1.Introduction of TRF-45 PCB

Taconic TRF-45 PCB materials, developed by Taconic’s Advanced Dielectric Division, stand as a new generation of laminated solutions engineered for superior performance—boasting low loss and exceptional thermal stability as core attributes. A key structural advantage of TRF-45 laminates lies in their woven-glass reinforcement: this design enhances dimensional stability, while integration with Taconic’s proprietary ceramic technology further elevates overall reliability. TRF-45 laminate maintains low and consistent Z-axis expansion even across a broad temperature range, including conditions up to high-temperature soldering—addressing a common pain point in high-heat electronic assembly processes.

 

In terms of manufacturability, TRF-45 PCBs offer significant convenience for production teams: they can be sheared, drilled, and plated using the same standard processing methods applied to PTFE woven fiberglass materials. This compatibility with existing workflows eliminates the need for specialized equipment or process adjustments, streamlining manufacturing and reducing operational costs for high-volume or precision PCB production.

 

 

2. Features

- Low-loss ceramic-filled PTFE

- Stable Dielectric constant (Dk) of 4.5±0.15 at 10GHz over temperature and frequency

- Dissipation factor of .0035 at 10GHz

- Moisture absorption of 0.06%

- X-axis CTE of 9  ppm/°C, Y-axis CTEof 9  ppm/°C, Z-axis CTE of 40  ppm/°C, 50°C to 150°C

- Thermal conductivity of 0.43 W/mk

- Flammability  of UL 94-V0

 

3.PCB Construction details:

    -Base material: TRF-45

    - Layer count: Double sided

    - Board dimensions:  50mm x 50 mm=1PCS, +/- 0.15mm

    - Minimum Trace/Space:  4/5 mils

    - Minimum Hole Size:  0.3mm

    - No Blind vias.

    - Finished board thickness:  0.9mm

    - Finished Cu weight:  1oz (1.4 mils) outer layers

    - Via plating thickness: 20 μm

    - Surface finish:  Electroless Nickel Immersion Gold (ENIG)

    - Top Silkscreen:          No

    - Bottom Silkscreen:      No

    - Top Solder Mask:  No

    - Bottom Solder Mask: No

    - 100% Electrical test used prior to shipment

 

4.PCB Stackup:  2-layer rigid PCB

Copper_layer_1 - 35 μm

TRF-45 Core - 0.813 mm (32mil)

Copper_layer_2 - 35 μm

 

5.PCB Statistics:

    Components:        12

    Total Pads:         27

    Thru Hole Pads:    19

    Top SMT Pads:     8

    Bottom SMT Pads:    0

    Vias:              11

    Nets:              2

 

6. Type of artwork supplied: Gerber RS-274-X

7. Quality standard: IPC-Class-2

8. Availability: worldwide

 

9. Some Typical Applications:

- Satellite radio antennas

- RFID antennas

- GPS antennas