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Megtron6 M6 PCB: 12-Layer 2.0mm High-Speed Low Loss Circuit Board for 5G and High-Frequency Applications
Megtron6 M6 PCB: 12-Layer 2.0mm High-Speed Low Loss Circuit Board for 5G and High-Frequency Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1.Megtron6 M6 PCB Introduction
Panasonic Megtron6 M6 PCB represents advanced high-frequency circuit technology with its 12-layer construction and 2.0 mm thickness. This multilayer copper-clad laminate is engineered for high-frequency, high-speed, and high-reliability electronic applications. The M6 material delivers consistent performance in demanding environments with its stable dielectric properties and excellent thermal reliability. Designed to meet the rigorous requirements of modern high-speed signal transmission, Megtron6 M6 PCB solution supports complex circuit designs while maintaining manufacturing efficiency.
2.PCB Construction Details
Layer Count: 12 layers
Base Material: Megtron6
Board Dimensions: 220 mm x 60 mm (1 PC), Tolerance: ±0.15mm
Minimum Trace/Space: 3/3 mils
Minimum Hole Size: 0.2mm
Blind Vias: None
Finished Board Thickness: 2.12mm
Finished Copper Weight: 1oz outer layers, 0.5oz/1oz inner layers
Via Plating Thickness: 25 μm
Surface Finish: Electroless Nickle Immersion Gold (ENIG)
Silkscreen: White (Top/Bottom)
Solder Mask: Blue (Top/Bottom)
Via Treatment: 0.2mm, 0.4mm vias filled by resin and capped plating
Electrical Test: 100% Tested Prior to Shipment
3.PCB Stackup: 12-Layer Rigid Construction
Copper Layer 1: 35 μm
Prepreg R-5670(G) 1080 (68%) X 1: 81.4μm
Copper Layer 2: 35 μm
M6 Core R5775G(HVLP): 75 μm
Copper Layer 3: 17 μm
Prepreg R-5670(G) 3313 (59%) X 2: 219.9μm
Copper Layer 4: 17 μm
M6 Core R5775G(HVLP): 75 μm
Copper Layer 5: 17 μm
Prepreg R-5670(G) 3313 (59%) X 2: 216.5μm
Copper Layer 6: 35 μm
M6 Core R5775G(HVLP): 400 μm
Copper Layer 7: 35 μm
Prepreg R-5670(G) 3313 (59%) X 2: 215.6μm
Copper Layer 8: 17 μm
M6 Core R5775G(HVLP): 75 μm
Copper Layer 9: 17 μm
Prepreg R-5670(G) 3313 (59%) X 2: 219.8μm
Copper Layer 10: 17 μm
M6 Core R5775G(HVLP): 75 μm
Copper Layer 11: 35 μm
Prepreg R-5670(G) 1080 (68%) X 1: 81.4μm
Copper Layer 12: 35 μm
4.Impedance Control
Impedance 1: Single end, L1, 5.71mil trace, 50 ohm, down reference L2
Impedance 2: Single end, L3, 4.31mil trace, 50 ohm, upper reference L2, down reference L4
Impedance 3: Single end, L5, 4.71mil trace, 50 ohm, upper reference L4, down reference L7
Impedance 4: Single end, L8, 4.51mil trace, 50 ohm, upper reference L7, down reference L9
Impedance 5: Single end, L10, 4.31mil trace, 50 ohm, upper reference L9, down reference L11
5.PCB Assembly Statistics
Components: 159
Total Pads: 433
Thru Hole Pads: 145
Top SMT Pads: 137
Bottom SMT Pads: 151
Vias: 459
Nets: 12
6.Artwork and Quality Standards
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-3
Availability: Worldwide
7.Megtron6 M6 Material Features
Dielectric Constant: 3.4 at 1GHz/23°C, 3.34 at 13GHz
Dissipation Factor: 0.002 at 1GHz/23°C, 0.0037 at 13GHz
Coefficient of Thermal Expansion: X axis 16 ppm/°C, Y axis 16 ppm/°C, Z axis 45 ppm/°C
Glass Transition Temperature: >185°C (DSC method), 210°C (DMA method)
Thermal Decomposition Temperature: 410°C (TGA method)
Layer Support: 4-30 layer multilayer PCB design
Environmental Compliance: RoHS and halogen-free
Flammability Rating: UL 94V-0
8.Typical Applications
5G Communication Base Stations
Automotive Millimeter-wave Radar Systems
High-Speed Data Center Equipment
Aerospace Communication Systems
High-Frequency Consumer Electronics
9.Conclusion
Megtron6 M6 PCB provides a reliable high-frequency solution for demanding applications, combining advanced material properties with robust construction. Its compatibility with standard manufacturing processes and consistent electrical performance makes it suitable for various high-speed and high-frequency applications across multiple industries.