2. Rogers TMM13i PCB Key Features

1. Core Base Material: Rogers TMM13i isotropic thermoset microwave laminate (ceramic thermoset polymer composite)
2. Layer Configuration: 2-layer rigid PCB, optimized for plated thru-hole strip-line and micro-strip applications
3. Finished Board Thickness: 0.5mm, ideal for compact, precision-focused high-frequency designs
4. Dielectric Constant (Dk): 12.85 +/- 0.35, featuring isotropic properties for consistent electrical performance
5. Dissipation Factor: 0.0019 at 10GHz, minimizing signal loss for high-reliability applications
6. Thermal Coefficient of Dk: -70 ppm/°K, ensuring stable dielectric performance across temperature variations
7. Coefficient of Thermal Expansion (CTE) Matched to Copper (-55 to 288 °C): X-axis 19 ppm/°C, Y-axis 19 ppm/°C, Z-axis 20 ppm/°C
8. Lead-Free Process Compatible, meeting 94V-0 flammability standards for safety and environmental compliance
9. Board Dimensions: 63.58mm x 89.2mm = 1PCS, designed for precise fit in target applications
10. Minimum Trace/Space: 6/7 mils, supporting detailed circuit layouts for high-frequency functionality
11. Minimum Hole Size: 0.3mm, compatible with miniaturized component mounting requirements
12. Blind Vias: Not incorporated, simplifying manufacturing while maintaining performance integrity
13. Outer Layer Finished Copper Weight: 1oz (equivalent to 1.4 mils), ensuring reliable conductivity and signal transmission
14. Via Plating Thickness: 20 μm, enhancing interlayer connection reliability and long-term durability
15. Surface Treatment: Immersion Gold, delivering superior solderability, corrosion resistance, and signal integrity
16. Top Silkscreen: Black, enabling clear component identification without compromising high-frequency performance
17. Bottom Silkscreen: Not applied, optimizing the board for minimal signal interference
18. Top Solder Mask: Not applied, supporting precise component placement and signal clarity
19. Bottom Solder Mask: Not applied, reducing signal distortion in critical RF and microwave applications

3. Rogers TMM13i PCB Advantages

1. Superior mechanical properties resist creep and cold flow, ensuring dimensional stability during manufacturing and long-term operation.
2. Exceptional resistance to process chemicals minimizes damage during fabrication, improving production yield rates and reducing defects.
3. Eliminates the need for sodium napthanate treatment prior to electroless plating, streamlining manufacturing workflows and cutting production time.
4. Built around a thermoset resin base, enabling reliable wire-bonding for secure component connections in high-frequency systems.
5. Isotropic dielectric constant (Dk) ensures consistent electrical performance across all axes, critical for precision strip-line and micro-strip applications.
6. Low dissipation factor reduces signal attenuation at 10GHz, preserving signal integrity for high-reliability RF and microwave circuitry.
7. CTE matched to copper prevents warping and delamination during thermal cycling, extending the PCB’s service life and reducing failure risks.
8. Lead-free process compatibility and 94V-0 flammability rating meet global safety and environmental standards, expanding application versatility.
9. Immersion Gold surface finish ensures strong, durable solder joints and corrosion resistance, enhancing long-term reliability in harsh environments.
10. Complies with IPC-Class-2 quality standards, achieving an optimal balance between cost-effectiveness and performance with minor cosmetic blemishes that do not impact functionality.
11. 100% electrical testing prior to shipment guarantees each PCB meets performance specifications, reducing post-delivery failures and ensuring consistent quality.
12. 2-layer rigid construction offers simplicity in design and manufacturing, while still supporting the demands of plated thru-hole strip-line and micro-strip applications.

4. PCB Construction Specifications

Construction Category	Specific Details
Base Material	Rogers TMM13i
Layer Count	2-Layer Rigid PCB
Board Dimensions (Single Unit)	63.58mm x 89.2mm = 1PCS
Minimum Trace/Space	6/7 mils
Minimum Hole Size	0.3mm
Blind Vias	No
Finished Board Thickness	0.5mm
Outer Layer Copper Weight	1oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	Black
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Pre-Shipment Electrical Test	100% Electrical Test Conducted

5. PCB Layer Stackup

Rogers TMM13i 2-layer rigid PCB features the following layered structure, ordered from the top copper layer to the bottom copper layer:

1. Copper_layer_1 – 35 μm Thickness
2. Rogers TMM13i Substrate – 15mil (0.381mm) Thickness
3. Copper_layer_2 – 35 μm Thickness

6. PCB Performance Statistics

1. Total Components: 25
2. Total Pad Count: 63
3. Through-Hole Pads: 28
4. Top-Side SMT Pads: 35
5. Bottom-Side SMT Pads: 0
6. Total Vias: 43
7. Circuit Nets: 2

7. Artwork Format Provided

Gerber RS-274-X, the industry-standard format for seamless PCB manufacturing integration.

8. Accepted Quality Standard

IPC-Class-2 – Aligns with industry-defined quality criteria for high-frequency, RF, and microwave PCBs. This standard balances cost efficiency and performance, permitting minor cosmetic imperfections that do not affect the board’s functional reliability.

9. Global Availability

Rogers TMM13i 2-layer high-frequency PCB is available for shipment to locations worldwide, ensuring global accessibility for diverse industry requirements.

10. Common Application Fields

1. Chip Testers
2. Dielectric Polarizers and Lenses
3. Filters and Couplers
4. RF and Microwave Circuitry
5. Satellite Communication Systems

Product Summary

Rogers TMM13i 2-Layer 0.5mm High-Frequency PCB is a high-reliability circuit board engineered specifically for plated thru-hole strip-line and micro-strip applications, leveraging Rogers TMM13i isotropic thermoset microwave laminate for exceptional performance. This unique laminate blends ceramic and PTFE advantages, enabling soft substrate processing while delivering consistent electrical properties—including a high isotropic Dk of 12.85 +/- 0.35 and low dissipation factor of 0.0019 at 10GHz. With a 0.5mm thickness, 2-layer rigid construction, and compliance with IPC-Class-2 standards, it offers CTE matched to copper, lead-free compatibility, and 94V-0 flammability rating. Equipped with Immersion Gold surface finish, 100% pre-shipment electrical testing, and resistance to process chemicals, Rogers TMM13i RF PCB merges durability, safety, and precision. Optimized for chip testers, filters, RF circuitry, and satellite communication systems, and supported by global availability, it serves as a cost-effective, dependable solution for high-reliability high-frequency applications across telecommunications, aerospace, and test equipment industries.

 

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.

 

We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !

Visit https://www.bicheng-enterprise.com to learn more.