness of non-woven PTFE laminates for precise line etching with the structural rigidity of woven-glass reinforcements. RO3210 laminates maintain excellent dimensional stability while supporting standard PTFE circuit board processing techniques, making them ideal for high-frequency applications requiring both electrical precision and mechanical reliability.

 

 

2. PCB Construction & Specifications

Board Type: 2-Layer Rigid PCB

Base Material: Rogers RO3210 High-Frequency Laminate

Quality Standard: IPC-Class-2

Board Dimensions: 16mm x 8mm (±0.15mm)

Finished Thickness: 0.8mm

Copper Weight: 1oz (35μm) outer layers

Minimum Trace/Space: 4/7 mils

Minimum Hole Size: 0.3mm

Blind Vias: Not Applicable

Via Plating Thickness: 20μm

Surface Finish: Immersion Gold

Solder Mask: Green (Top), None (Bottom)

Silkscreen: White (Top), None (Bottom)

Electrical Test: 100% tested prior to shipment

 

3. PCB Stackup Configuration

Layer 1: Copper - 35μm

Core: Rogers RO3210 Laminate - 0.762mm (30mil)

Layer 2: Copper - 35μm

 

4. PCB Statistics

Components: 3

Total Pads: 10

Thru Hole Pads: 6

Top SMT Pads: 4

Bottom SMT Pads: 0

Vias: 5

Nets: 2

 

5. Artwork & Standards

Type of artwork supplied: Gerber RS-274-X

Quality standard: IPC-Class-2

Availability: worldwide

 

6. Material Features

Dielectric Constant: 10.2 ± 0.5

Dissipation Factor: 0.0027 @ 10GHz

CTE Values: X-axis 13 ppm/°C, Y-axis 13 ppm/°C, Z-axis 34 ppm/°C

Decomposition Temperature: 500°C (TGA)

Thermal Conductivity: 0.81 W/mk

Flammability Rating: V0 UL 94

 

7. Performance Benefits

Woven glass reinforcement for improved rigidity and handling

Uniform electrical and mechanical performance for complex multi-layer structures

Low in-plane expansion coefficient matched to copper

Compatibility with epoxy multi-layer board hybrid designs

Reliable surface mounted assemblies

Excellent dimensional stability for high production yields

Superior surface smoothness for finer line etching tolerances

 

8. Target Applications

Automotive collision avoidance systems

Automotive GPS satellite antennas

Wireless telecommunications systems

Microstrip patch antennas for wireless communications

Direct broadcast satellites

Datalink on cable systems

Remote meter readers

Power backplanes

LMDS and wireless broadband

Base station infrastructure

 

9. Global Availability

This Rogers RO3210 based PCB solution is available for worldwide manufacturing and distribution, supporting both prototype development and volume production requirements across global markets.

 

10. Quality Assurance

100% electrical testing prior to shipment

IPC-Class-2 quality standards compliance

High-frequency performance validation

Mechanical stability testing

Thermal reliability verification

 

 

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