CLTE-MW 2-Layer 0.2mm Pure Gold High Frequency PCB Rogers Low Loss Microwave Circuit Board

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

1. Product Introduction

CLTE-MW 2-layer high frequency PCB is a high-performance rigid circuit board engineered for precision millimeter wave and 5G communication applications. This CLTE series PCB adopts premium 0.102 mm CLTE-MW laminate material with spread glass reinforcement and high filler loading, effectively reducing high frequency glass weave interference on electromagnetic wave propagation. Designed with customizable thickness specifications ranging from 3 mils to 10 mils, CLTE-MW circuit board delivers optimal signal-to-ground spacing to meet strict physical and electrical thickness limitation requirements. With pure gold surface finish and standardized IPC-Class-2 manufacturing quality, this CLTE-MW high frequency material provides a cost-effective and reliable circuit solution for commercial, aerospace and military high-frequency electronic systems, supporting stable operation in complex thermal and electromagnetic environments.

2. Core Product Features

1. Extremely low loss tangent of 0.0015 at 10GHz, ensuring stable high-frequency signal transmission
2. Low Z-axis CTE of 30ppm/°C, optimizing structural stability during temperature changes
3. Superior thermal conductivity of 0.42 W/(mK) for efficient heat transfer
4. Complies with UL94 V-0 flammability rating, meeting global safety fire resistance standards
5. Precision circuit design with 4/6 mils minimum trace/space and 0.3mm minimum hole size
6. Standard 2-layer rigid structure without blind vias, simplifying assembly and improving structural stability

3. Product Performance Benefits

1. Supports ultra-low loss circuit designs, minimizing high-frequency signal attenuation for 5G and millimeter wave devices
2. Offers excellent plated through hole (PTH) reliability, ensuring long-term structural and electrical stability
3. Achieves outstanding heat dissipation performance, adapting to high-load and aggressive circuit design scenarios
4. Features strong compatibility with various commercial communication electronic applications, reducing application adaptation costs
5. Maintains consistent mechanical performance under thermally challenging and high-temperature working environments

4. PCB Construction Details

5. PCB Stackup Structure

0.102mm CLTE-MW laminate PCB  adopts a standard 2-layer rigid PCB stackup structure with stable and layered layout, which ensures uniform signal transmission and reliable structural performance. The detailed stackup configuration is as follows:

1. Copper_layer_1: 35 μm
2. CLTE-MW Core: 0.102 mm (4.016mil)
3. Copper_layer_2: 35 μm

6. PCB Statistical Parameters

1. Components: 43
2. Total Pads: 27
3. Thru Hole Pads: 19
4. Top SMT Pads: 8
5. Bottom SMT Pads: 0
6. Vias: 25
7. Nets: 6

7. Artwork Supplied Type

The PCB design artwork is provided in Gerber RS-274-X standard format, which is universally compatible with global PCB manufacturing and processing equipment, supporting accurate circuit etching and production.

8. Quality Manufacturing Standard

CLTE-MW 0.2mm Thickness PCB is manufactured in strict accordance with IPC-Class-2 industry quality standards, ensuring consistent product quality, stable electrical performance and qualified structural reliability for industrial and commercial applications.

9. Product Availability

2-layer CLTE-MW high frequency PCB is available for worldwide supply, supporting global customer procurement and customized processing services.

10. Typical Application Scenarios

1. Commercial Communications and Avionics Systems
2. Military and Aerospace Electronic Equipment
3. Microwave Feed Network Devices
4. Phase Sensitive Electronic Structures
5. Satellite Communication Systems
6. Passive Components Including Couplers, Filters and Baluns

11.CLTE Copper Clad Laminate (CCL) Knowledge

CLTE series high frequency copper clad laminates are core dielectric materials specially developed for high-performance radio frequency, microwave and millimeter wave PCB production. As a premium PTFE-based laminate solution, CLTE materials stand out in the high-frequency circuit industry for their ultra-stable physical and electrical properties, serving as the foundational guarantee for the reliable operation of CLTE-MW high frequency PCB boards.

11.1 Core Material Advantages

1. Superior Dimensional Stability: CLTE laminates feature ultra-low planar CTE and excellent dimensional uniformity, delivering extremely low performance variance among all PTFE-based copper clad laminates. This stable property enables high-precision integration of embedded resistors and fine-line circuits on high frequency PCBs.
2. Diversified Cladding Compatibility: With mature and stable application experience matching resistor foil, CLTE laminates support multiple copper cladding options, including electrodeposited copper, reverse treated copper and rolled copper foil, meeting diverse high-frequency PCB design and manufacturing demands.
3. Proven Industrial Reliability: After long-term market verification, CLTE copper clad laminates have become the preferred dielectric material for ground-based and airborne communication equipment, as well as high-precision radar system PCBs, with stable performance in complex working conditions.

11.2 Key Features and Corresponding Performance Benefits

1. Ultra-Low Loss Tangent: Boasts a loss tangent of 0.0012 at 10 GHz, effectively reducing high-frequency circuit signal loss while maintaining outstanding dimensional stability, maximizing the signal transmission efficiency of high frequency PCB.
2. Ultra-Low Z-axis CTE: Equipped with a low Z-axis CTE of 20 ppm/°C, greatly improves the structural stability of plated through holes, effectively avoiding hole cracking and circuit failure caused by temperature cycling, and enhancing the long-term reliability of multilayer and precision PCBs.
3. Temperature-Stable Dielectric Constant: The dielectric constant remains stable under varying temperature environments, reducing thermal stress on ceramic active devices mounted on the high frequency PCB, and protecting core electronic components.
4. Heavy Metal Backing Support: Customizable with aluminum, brass and copper heavy metal backing structures, perfectly adapting to embedded resistor network design requirements and improving the structural firmness and heat resistance of high-frequency circuit boards.

11.3 Extended Application Scenarios of CLTE Laminate PCB

1. Advanced Driver Assistance Systems (ADAS) automotive high-frequency circuit modules
2. High-precision patch antenna PCBs for wireless communication devices
3. Phased array antenna system high-frequency microwave circuit boards
4. High-power amplifier RF PCBs for communication base stations
6. 12.CLTE Series Laminates Data Sheet

13.Product Summary

CLTE-MW high frequency PCB is a premium low-loss rigid circuit board tailored for high-frequency millimeter wave and 5G communication industries. Featuring 0.2mm ultra-thin finished thickness, pure gold surface finish and CLTE-MW high-performance laminate core material, this PCB achieves ultra-low loss tangent at 10GHz, excellent thermal conductivity and stable thermal expansion performance. With standardized IPC-Class-2 manufacturing quality and precise circuit parameters, it delivers reliable low-loss signal transmission, superior heat dissipation and durable mechanical performance, fully adapting to commercial communication, aerospace, military and satellite communication high-precision electronic device applications.