Rogers TMM10i Dual-Sided Immersion Gold PCB 30mil Isotropic Thermoset Microwave Substrate for RF and GPS Antennas

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

1. Product Introduction

Rogers TMM10i 2-layer rigid high frequency PCB is a high-reliability thermoset microwave circuit board built on authentic TMM series ceramic hydrocarbon polymer composite substrates. Featuring a 0.8mm finished board thickness and premium ENIG surface finish, TMM10i isotropic RF PCB supports dual-sided white silkscreen and full black solder mask coverage, plus professional edge plating processing for enhanced circuit stability and corrosion resistance. Manufactured with standard Gerber RS-274-X artwork and compliant with strict IPC-Class-2 quality standards, every finished PCB undergoes 100% full electrical testing before shipment to ensure consistent and reliable performance. Different from conventional PTFE and pure ceramic substrates, Rogers TMM10i perfectly integrates the superior electrical properties of ceramic materials and the easy processing advantages of soft substrates, eliminating complex pre-plating treatments and supporting reliable wire bonding. With worldwide supply availability, Rogers TMM10i high-performance PCB is widely adopted for high-precision microwave circuits, satellite communication systems, GPS antennas and RF power amplifier applications.

2. Core Product Features

Adopting professional Rogers TMM10i isotropic thermoset microwave composite material, this 2-layer high frequency PCB delivers balanced electrical stability, mechanical durability and processing compatibility, with comprehensive core technical features for high-end RF and microwave designs:

1. Isotropic dielectric constant of 9.80 ±0.245, ensuring uniform electrical performance in all directions and eliminating signal deviation in precision circuit layouts
2. Ultra-low dissipation factor of 0.0020 at 10GHz, effectively minimizing high-frequency signal loss and improving microwave transmission efficiency
3. Low thermal coefficient of DK at -43 ppm/°K, maintaining stable dielectric performance under variable temperature working environments
4. Copper-matched thermal expansion coefficient (19ppm/K for X/Y axis, 20ppm/K for Z axis), greatly boosting plated through-hole reliability
5. High decomposition temperature (Td) of 425°C via TGA testing, delivering excellent thermal resistance for high-power circuit operation
6. Stable thermal conductivity of 0.76W/mK, accelerating heat dissipation and avoiding thermal accumulation in compact RF modules
7. Wide customizable substrate thickness range from 0.0015 to 0.500 inches, supporting diversified structural design demands
8. Professional edge plating design enhances circuit edge conductivity, anti-interference capability and structural durability
9. Dual-sided black solder mask and dual-sided white silkscreen configuration, realizing clear marking and full-circuit insulation protection
10. No blind via design, simplifying fabrication processes and improving overall circuit yield and reliability

3. Product Performance Benefits

Benefiting from the exclusive thermoset ceramic hydrocarbon composite formula and isotropic structural design of Rogers TMM10i substrate, this 2-layer high frequency PCB provides irreplaceable practical advantages for modern high-precision microwave electronic design and mass production:

1. Superior mechanical anti-creep and anti-cold flow properties, maintaining stable structural shape and circuit performance under long-term load and high-temperature conditions
2. Excellent chemical resistance against mainstream PCB process etchants and solvents, effectively avoiding substrate damage during fabrication and assembly
3. No sodium napthanate pre-treatment required before electroless plating, greatly simplifying production processes and reducing manufacturing costs
4. Thermoset resin structure will not soften under high temperature, supporting stable and reliable wire bonding without pad lifting or substrate deformation risks
5. Ultra-low thermal DK drift and copper-matched CTE achieve extremely low etching shrinkage, ensuring high precision of fine-line microwave circuits
6. Thermal conductivity nearly doubles that of traditional PTFE-ceramic laminates, optimizing heat dissipation for high-power RF amplifiers and combiner modules
7. Combines ceramic-level high-frequency stability and soft substrate processability, no specialized complex production techniques required
8. Able to replace expensive alumina ceramic substrates, achieving equivalent high-frequency performance with higher cost performance and better processability

4. PCB Construction Details

Rogers TMM10i high frequency microwave PCB is produced with standardized high-precision industrial parameters. All detailed construction specifications are sorted in the table below for circuit design, process verification and quality inspection reference:

5. PCB Stackup Structure

This 2-layer rigid high frequency PCB adopts a stable isotropic stackup structure with genuine Rogers TMM10i thermoset microwave composite core, ensuring uniform electrical transmission and ultra-high structural reliability for stripline and microstrip circuits:

1. Copper_layer_1: 35 μm High-Purity Copper Foil
2. Rogers TMM10i Core Substrate: 0.762mm (30mil) Isotropic Thermoset Composite Laminate
3. Copper_layer_2: 35 μm High-Purity Copper Foil

6. PCB Circuit Statistics

The Rogers TMM10i high frequency PCB features a scientific and compact circuit layout, with complete component and wiring configurations to meet high-precision RF microwave assembly and testing requirements:

1. Total Mountable Components: 19
2. Total Circuit Pads: 52
3. Through Hole Pads: 38
4. Top SMT Pads: 14
5. Bottom SMT Pads: 0
6. Conductive Vias: 18
7. Circuit Nets: 2

7. Production Specification & Global Availability

All Rogers TMM10i microwave PCBs are produced based on standard Gerber RS-274-X artwork format, achieving full compatibility with global mainstream PCB processing, plating and assembly equipment. The entire manufacturing process strictly implements IPC-Class-2 industrial quality standards, ensuring ultra-high dimensional accuracy, stable isotropic dielectric performance and long-term structural durability. With mature and stable global supply channels, this high-cost-performance thermoset microwave PCB can provide standardized and customized circuit solutions for RF microwave enterprises, communication equipment manufacturers and precision electronic testing institutions worldwide.

