Rogers TMM6 2-Layer HASL PCB 75mil High Thermal Conductivity and Temperature Stable Laminate for High-Power RF Microwave Applications

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

1.General Description

This TMM6 PCB is a 2-layer rigid printed circuit board built on 75mil Rogers TMM6 high-frequency circuit laminates. TMM6 PCB substrate is a ceramic thermoset polymer composite material engineered for stripline and microstrip circuit designs. Rogers TMM6 PCB material combines the advantages of ceramic and traditional PTFE microwave material, delivering stable electrical performance without complicated manufacturing procedures, well suited for RF and microwave circuit development.

2. Features

1. Built with Rogers TMM6 ceramic thermoset composite PCB laminate
2. Finished board thickness of 2 mm, minimum trace/space at 5/8 mils and minimum hole size of 0.35mm
3. HASL surface finish, no silkscreen and no solder mask on both top and bottom sides
4. 1 oz outer copper weight with 20 μm via plating thickness, fully compliant with IPC-Class-2 quality standard
5. Dk of 6.0 +/-0.08 at 10GHz and dissipation factor of 0.0023 at 10GHz for low-loss signal transmission
6. 100% electrical test performed before shipment, available for global delivery

3. Benefits

1. The Rogers TMM6 high-frequency laminate has excellent creep and cold flow resistance to maintain stable mechanical performance
2. Strong resistance to PCB processing chemicals reduces substrate damage during fabrication
3. Thermoset resin construction enables reliable wire bonding operations without substrate softening
4. Fully compatible with standard PCB fabrication workflows, no special treatment required for manufacturing

Worldwide availability supports small batch and mass production for RF, microwave and antenna projects

4. PCB Construction Details

5. PCB Stackup

1. Copper_layer_1 - 35 μm
2. Rogers TMM6 Core - 1.905 mm (75mil)
3. Copper_layer_2 - 35 μm

6. PCB Statistics

1. Components: 53
2. Total Pads: 36
3. Thru Hole Pads: 21
4. Top SMT Pads: 15
5. Bottom SMT Pads: 0
6. Vias: 38
7. Nets: 2

7. Type of artwork supplied

Gerber RS-274-X

8. Quality standard

IPC-Class-2

9. Availability

worldwide

10. Rogers TMM6 Copper Clad Laminate (CCL) Introduction

10.1 Core Features of TMM6 CCL

1. Unique ceramic hydrocarbon thermoset composite structure combining ceramic stability and PTFE processability
2. Precise Dk 6.0 ±0.08 and ultra-low DF 0.0023 at 10GHz for low-loss high-frequency transmission
3. Ultra-low TCDK of -11 ppm/°K delivers excellent temperature-frequency stability
4. Copper-matched CTE realizes high-reliability plated through-hole structure
5. High 425°C decomposition temperature enhances high-temperature working durability
6. Superior thermal conductivity accelerates heat dissipation for high-power RF circuits
7. Excellent creep resistance and cold flow resistance for long-term mechanical stability
8. Strong chemical resistance against PCB processing solvents and etchants
9. Support reliable wire bonding without substrate softening or pad lifting
10. No special processing required, fully compatible with standard PCB manufacturing workflow

10.2 Processing & Structural Advantages of TMM6 Laminate

1. Eliminates sodium napthanate pretreatment, simplifying electroless plating procedures
2. Wide customizable thickness range from 0.0015” to 0.500” with ultra-tight tolerance
3. Multiple copper cladding options: 1/2oz, 1oz, 2oz electrodeposited copper foil
4. Supports direct bonding with aluminum and brass substrates for metal-backed circuit designs
5. Low etching shrinkage ensures high dimensional accuracy for fine-line circuits
6. Isotropic material performance guarantees uniform signal transmission in all directions

10.3 Main Application Scenarios

1. Industrial RF and Microwave Circuit Systems
2. High-Power Amplifiers, Combiners, Filters and Couplers
3. Satellite Communication and GPS Navigation Antenna Systems
4. Precision Patch Antennas, Dielectric Polarizers and Microwave Lenses
5. Semiconductor Chip Testing and Precision Measurement Equipment

11. Some Typical Applications

1. RF and microwave circuitry
2. Power amplifiers and combiners
3. Filters and couplers
4. Satellite communication systems
5. Global Positioning Systems Antennas
6. Patch Antennas
7. Dielectric polarizers and lenses
8. Chip testers

12. Rogers TMM6 DataSheet

13. Product Summary

Rogers TMM6 2-Layer high-frequency rigid PCB delivers reliable RF performance for microwave and communication applications. This printed circuit board uses Rogers TMM6 ceramic hydrocarbon copper clad laminate with HASL surface finish and 2mm finished thickness. TMM6 circuit laminates support high power density RF circuit designs and plated through-hole reliability, widely adopted for power amplifiers, satellite communication hardware and GPS antenna systems. The product follows IPC-Class-2 standards and offers global supply.