2. PCB Construction Details:

 

Base Material: Rogers RO3003

 

Layer Count: 2 Layers

 

Board Dimensions: 33mm × 63mm = 1PCS

 

Minimum Trace/Space: 5/7 mils

 

Minimum Hole Size: 0.3mm

 

No Blind Vias

 

Finished Board Thickness: 1.4mm

 

Finished Cu Weight: 1oz (1.4 mils) Outer Layers

 

Via Plating Thickness: 20 μm

 

Surface Finish: Immersion Gold

 

Top Silkscreen: Black

 

Bottom Silkscreen: No

 

Top Solder Mask: No

 

Bottom Solder Mask: No

 

100% Electrical Test Before Shipment

 

 

3. PCB Stackup: 2-Layer

 

Copper Layer 1 - 35 μm

 

Rogers RO3003 Substrate - 50mil (1.27mm)

 

Copper Layer 2 - 35 μm

 

 

4. PCB Statistics:

 

Components: 11

 

Total Pads: 32

 

Thru-Hole Pads: 20

 

Top SMT Pads: 12

 

Bottom SMT Pads: 0

 

Vias: 10

 

Nets: 2

 

 

5. Artwork Format: Gerber RS-274-X

 

6. Quality Standard: IPC-Class-2

 

7. Availability: Worldwide

 

 

8. RO3003 Material Properties:

 

Dielectric Constant: 3.0 ± 0.04 @10GHz/23°C

 

Dissipation Factor: 0.001 @10GHz/23°C

 

Thermal Decomposition: >500°C

 

Thermal Conductivity: 0.5 W/mK

 

Moisture Absorption: 0.04%

 

CTE: X-17 ppm/°C, Y-16 ppm/°C, Z-25 ppm/°C

 

Ceramic-Filled PTFE Composite

 

Stable Dk vs Temperature and Frequency

 

 

9. Material Benefits:

 

Low Loss up to 77GHz

 

Excellent Mechanical Stability

 

Reliable Multi-layer Construction

 

Stable Dielectric Constant

 

Low In-plane CTE (Matches Copper)

 

Cost-Effective Manufacturing

 

Superior Dimensional Stability

 

 

10. Typical Applications:

 

Automotive Radar Systems (77GHz)

 

5G Wireless Infrastructure

 

GPS Antennas

 

Cellular Power Amplifiers

 

Patch Antennas

 

Satellite Communications

 

Microwave Filters

 

Voltage Controlled Oscillators