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12-Layer 1.6mm Isola 370HR PCB with ENIG Surface Finish High-Thermal-Reliability FR-4 Board for Industrial and Automotive Electronics
12-Layer 1.6mm Isola 370HR PCB with ENIG Surface Finish High-Thermal-Reliability FR-4 Board for Industrial and Automotive Electronics
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
- Introduction to Isola 370HR Material
Isola 370HR PCB is a high-performance FR-4 system with a 180°C glass transition temperature (Tg), specially designed for multilayer printed circuit boards (PCBs) that demand maximum thermal performance and reliability. Manufactured using a unique high-performance multifunctional epoxy resin and reinforced with electrical-grade (E-glass) glass fabric, this material outperforms traditional FR-4 in thermal performance and offers lower expansion rates while maintaining excellent processability similar to conventional FR-4.
In addition to its superior thermal properties, Isola 370HR excels in mechanical strength, chemical resistance, and moisture resistance, meeting or exceeding the performance of traditional FR-4 materials. It also features laser fluorescing and UV blocking capabilities, ensuring maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems, and photoimagable solder mask imaging. Renowned as a top choice for sequential lamination designs, Isola 370HR is a versatile solution for high-reliability PCB applications.
2.PCB Construction Details:
Base material: 370HR
Layer count: 12-layer
Board dimensions: 120mm x 88 mm/1up, +/- 0.15mm
Minimum Trace/Space: 4/6 mils
Minimum Hole Size: 8 mils
Blind via L1-L4, L1-L10
Finished Cu weight: 1 oz signal and plane layers
Top/Bottom Silkscreen: White
Top/Bottom Solder Mask: Green
Board thickness: 1.58mm +/- 10%
UL mark on PCB required
Electrical test required
Ensure no silkscreen on solder pads
Surface Finish: ENIG, with 0.1um (0.004 mils) gold, for -40°C to +85°C
3.Impedance Matching, +/- 10%:
Layer 1, 7mil single end, 100 ohm, reference layer 2
Layer 3, 9mil single end, 100 ohm, reference layer 2
Layer 4, 10mil single end, 100 ohm, reference layer 5
Layer 6, 7mil single end, 100 ohm, reference layer 5
- PCB Stackup - 12-layer Rigid PCB
TOP LAYER (PCB Layer 1) - 1.4mil (1oz)
IS370 HR - Prepreg 1080 (65%) x 1 - 0.0727mm
GROUND PLANE (PCB Layer 2) -0.7mil (0.5oz)
IS370 HR - Prepreg 1080 (65%) x 1 - 0.0727mm
MID LAYER 1 (PCB Layer 3) - 0.7mil (0.5oz)
IS370 HR - Prepreg 1080 (65%) x 1 - 0.0727mm
MID LAYER 2 (PCB Layer 4) -0.7mil (0.5oz)
IS370 HR - Prepreg 1080 (65%) x 2 - 0.1479mm
POWER PLANE (PCB Layer 5) -0.7mil (0.5oz)
IS370HR - Core - 0.2mm
COPPER LAYER (PCB Layer 6) -0.7mil (0.5oz)
IS370 HR - Prepreg 1080 (65%) x 2 - 0.1479mm
POWER PLANE (PCB Layer 7) -0.7mil (0.5oz)
IS370HR - Core - 0.2mm
COPPER LAYER (PCB Layer 8) -0.7mil (0.5oz)
IS370 HR - Prepreg 1080 (65%) x 2 - 0.1479mm
COPPER LAYER (PCB Layer 9) - 1.4mil (1oz)
IS370 HR - Prepreg 1080 (65%) x 1 - 0.0727mm
GROUND PLANE (PCB Layer 10) -0.7mil (0.5oz)
IS370 HR - Prepreg 1080 (65%) x 1 - 0.0727mm
COPPER LAYER 11 (PCB Layer 11) - 0.7mil (0.5oz)
IS370 HR - Prepreg 1080 (65%) x 1 - 0.0727mm
BOTTOM LAYER (PCB Layer 12) -1.4mil (1oz)
5.Features
High Thermal Performance
Tg: 180°C (DSC)
Td: 340°C (TGA @ 5% wt loss)
Low X/Y-Axis CTE of 13/14ppm/°C for reliability
T260: 60 minutes
T288: 30 minutes
RoHS Compliant
UV Blocking and AOI Fluorescence
High throughput and accuracy during PCB fabrication and assembly
CAF Resistant
Superior Processing: Closest to conventional FR-4 processing
6.PCB Statistics:
Components: 59
Total Pads: 355
Thru Hole Pads: 129
Top SMT Pads: 178
Bottom SMT Pads: 48
Vias: 211
Nets: 61
7.Type of Artwork Supplied: Gerber RS-274-X
8.Quality Standard: IPC-Class-2
9.Availability: Worldwide
- 10.Typical Applications
Computing, Storage & Peripherals
Networking & Communications
Automotive & Transportation
Consumer Electronics
Aerospace & Defense
Medical, Industrial & Instrumentation

