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Rogers RO4003C PCB 4-Layer Multilayer PCB with Countersunk Holes for Base Station Antennas and RF Applications
Rogers RO4003C PCB 4-Layer Multilayer PCB with Countersunk Holes for Base Station Antennas and RF Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
Rogers RO4003C PCB utilizes proprietary woven glass reinforced hydrocarbon/ceramic technology that delivers the electrical performance of PTFE/woven glass materials while maintaining the manufacturability of standard epoxy/glass. RO4003C laminates employ both 1080 and 1674 glass fabric styles while ensuring consistent electrical performance across all configurations.
Rogers RO4003C PCB provides tight dielectric constant control and low loss characteristics using standard FR-4 processing methods, offering significant cost advantages over conventional microwave laminates without requiring special through-hole treatments. With a thermal expansion coefficient closely matched to copper and high Tg exceeding 280°C, RO4003C PCB material ensures excellent dimensional stability for complex multilayer constructions.
2. PCB Construction Details
Specification Category |
Details |
Base Material |
Rogers RO4003C |
Layer Count |
5 Layers |
Board Dimensions |
60mm x 60mm (±0.15mm) |
Finished Thickness |
4.8mm |
Copper Weight |
1 oz Inner/Outer Layers |
Min. Trace/Space |
4/5 mils |
Min. Hole Size |
0.4mm |
Blind Vias |
None |
Surface Finish |
ENIG |
Via Treatment |
Resin Filled and Capped |
Special Features |
Countersunk Holes (90° Conical) |
Solder Mask |
None |
Silkscreen |
Black (Top), None (Bottom) |
Electrical Test |
100% |
3. Stackup Structure
This 5-layer multilayer construction utilizes multiple Rogers RO4003C cores (0.508mm and 1.524mm thicknesses) with RO4450F prepreg layers, creating a robust 4.8mm thick board with resin-filled vias and 35μm copper layers throughout the stackup.
4. Board Statistics
Components: 2
Total Pads: 7 (3 Thru-Hole, 4 Top SMT)
Vias: 5
Nets: 7
Files: Gerber RS-274-X
Standard: IPC-Class-2
Availability: Worldwide
5. RO4003C Material Features
Dielectric Constant: 3.38±0.05 @ 10GHz
Dissipation Factor: 0.0027 @ 10GHz, 0.0021 @ 2.5GHz
Thermal Coefficient of Dk: +40 ppm/°C
Thermal Conductivity: 0.71 W/m/K
CTE: X 11/Y 14/Z 46 ppm/°C
Moisture Absorption: 0.06%
Glass Transition Temperature: >280°C
6. RO4003C Key Benefits
Ideal for complex multilayer board constructions
FR-4 compatible processing at reduced fabrication costs
Optimized for performance-sensitive, high-volume applications
Cost-competitive microwave circuit solution
Excellent dimensional stability with copper-matched CTE
Reliable plated through-hole quality in thermal shock conditions
No special through-hole treatments required
7. Typical Applications
Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags and Systems
Automotive Radar and Sensor Systems
LNB for Direct Broadcast Satellites
High-Frequency Communication Equipment
Microwave and RF Circuit Designs