8. Typical Application Scenarios

Supported by isotropic electrical performance, low temperature drift, high thermal stability and reliable wire-bonding capability, TMM10i high frequency PCB is widely used in high-precision commercial and industrial microwave electronic fields:

1. General RF & Microwave Systems: High-precision stripline and microstrip microwave circuitry
2. High-Power RF Components: Power amplifiers, signal combiners, filters and couplers
3. Satellite & Navigation Communication: Satellite communication systems and GPS global positioning antennas
4. Wireless Antenna Devices: High-stability patch antennas and dielectric polarizers & lenses
5. Precision Testing Equipment: Professional chip testers and high-precision microwave detection modules

9. Rogers TMM10i & TMM Series Substrate Professional Knowledge

Rogers TMM10i belongs to the premium TMM series thermoset microwave materials, which are innovative ceramic-hydrocarbon-polymer composite laminates developed to combine the strengths of traditional ceramic substrates and PTFE microwave laminates. Breaking through the processing limitations of ceramic materials and the thermal instability of PTFE materials, TMM10i realizes high isotropic performance, excellent process adaptability and ultra-reliable structural stability, becoming a mainstream alternative to high-cost alumina substrates in high-frequency microwave industries.

9.1 Unique Isotropic Material Design

TMM10i features fully isotropic dielectric and mechanical properties, with consistent dielectric constant and thermal expansion in all directions. This design completely avoids circuit performance deviation caused by material anisotropy, which is common in glass-reinforced substrates. The ultra-stable DK value and low thermal coefficient of dielectric constant (only -43 ppm/°K) ensure extremely stable frequency and phase performance in fluctuating temperature environments, perfectly adapting to temperature-sensitive precision microwave circuits.

9.2 Advanced Thermoset Resin Structural Advantages

Different from thermoplastic PTFE materials, TMM10i adopts high-performance thermoset resin formula, which will not soften or deform under continuous high-temperature conditions. This core characteristic enables safe and reliable wire bonding processes without pad warping, lifting or substrate damage. Meanwhile, the material possesses excellent mechanical rigidity with strong resistance to creep and cold flow, maintaining stable structural dimensions under long-term mechanical and thermal load.

9.3 Simplified Processing & Chemical Stability

TMM10i laminates feature outstanding resistance to various PCB process chemicals, including etching solutions and organic solvents, effectively reducing substrate damage and yield loss during fabrication. Most importantly, the material eliminates the need for complicated sodium napthanate surface treatment before electroless plating, greatly simplifying the production process, shortening manufacturing cycles and reducing overall production costs. It is fully compatible with all standard conventional printed circuit board processing techniques.

9.4 Thermal & Structural Reliability Mechanism

The X/Y/Z three-axis thermal expansion coefficients of TMM10i are highly matched with copper foil, achieving ultra-low etching shrinkage and excellent plated through-hole reliability even under severe thermal cycling conditions. Its thermal conductivity is nearly twice that of traditional PTFE-ceramic composite substrates, providing efficient heat dissipation for high-power RF circuits and avoiding performance attenuation caused by thermal accumulation. With a high decomposition temperature of 425°C, the material adapts to high-temperature processing and long-term high-power working scenarios.

9.5 Product Customization & Versatility

TMM10i supports a wide thickness customization range from 0.0015 inches to 0.500 inches, and can be clad with 0.5oz to 2oz electrodeposited copper foil. It can also be directly bonded with brass or aluminum base plates to adapt to high-power heat-dissipation structural designs. With versatile performance and process compatibility, TMM10i can completely replace traditional alumina ceramic substrates, achieving high-end microwave performance with better processability and higher cost performance.

11.Rogers TMM10i Datasheet

11. Product Summary

Rogers 2-Layer TMM10i high frequency PCB is a high-reliability isotropic thermoset microwave composite circuit board for precision RF and microwave applications. Featuring 0.8mm standard thickness, premium ENIG surface finish, dual-sided full solder mask and edge plating design, this 2-layer PCB adopts TMM10i ceramic hydrocarbon substrate with stable DK 9.80 isotropic performance, ultra-low high-frequency loss and copper-matched thermal expansion. With excellent chemical resistance, reliable wire-bonding capability and simplified processing requirements, it outperforms traditional PTFE and ceramic substrates in comprehensive performance. Compliant with IPC-Class-2 standards and 100% pre-delivery electrical testing, it is the ideal cost-effective replacement for alumina substrates, widely suitable for RF power amplifiers, microwave filters, satellite communication systems and precision antenna equipment.