2. PCB Construction Details:

 

Base Material: Rogers RO3035

 

Layer Count: 2 Layers

 

Board Dimensions: 60mm × 30mm = 1PCS

 

Minimum Trace/Space: 5/7 mils

 

Minimum Hole Size: 0.3mm

 

No Blind Vias

 

Finished Board Thickness: 0.37mm

 

Finished Cu Weight: 1oz (1.4 mils)

 

Via Plating Thickness: 20 μm

 

Surface Finish: Immersion Gold

 

Top Silkscreen: No

 

Bottom Silkscreen: No

 

Top Solder Mask: No

 

Bottom Solder Mask: No

 

100% Electrical Test Before Shipment

 

 

3. PCB Stackup: 2 Layer Rigid PCB

 

Copper Layer 1 - 35 μm

 

Rogers RO3035 Substrate - 10mil (0.254mm)

 

Copper Layer 2 - 35 μm

 

 

4. PCB Statistics:

 

Components: 10

 

Total Pads: 63

 

Thru Hole Pads: 41

 

Top SMT Pads: 22

 

Bottom SMT Pads: 0

 

Vias: 21

 

Nets: 2

 

 

5. Artwork Format: Gerber RS-274-X

 

 

6. Quality Standard: IPC-Class-2

 

 

7. Availability: Worldwide

 

 

8. RO3035 Material Features:

 

Dielectric Constant: 3.5 ± 0.05 @10GHz/23°C

 

Dissipation Factor: 0.0015 @10GHz/23°C

 

Thermal Decomposition Temperature: >500°C

 

Thermal Conductivity: 0.5 W/mK

 

Moisture Absorption: 0.04%

 

CTE: X-axis 17 ppm/°C, Y-axis 17 ppm/°C, Z-axis 24 ppm/°C

 

Ceramic Filled PTFE Composite

 

Stable Dielectric Constant Over Temperature

 

 

9. Material Benefits:

 

Suitable for 30-40GHz Applications

 

Lower Operating Temperature

 

Increased Power Amplifier Reliability

 

Uniform Mechanical Properties

 

Low In-plane CTE Matching Copper

 

Excellent Dimensional Stability

 

Cost Effective Manufacturing

 

 

10. Typical Applications:

 

5G Communication Systems

 

Millimeter Wave Applications

 

Automotive Radar

 

GPS Antennas

 

Cellular Base Stations

 

Massive MIMO Systems

 

Microwave Circuits

 

Satellite Communications