1. Introduction of FPC-220 Flexible PCB

This double-sided flexible printed circuit board utilizes high-performance adhesive polyimide as the base material, delivering exceptional flexibility and thermal stability. Designed with a ultra-slim 0.22mm core thickness and reinforced with precision 1.0mm FR-4 stiffeners, this FPC maintains structural integrity while supporting dynamic bending applications. The board features 2oz thick copper layers and reliable ENIG surface finish, ensuring excellent conductivity and corrosion resistance. Manufactured in compliance with IPC-Class-2 quality standards and halogen-free requirements, this flexible circuit solution is particularly suitable for space-constrained applications in consumer electronics, automotive systems, and portable devices where reliability and compact design are paramount.

2.PCB Construction Details

    -Base material: Flexible polyimide

    - Layer count: Double sided

    - Board dimensions:  51mm x 35 mm=1PCS, +/- 0.15mm

    - Minimum Trace/Space:  5/5 mils

    - Minimum Hole Size:  0.4mm

    - No Blind vias.

    - Flex thickness:  0.22mm

    - Thickness of Flex +PI stiffener: 0.3mm

    -  Thickness of Flex+FR4 stiffener: 1.34mm

    - Finished Cu weight:  2oz (2.8 mils) outer layers

    - Via plating thickness: 20 μm

    - Surface finish:  Electroless Nickel Immersion Gold (ENIG)

    - Top Silkscreen:          White

    - Bottom Silkscreen:      No

    - Top Solder Mask:  Yellow coverlay

    - Bottom Solder Mask: No

- 100% Electrical test used prior to shipment

 

3. PCB Stackup

2-layer flexible PCB structure

FR4 Stiffener + PI Stiffener

Copper Layer 1: 70 μm

Adhesive Polyimide Core: 25μm (1mil)

Copper Layer 2: 70 μm

 

 

4. PCB Statistics

Parameter Quantity

Components 12

Total Pads 39

Thru Hole Pads 19

Top SMT Pads 20

Bottom SMT Pads 0

Vias 11

Nets 2

 

5. Artwork & Quality Standards

Artwork Format: Gerber RS-274-X

Quality Standard: IPC-Class-2

Availability: Worldwide

 

6. Material Features - Adhesive Polyimide

Halogen free, Flammability UL94 V-0 rated

Excellent flexibility and thermal resistance

Superior dimensional and electrical properties

RoHS compliant, free of restricted substances

Peel strength 90°: 1.0-1.5N/mm

Dimensional stability: MD -0.06% to 0.015%; TD 0.05% to 0.06%

Chemical resistance: 85%

Moisture absorption: 1.37-1.46%

Dielectric constant @10 GHz: 3.31-3.34

Dissipation factor @10 GHz: 0.0188-0.0191

 

7. Key Specifications

Operating Temperature: -40°C to +125°C

Bend Radius: Dynamic 10x thickness, Static 5x thickness

Flame Rating: UL94 V-0

RoHS Compliance: Yes

 

8. Manufacturing Capabilities

Minimum Trace Width: 5 mil

Minimum Space: 5 mil

Minimum Hole Size: 0.4mm

Surface Finish: ENIG

Stiffener Options: PI or FR-4

Testing: 100% Electrical Test

 

9. Typical Applications

Computer Systems

Mobile Phones

Digital Cameras

VCR Systems

Automotive Electronics

Office Automation Equipment

Medical Devices

Aerospace Systems

Industrial Controls

Consumer Electronics