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Rogers RO4350B 6-Layer 1.6mm HDI PCB with ENIG Surface Finish for Cellular Base Station and RF Applications
Rogers RO4350B 6-Layer 1.6mm HDI PCB with ENIG Surface Finish for Cellular Base Station and RF Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Rogers RO4350B PCB Introduction
Rogers RO4350B PCB leverages a unique formulation of woven glass-reinforced hydrocarbon/ceramic composite, achieving electrical characteristics comparable to PTFE/woven glass materials while retaining the straightforward processing advantages of conventional epoxy/glass systems.RO4350B laminates provide precise dielectric constant control and low loss characteristics using conventional FR-4 processing methods, available at a fraction of the cost of traditional microwave laminates. With UL 94 V-0 rating for active devices and high-power RF designs, RO4350B PCB features a thermal expansion coefficient matched to copper for excellent dimensional stability in multilayer constructions and reliable plated through-hole performance in thermal shock conditions, supported by a high Tg exceeding 280°C for stable expansion characteristics throughout circuit processing.
2. PCB Construction Details
Specification Category |
Details |
Base Material |
Rogers RO4350B |
Layer Count |
6 Layers |
Board Dimensions |
110mm x 80mm (±0.15mm) |
Finished Thickness |
1.6mm |
Copper Weight |
1 oz Inner/Outer Layers |
Min. Trace/Space |
4/4 mils |
Min. Hole Size |
0.3mm |
Blind Vias |
L1-L4, L5-L6 |
Surface Finish |
ENIG |
Solder Mask |
Green (Top/Bottom) |
Silkscreen |
White (Top/Bottom) |
Electrical Test |
100% |
3. Stackup Structure
6-layer Rogers RO4350B PCB employs multiple RO4350B cores (0.254mm and 0.508mm thicknesses) with RO4450F prepreg layers, creating an optimized 1.6mm thick board with advanced blind via technology and 35μm copper layers throughout the structure.
4. Board Statistics
Components: 28
Total Pads: 120 (96 Thru-Hole, 24 Top SMT)
Vias: 455
Nets: 12
Files: Gerber RS-274-X
Standard: IPC-Class-2
Availability: Worldwide
5. RO4350B Material Features
Dielectric Constant: 3.48±0.05 @ 10GHz
Dissipation Factor: 0.0037 @ 10GHz
Thermal Conductivity: 0.69 W/m/K
CTE: X 10/Y 12/Z 32 ppm/°C
Glass Transition Temperature: >280°C
Moisture Absorption: 0.06%
Flammability Rating: UL 94 V-0
6. RO4350B Key Benefits
Ideal for complex multilayer board constructions
FR-4 compatible processing at reduced fabrication costs
Excellent dimensional stability for precision circuits
Cost-competitive high-frequency solution
No special through-hole treatments required
Reliable performance in thermal shock environments
Suitable for high-power RF applications
7. Typical Applications
Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags and Systems
Automotive Radar and Sensor Systems
LNB for Direct Broadcast Satellites
Wireless Communication Infrastructure
High-Frequency Electronic Systems