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F4BTMS450 4-Layer 1.4mm High-Frequency PCB Circuit Board with Enhanced Thermal and Electrical Performance
F4BTMS450 4-Layer 1.4mm High-Frequency PCB Circuit Board with Enhanced Thermal and Electrical Performance
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. F4BTMS450 PCB Introduction
F4BTMS450 PCB represents a significant technological advancement in high-frequency circuit materials, developed as an upgraded iteration of the F4BTM series. Through breakthroughs in material formulation and manufacturing techniques, F4BTMS450 laminate integrates a high concentration of specialized nano-ceramics within a polytetrafluoroethylene (PTFE) resin matrix, reinforced with ultra-fine glass fiber cloth. This composition minimizes the adverse effects of traditional glass reinforcement on electromagnetic wave propagation, resulting in reduced dielectric loss, improved dimensional stability, and lower X/Y/Z CTE anisotropy. Designed for high-reliability aerospace and RF applications, F4BTMS450 PCB provides a high-performance domestic alternative to comparable international materials.
2. PCB Construction Details
Base Material: F4BTMS450
Layer Count: 4-Layer
Board Dimensions: 20mm × 20mm (1 PC), Tolerance: ±0.15mm
Minimum Trace/Space: 4/5 mils
Minimum Hole Size: 0.3mm
Blind Vias: None
Finished Board Thickness: 1.4mm
Finished Copper Weight: 1 oz (1.4 mils)
Via Plating Thickness: 20 μm
Surface Finish: Immersion Gold
Silkscreen: None (Top/Bottom)
Solder Mask: None (Top/Bottom)
Electrical Test: 100% Tested Prior to Shipment
3. PCB Stackup: 4-Layer Rigid Construction
Copper Layer 1: 35 μm
F4BTMS450 Core: 0.127 mm (5 mil)
Copper Layer 2: 35 μm
Prepreg RO4450F: 0.102 mm (4 mil)
F4BTMS450 Core: 0.127 mm (5 mil)
Copper Layer 3: 35 μm
Prepreg RO4450F: 0.102 mm (4 mil)
F4BTMS450 Core: 0.762 mm (30 mil)
Copper Layer 4: 35 μm
4. PCB Assembly Statistics
Components: 3
Total Pads: 14
Thru-Hole Pads: 6
Top SMT Pads: 8
Bottom SMT Pads: 0
Vias: 4
Nets: 10
5. Artwork and Quality Standards
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
6. F4BTMS450 Material Features
Dielectric Constant (Dk): 4.5 ±0.09 at 10GHz
Dissipation Factor: 0.0015 at 10GHz, 0.0019 at 20GHz
Coefficient of Thermal Expansion (CTE): X-Axis 12 ppm/°C, Y-Axis 12 ppm/°C, Z-Axis 45 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk: -58 ppm/°C (-55°C to 150°C)
Flammability Rating: UL-94 V0
Thermal Conductivity: 0.64 W/m·K
Moisture Absorption: 0.08%
7. Typical Applications
Aerospace and Avionics Systems
Satellite Communication Equipment
Radar and Military Radar Systems
RF and Microwave Circuits
Phased Array and Phase-Sensitive Antennas
Feed Networks and High-Frequency Signal Transmission