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2-Layer Taconic RF PCB: 30mil Taconic TLX-8 Laminate-Based Solution for Telecommunications and Industrial Sectors
2-Layer Taconic RF PCB: 30mil Taconic TLX-8 Laminate-Based Solution for Telecommunications and Industrial Sectors
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Introduction
This Taconic specialized 2-layer high-frequency Printed Circuit Board (PCB) is engineered to deliver reliable performance in demanding RF and microwave applications. Constructed with TLX-8 laminate—a high-performance fiberglass-reinforced PTFE composite—TLX-8 high-frequency PCB meets precise specifications including 30mil thickness, 1oz copper weight, and immersion gold surface finish. Designed with no silkscreen or solder mask ("no silk, no ink"), Taconic TLX-8 circuit board provides optimal signal integrity for compact RF components measuring 40.5 x 70.6 mm per unit. The board’s controlled dielectric properties and robust mechanical structure make it ideal for aerospace, telecommunications, defense, and industrial applications where environmental durability and electrical stability are critical.

2. Product Specifications Overview
Taconic TLX-8 high-frequency circuit material is manufactured to precise standards, ensuring consistency and performance for critical microwave designs.
Feature |
Specification |
Note |
Layer Count |
2 Layers (Double-Sided) |
Low layer count microwave design. |
Core Material |
TLX-8 Laminate |
Fiberglass-reinforced PTFE composite. |
Dielectric Constant (Dk) |
2.45 - 2.65 (Tightly Controlled) |
Low and stable for predictable performance. |
Thickness |
30 mil (0.762 mm) |
Standard thickness for robust mechanical structure. |
Copper Weight |
1 oz (35 µm) |
Standard weight for conductive traces and planes. |
Surface Finish |
Immersion Gold (ENIG) |
Excellent solderability, wire-bondability, and oxidation resistance. |
Legend & Solder Mask |
No Silkscreen, No Solder Mask Ink ("No Silk, No Ink") |
Clean surface for optimal high-frequency performance. |
Board Dimensions |
40.5 x 70.6 mm (per single piece) |
Compact size suitable for various RF components. |
3. In-Depth: TLX-8 Laminate Material Benefits
Taconic TLX-8 is a premier microwave substrate chosen for its balanced electrical, mechanical, and thermal properties, making it a "workhorse" material for RF applications.
3.1. Key Electrical & Reliability Benefits
Excellent PIM Performance: Delivers Passive Intermodulation (PIM) values typically measured lower than -160 dBc, crucial for multi-carrier systems like base station antennas.
Stable Electrical Properties: Features a low, stable Dielectric Constant (Dk) and low Dissipation Factor (Df), ensuring minimal signal loss and phase stability over frequency and temperature.
Dimensional Stability & Low Moisture Absorption: Maintains physical and electrical integrity under varying environmental conditions, critical for precision circuits.
3.2. Robust Mechanical & Safety Properties
Excellent Mechanical & Thermal Properties: Fiberglass reinforcement provides superior strength and resistance to creep, thermal expansion, and vibration.
UL 94 V-0 Rating: Certifies the material's flame retardancy, enhancing safety in end-use applications.
Environmental Durability: Offers proven resistance to high temperatures, radiation (low outgassing), and wide temperature swings, qualifying it for severe operational environments.
4. Target Applications
The combination of this PCB's specifications and Taconic TLX-8 material's versatility enables its use in a broad spectrum of high-frequency applications:
Telecommunications: Base station antennas, filters, combiners, splitters, and power amplifiers.
Aerospace & Defense: Radar systems, altimeter substrates, communication payloads, and avionics requiring radiation resistance and vibration survival.
Test & Measurement: Probes, fixtures, and components for microwave test equipment.
Industrial RF: Microwave transmission devices, mixers, and passive components.
Specifically, Taconic TLX-8 laminate PCB's mechanical robustness is essential for applications such as PCBs bolted in high-vibration launch vehicles, engine module electronics, warship antenna systems, and airborne equipment experiencing rapid pressure and temperature changes.
5.Typical Values Table
Properties |
Conditions |
Typical Value |
Unit |
Test Method |
Dielectric Constant |
@ 10 GHz |
2.55 ± 0.04 |
|
IPC-650 2.5.5.3 |
Dissipation Factor |
@ 10 GHz |
0.0018 |
|
IPC-650 2.5.5.5.1 |
Outgassing |
% TML |
0.03 |
4 H 257 °F @ ≤ 5 x 10-5 Torr |
ASTM E 595 |
% CVCM |
0.00 |
|||
% WVR |
0.01 |
|||
Surface Resistivity |
|
6.605 x 108 |
Mohm |
IPC-650 2.5.17.1 Sec. 5.2.1 (Elevated Temp.) |
|
3.550 x 106 |
Mohm |
IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) |
|
Volume Resistivity |
|
1.110 x 1010 |
Mohm/cm |
IPC-650 2.5.17.1 Sec. 5.2.1 (Elevated Temp.) |
|
1.046 x 1010 |
Mohm/cm |
IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) |
|
Dimensional Stability |
MD |
0.06 |
mm/M (mils/in) |
IPC-650 2.4.39 Sec. 5.4 (After Bake) |
CD |
0.08 |
mm/M (mils/in) |
||
MD |
0.09 |
mm/M (mils/in) |
IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) |
|
CD |
0.10 |
mm/M (mils/in) |
Thermal Conductivity |
|
0.19 |
W/M*K |
ASTM F433/ASTM 1530-06 |
CTE (25-260 °C) |
X |
21 |
ppm/°C |
IPC-650 2.4 .41/ASTM D 3386 |
Y |
23 |
|||
Z |
215 |
|||
Td |
2% Weight Loss |
535 |
°C |
IPC-650 2.4.24.6 (TGA) |
5% Weight Loss |
553 |
°C |
Peel Strength |
1 oz. ED |
2.63 (15) |
N/mm (Ibs/in) |
IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress) |
1 oz. RTF |
2.98 (17) |
N/mm2 (kpsi) |
||
½ oz. ED |
2.45 (14) |
N/mm2 (kpsi) |
IPC-650 2.4.8.3 (Elevated Temp.) |
|
½ oz. ED |
1.93 (11) |
N/mm2 (kpsi) |
IPC-650 2.4.8 Sec. 5.2.2 (Thermal Stress) |
|
1 oz. rolled |
2.28 (13) |
N/mm2 (kpsi) |
||
Young’s Modulus |
MD |
6,757 (980) |
N/mm2 (psi) |
ASTM D 902 |
CD |
8,274 (1,200) |
N/mm2 (psi) |
||
MD |
11,238 (1,630) |
N/mm2 (psi) |
ASTM D 3039 |
Chemical / Physical Properties |
||||
Moisture Absorption |
|
0.02 |
% |
IPC-650 2.6.2.1 |
Dielectric Breakdown |
|
> 45 |
Kv |
IPC-650 2.5.6 |
Flammability Rating |
|
V-0 |
|
UL-94 |
6. Conclusion
This Taconic 2-layer PCB built on 30mil TLX-8 laminate represents a reliable, high-performance solution for engineers designing next-generation RF and microwave systems. Its controlled electrical characteristics, coupled with exceptional mechanical durability, make it an ideal choice for applications where performance cannot be compromised by environmental stress. From space-qualified hardware to terrestrial communication infrastructure, TLX-8 PCB provides a foundation for innovative and reliable circuit design.
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.
We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !
Visit https://www.bicheng-enterprise.com to learn more.

