Rogers TMM10i High Frequency PCB Material Introduction Hello and welcome back to our channel. Today we're going to be talking about Rogers TMM10i laminate, an isotropic thermoset microwave PCB material that's perfect for high plated thru-hole reliability strip-line and micro-strip applications. Rogers TMM10i thermoset microwave PCB materials are made up of a combination of ceramics, hydrocarbons and thermoset polymers. They offer a unique blend of electrical and mechanical properties that draw from the advantages of both ceramic and traditional PTFE microwave circuit laminates. TMM10i laminates have an exceptionally low TCDk value. This material's isotropic CTE, which closely match those of copper, make it possible to produce high-reliability plated through holes and achieve low etch shrinkage values. Additionally, the thermal conductivity is about double that of traditional PTFE/ceramic laminates, enabling effective heat removal. Now let’s take a closer look at the data sheet for Rogers TMM10i and explore its properties in more detail. TMM10i Typical Properties Starting with the electrical properties, TMM10i has a process dielectric constant of 9.80±0.245 in the Z-direction at 10 GHz (measured using IPC-TM-650 2.5.5.5), and a slightly higher design dielectric constant of 9.9 across a frequency range of 8 GHz to 40 GHz (measured using the Differential Phase Length Method). Its dissipation factor is also impressively low at 0.002 in the Z-direction at 10 GHz (measured using IPC-TM-650 2.5.5.5). TMM10i high frequency circuit material has a low thermal coefficient of dielectric constant (TCDk) of -43 ppm/°K over a temperature range of -55℃ to 125℃ (measured using IPC-TM-650 2.5.5.5), which makes it suitable for use in a range of applications that require thermal stability. Its insulation resistance is greater than 2000 Gohm (measured using ASTM D257), and it has a high volume resistivity of 2 x 10^8 Mohm.cm and a surface resistivity of 4 x 10^7 Mohm (both measured using ASTM D257). Its dielectric strength is 267 V/mil in the Z-direction (measured using IPC-TM-650 method 2.5.6.2), which indicates its resistance to electrical breakdown. Moving on to the thermal properties, TMM10i has a decomposition temperature of 425℃ (measured using TGA ASTM D3850), making it suitable for use in high-temperature applications. It has a coefficient of thermal expansion of 19 ppm/K in the X and Y directions and 20 ppm/K in the Z direction over a temperature range of 0 to 140℃ (measured using ASTM E 831 IPC-TM-650, 2.4.41), which means that it has isotropic thermal properties that closely match those of copper. Its thermal conductivity is 0.76 W/m/K in the Z-direction at 80℃ (measured using ASTM C518),which indicates its ability to dissipate heat and facilitate heat removal. TMM10i also has impressive mechanical properties, with a copper peel strength of 5.0 (0.9) lb/inch (N/mm) in the X and Y directions after thermal stress from solder float (measured using IPC-TM-650 Method 2.4.8), a flexural modulus of 1.8 Mpsi in the X and Y directions (measured using ASTM D790). Finally, TMM10i has a moisture absorption rate of 0.16% for a thickness of 1.27mm (0.050") and 0.13% for a thickness of 3.18mm (0.125") (measured using ASTM D570), a specific gravity of 2.77 (measured using ASTM D792). and a specific heat capacity of 0.72 J/g/K. It is also lead-free process compatible. TMM10i Typical Value Property TMM10i Direction Units Condition Test Method Dielectric Constant,εProcess 9.80±0.245 Z 10 GHz IPC-TM-650 2.5.5.5 Dielectric Constant,εDesign 9.9 - - 8GHz to 40 GHz Differential Phase Length Method Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5 Thermal Coefficient of dielectric constant -43 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5 Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257 Volume Resistivity 2 x 108 - Mohm.cm - ASTM D257 Surface Resistivity 4 x 107 - Mohm - ASTM D257 Electrical Strength(dielectric strength) 267 Z V/mil - IPC-TM-650 method 2.5.6.2 Thermal Properties Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850 Coefficient of Thermal Expansion - x 19 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41 Coefficient of Thermal Expansion - Y 19 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41 Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41 Thermal Conductivity 0.76 Z W/m/K 80 ℃ ASTM C518 Mechanical Properties Copper Peel Strength after Thermal Stress 5.0 (0.9) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8 Flexural Strength (MD/CMD) - X,Y kpsi A ASTM D790 Flexural Modulus (MD/CMD) 1.8 X,Y Mpsi A ASTM D790 Physical Properties Moisture Absorption (2X2) 1.27mm (0.050") 0.16 - % D/24/23 ASTM D570 3.18mm (0.125") 0.13 Specific Gravity 2.77 - - A ASTM D792 Specific Heat Capacity 0.72 - J/g/K A Calculated Lead-Free Process Compatible YES - - - - A Piece of TMM10i Laminate On the screen, you can see a TMM10i laminate. We can find its versatile applications in RF and microwave circuitry, power amplifiers, power combiners，filters and couplers, satellite communication systems, global positioning systems antennas, patch antennas, dielectric polarizers, chip testers and more. Conclusion Rogers TMM10i PCB materials are known for their temperature stability, thanks to their hydrocarbon matrix that's heavily filled with ceramic particles. These ceramic fillers give TMM10i materials a low thermal expansion. However, drilling TMM10i materials requires some precautions due to the abrasive nature of the ceramic filler. It's recommended to avoid high tool surface speeds over 500 SFM and low chip loads under 0.002" per revolution, as they can cause excessive heat and tool wear. If you're interested in machining TMM10i laminates, you'll be happy to know that they can be routed using conventional carbide tools. By selecting the right routing conditions and tools, you can achieve a useful tool life of over 250 linear inches. OK, this concludes the episode. Thanks for your reading, I’ll see you next time.
.jpg)
Home