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Rogers RO3210 High-frequency PCB 2-Layer 20mil Immersion Silver PCB for Automotive and Wireless Applications
Rogers RO3210 High-frequency PCB 2-Layer 20mil Immersion Silver PCB for Automotive and Wireless Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Rogers RO3210 PCB Introduction
Rogers RO3210 PCB utilizes ceramic-filled laminates with woven fiberglass reinforcement in a 2-layer configuration with 0.6mm thickness. Rogers RO3210 high-frequency circuit material offers exceptional electrical performance and mechanical stability, featuring Immersion Silver surface finish and blue solder mask. Rogers RO3210 laminate combines the surface smoothness of non-woven PTFE for finer line etching with the rigidity of woven-glass reinforcement, making it ideal for automotive and wireless communication applications.
2. PCB Construction Details:
Base Material: Rogers RO3210
Layer Count: 2 Layer
Board Dimensions: 54.5mm × 50mm = 1PCS, ±0.15mm
Minimum Trace/Space: 5/8 mils
Minimum Hole Size: 0.3mm
No Blind Vias
Finished Board Thickness: 0.6mm
Finished Cu Weight: 1oz (1.4 mils)
Via Plating Thickness: 20 μm
Surface Finish: Immersion Silver
Top Silkscreen: White
Bottom Silkscreen: No
Top Solder Mask: Blue
Bottom Solder Mask: No
100% Electrical Test Before Shipment
3. PCB Stackup: 2 Layer Rigid PCB
Copper Layer 1 - 35 μm
Rogers RO3210 Core - 0.508 mm (20mil)
Copper Layer 2 - 35 μm
4. PCB Statistics:
Components: 9
Total Pads: 23
Thru Hole Pads: 15
Top SMT Pads: 8
Bottom SMT Pads: 0
Vias: 14
Nets: 2
5. Artwork Format: Gerber RS-274-X
6. Quality Standard: IPC-Class-2
7. Availability: Worldwide
8. RO3210 Material Features:
Dielectric Constant: 10.2 ± 0.5
Dissipation Factor: 0.0027 @10GHz
CTE: X-axis 13 ppm/°C, Y-axis 13 ppm/°C, Z-axis 34 ppm/°C
Thermal Decomposition Temperature: 500°C
Thermal Conductivity: 0.81 W/mK
Flammability Rating: UL 94 V-0
Ceramic Filled Woven Glass Laminate
Excellent Surface Smoothness
9. Material Benefits:
Woven Glass Reinforcement
Improved Mechanical Rigidity
Uniform Electrical Performance
CTE Matched to Copper
Reliable Surface Mount Assembly
Excellent Dimensional Stability
Fine Line Etching Capability
High Production Yield
10. Typical Applications:
Automotive Collision Avoidance Systems
GPS Antennas
Wireless Communication Systems
Microstrip Patch Antennas
Satellite Communication Systems
RF Power Amplifiers
Microwave Circuits
Telecommunication Infrastructure