2. PCB Construction Details:

 

Base Material: Rogers RO3006

 

Layer Count: 2 Layers

 

Board Dimensions: 20mm × 25mm = 1PCS

 

Minimum Trace/Space: 5/9 mils

 

Minimum Hole Size: 0.2mm

 

No Blind Vias

 

Finished Board Thickness: 0.2mm

 

Finished Cu Weight: 1oz (1.4 mils)

 

Via Plating Thickness: 20 μm

 

Surface Finish: Pure Gold 30μ" for Wire Bonding

 

Top Silkscreen: No

 

Bottom Silkscreen: No

 

Top Solder Mask: No

 

Bottom Solder Mask: No

 

100% Electrical Test Before Shipment

3. PCB Stackup: 2 Layer Rigid PCB

 

Copper Layer 1 - 35 μm

 

Rogers RO3006 - 5mil (0.127mm)

 

Copper Layer 2 - 35 μm

 

 

4. PCB Statistics:

 

Components: 3

 

Total Pads: 14

 

Thru Hole Pads: 10

 

Top SMT Pads: 4

 

Bottom SMT Pads: 0

 

Vias: 16

 

Nets: 2

 

5. Artwork Format: Gerber RS-274-X

 

6. Quality Standard: IPC-Class-2

 

7. Availability: Worldwide

 

8. RO3006 Material Features:

 

Dielectric Constant: 6.15 ± 0.15 @10GHz/23°C

 

Dissipation Factor: 0.002 @10GHz/23°C

 

Thermal Decomposition Temperature: >500°C

 

Thermal Conductivity: 0.79 W/mK

 

Moisture Absorption: 0.02%

 

CTE: X-axis 17 ppm/°C, Y-axis 17 ppm/°C, Z-axis 24 ppm/°C

 

Ceramic Filled PTFE Composite

 

Stable Dielectric Constant Over Temperature

 

 

9. Material Benefits:

 

Uniform Mechanical Properties

 

Suitable for Multi-layer Board Designs

 

Low In-plane CTE Matching Copper

 

Reliable Surface Mount Assemblies

 

Excellent Dimensional Stability

 

Cost Effective Manufacturing

 

Stable Electrical Performance

 

 

10. Typical Applications:

 

Automotive Radar Systems

 

GPS Antennas

 

Cellular Communication Systems

 

Patch Antennas

 

Satellite Communications

 

Microwave Circuits

 

Power Amplifiers

 

RF Components