1.Introduction to M6 and IS370HR Hybrid PCB

This Copper Coin Embedded PCB solution combines high-performance materials to meet the demanding requirements of modern electronic systems. Utilizing Megtron M6 and IS370HR substrates, the board delivers exceptional high-frequency characteristics, thermal resilience, and reliability for industrial and automotive applications. With a dielectric constant (Dk) as low as 3.34 and a dissipation factor (Df) of 0.002 at 1GHz, it ensures minimal signal loss in high-speed designs. The materials support multilayer constructions of 4 to 30 layers and offer high thermal decomposition temperatures (Td up to 410°C for M6, 340°C for IS370HR), ensuring stability in harsh operating environments. Compliant with RoHS and halogen-free standards, these PCBs are compatible with conventional FR-4 manufacturing processes, enabling cost-effective production without specialized equipment. Typical applications include 5G communication base stations, automotive radar systems, ADAS, and aerospace/defense electronics, where signal integrity, thermal management, and long-term reliability are critical.

 

 

 2.Features of M6

- Dielectric Constant of DK 3.4 at 1GHz/23°C, 3.34 at 13GHz

- Dissipation Factor of 0.002 at 1GHz/23°C, 0.0037 at 13GHz

- X axis CTE of 16 ppm/°C, Y CTE of 16 ppm/°C, Z CTE of 45 ppm/°C

- High Tg value of >185 °C, DSC method, 210°C DMA method.

- Thermal Decomposition Temp ( Td ), 410°C, TGA method.

- Supports 4 - 30 layer multilayer PCB design, adapting to complex circuit requirements

- Complies with RoHS and halogen - free requirements, meeting the standards of green manufacturing.

- Compatible with traditional FR-4 processing technology, no special equipment is required, reducing production costs.

- Flammability of UL 94V-0

 

3. Features of IS370HR

- High Thermal Performance

- Tg: 180°C (DSC)

- Td: 340°C (TGA @ 5% wt loss)

- Low X/Y-Axis CTE of 13/14ppm/°C for reliability

- T260: 60 minutes

- T288: 30 minutes

- RoHS Compliant

- UV Blocking and AOI Fluorescence

- High throughput and accuracy during PCB fabrication and assembly

- CAF Resistant

- Superior Processing: Closest to conventional FR-4 processing

 

1. PCB Construction details:

    -Base material: M6 High Speed material + High Tg FR-4

    - Layer count: 6 Layers

    - Board dimensions:  120mm x 60 mm=1PCS, +/- 0.15mm

    - Minimum Trace/Space:  4/4 mils

    - Minimum Hole Size:  0.2mm

    - No Blind vias.

    - Finished board thickness:  1.0mm

    - Finished Cu weight:  1oz (1.4 mils) outer layers

    - Via plating thickness: 20 μm

    - Surface finish:  Electroless Nickel Immersion Gold (ENIG)

    - Top Silkscreen:          White

    - Bottom Silkscreen:      White

    - Top Solder Mask:  Green

    - Bottom Solder Mask: Green

    - Copper coin embedded in the center of PCB

    - All vias are resin filled and capped

    - 100% Electrical test used prior to shipment

 

5. PCB Stackup:  6-layer rigid PCB

Copper_layer_1 - 35 μm

R5775G  (M6) Core - 0.25 mm, DK 3.61

Copper_layer_2 - 18 μm

            IS370HR - 1080(64%) X 2 - 0.14mm, DK 3.72

Copper_layer_3 - 35 μm

IS370HR Core - 0.1 mm DK 4.17

Copper_layer_4 - 35 μm

             IS370HR - 1080(64%) X 2 - 0.14mm, DK 3.72

Copper_layer_5 - 18 μm

IS370HR Core - 0.1 mm DK 4.17

Copper_layer_6 - 35 μm

 

6. PCB Statistics:

    Components:        67

    Total Pads:         250

    Thru Hole Pads:    198

    Top SMT Pads:     36

    Bottom SMT Pads:    16

    Vias:              91

    Nets:              23

 

1. 7.Type of artwork supplied: Gerber RS-274-X

8.Quality standard: IPC-Class-2

9. Availability: worldwide

 

 

10.Some Typical Applications:

- 5G Communication Base Stations: Millimeter-wave antennas, radio - frequency front - ends of AAU (Active Antenna Unit).

 

- Automotive Electronics: 77GHz millimeter-wave radar, ADAS (Advanced Driver - Assistance Systems).

 

- Networking & Communications

- Aerospace & Defense