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0.305mm Rogers RO4003C Laminate and 3.0mm FR-4 6-Layer Hybrid PCB For Antennas and Automotive Radar
0.305mm Rogers RO4003C Laminate and 3.0mm FR-4 6-Layer Hybrid PCB For Antennas and Automotive Radar
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Rogers RO4003C High-Frequency Laminate
Rogers RO4003C PCBs are proprietary, ceramic-reinforced hydrocarbon materials that deliver the superior electrical performance of PTFE with the familiar, cost-effective manufacturability of standard FR-4. Unlike PTFE-based materials, RO4003C laminate requires no special through-hole treatments, streamlining production and reducing cost.
Engineered for performance and reliability, RO4003C laminate offers a stable Dielectric Constant (Dk) of 3.38±0.05 @ 10 GHz and an ultra-low Dissipation Factor (0.0027 @ 10 GHz), making it ideal for high-frequency applications. Its thermal expansion characteristics (CTE) are closely matched to copper, ensuring excellent dimensional stability for multi-layer boards and reliable plated through-holes (PTH) even under severe thermal cycling. With a high Tg >280°C, low moisture absorption (0.06%), and a Z-axis CTE of 46 ppm/°C, RO4003C PCB is the optimal choice for demanding RF and microwave circuits.
2. PCB Construction & Key Specifications
Board Type: 6-Layer Rigid PCB, Mixed Dielectric (RO4003C & Tg170 FR-4)
Quality Standard: IPC-6012 Class 2
Board Dimensions: 495mm x 345mm (±0.15mm)
Finished Thickness: 6.8mm
Copper Weight: 1oz (35μm) on all inner and outer layers
Minimum Trace/Space: 5/6 mils
Minimum Hole Size: 0.8mm
Blind Vias: No
Via Plating Thickness: 20 μm
Surface Finish: Immersion Gold (ENIG)
Solder Mask & Silkscreen: None on both sides
Special Feature: Depth-controlled routing (slots) on top and bottom layers
Electrical Test: 100% tested prior to shipment
3. Detailed 6-Layer PCB Stackup
L1: Copper - 35 μm
Core: Tg170 FR-4 - 3.0mm
L2: Copper - 35 μm
Prepreg: Bonding Ply - 0.102mm (4mil)
L3: Copper - 35 μm
Core: Rogers RO4003C - 0.305mm (12mil)
L4: Copper - 35 μm
Prepreg: Bonding Ply - 0.102mm (4mil)
L5: Copper - 35 μm
Core: Tg170 FR-4 - 3.0mm
L6: Copper - 35 μm
4. PCB Design Statistics
Component Count: 132
Total Pads: 456
Thru-Hole Pads: 271
SMT Pads (Top): 166
SMT Pads (Bottom): 19
Vias: 131
Nets: 17
Artwork Format: Gerber RS-274-X
5. Material Features & Benefits
Key Features:
Stable Dielectric Constant (Dk) and low loss tangent
High Thermal Conductivity: 0.71 W/m/°K
Matched CTE to copper for superior dimensional stability
Low Moisture Absorption: 0.06%
Key Benefits:
Ideal for Mixed-Dielectric Multi-Layer Boards (MLB)
Reduces fabrication costs with FR-4-like processing
Designed for performance-sensitive, high-volume commercial applications
Provides reliable PTH integrity in thermally demanding environments
6. Target Applications
Cellular Base Station Antennas and Power Amplifiers
Automotive Radar and Sensor Systems
RF Identification (RFID) Tags
LNBs for Direct Broadcast Satellites
Other High-Frequency RF & Microwave Circuits
7. Global Availability
This PCB solution is available for manufacturing and shipment worldwide.