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F4BTMS220 Double-Sided PCB 0.2mm Ultra-Thin Ceramic PCB for Aerospace and Radar Applications
F4BTMS220 Double-Sided PCB 0.2mm Ultra-Thin Ceramic PCB for Aerospace and Radar Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. F4BTMS220 PCB Introduction
F4BTMS220 PCB represents an advanced upgrade from the F4BTM series, achieving significant breakthroughs in material formulation and manufacturing technology. This high-reliability material incorporates substantial ceramic content reinforced with ultra-thin glass fiber cloth, delivering enhanced performance characteristics and a broader range of dielectric constants. The optimized composition minimizes negative effects on electromagnetic wave propagation while reducing dielectric loss, improving dimensional stability, and decreasing material anisotropy. With standard RTF low-roughness copper foil for reduced conductor loss and excellent peel strength, this aerospace-grade material serves as a reliable domestic alternative to international equivalents.
2. PCB Construction Details
Specification Category |
Details |
Base Material |
F4BTMS220 |
Layer Count |
Double-Sided |
Board Dimensions |
114mm x 20mm (±0.15mm) |
Finished Thickness |
0.2mm |
Copper Weight |
1 oz |
Min. Trace/Space |
5/5 mils |
Min. Hole Size |
0.2mm |
Blind Vias |
None |
Surface Finish |
Immersion Gold |
Solder Mask |
Black (Top), None (Bottom) |
Silkscreen |
White (Top), None (Bottom) |
Electrical Test |
100% |
3. Stackup Structure
This ultra-thin double-sided PCB utilizes an F4BTMS220 core measuring 0.127mm (5mil) thickness, sandwiched between two 35μm copper layers to create a compact 0.2mm overall profile ideal for space-constrained aerospace applications.
4. Board Statistics
Components: 34
Total Pads: 65 (47 Thru-Hole, 18 Top SMT)
Vias: 35
Nets: 2
Files: Gerber RS-274-X
Standard: IPC-Class-2
Availability: Worldwide
5. F4BTMS220 Material Features
Dielectric Constant: 2.2±0.02 @ 10GHz
Dissipation Factor: 0.0009 @ 10GHz, 0.001 @ 20GHz
Thermal Coefficient of Dk: -130 ppm/°C
CTE: X 40/Y 50/Z 290 ppm/°C
Moisture Absorption: 0.02%
Flammability: UL-94 V0
Standard RTF Copper Foil
6. F4BTMS220 Key Benefits
Enhanced dimensional stability with reduced anisotropy
Extended usable frequency range with improved thermal conductivity
Excellent low thermal expansion coefficient
Stable dielectric temperature characteristics
Reduced conductor loss with maintained peel strength
Compatibility with copper or aluminum bases
7. Typical Applications
Aerospace Equipment and Space Cabin Systems
Microwave and RF Circuits
Radar and Military Radar Systems
Feed Networks
Phase-Sensitive Antennas and Phased Array Antennas
Satellite Communication Systems