2. Rogers RO4730G3 PCB Features

1. Dielectric constant (Dk) of 3.0 +/- 0.05 at 10GHz
2. Dissipation factor of 0.0028 at 10GHz
3. Thermal coefficient of Dk (TCDk) of 34 ppm/°C
4. Coefficient of Thermal Expansion (CTE) matched to copper
5. Glass Transition Temperature (Tg) >280 °C
6. Decomposition Temperature (Td) of 411 °C (TGA)
7. Coefficient of Thermal Expansion (CTE) - x-axis: 15.9 ppm/°C, y-axis: 14.4 ppm/°C, z-axis: 35.2 ppm/°C
8. Thermal Conductivity of 0.45 W/mk
9. Base Material: Rogers RO4730G3 (hydrocarbon/ceramic/woven glass UL 94 V-0 antenna grade laminates)
10. Layer Count: 2-layer rigid PCB
11. Finished Board Thickness: 0.6mm
12. Surface Finish: ENEPIG

3. Rogers RO4730G3 PCB Benefits

1. Low loss dielectric with low profile foil ensures minimal signal attenuation, delivering excellent insertion loss performance for high-frequency antenna applications.
2. Reduced Passive Intermodulation (PIM) enhances signal clarity and reliability, critical for cellular base station antenna performance.
3. Unique filler and closed microspheres contribute to low density, making the PCB 30% lighter than PTFE/Glass alternatives, ideal for weight-sensitive applications.
4. Low z-axis CTE (<30 ppm/°C) and CTE matched to copper prevent warping and delamination, improving structural stability and long-term reliability during thermal cycling.
5. High Tg (>280 °C) provides exceptional thermal stability, supporting compatibility with high-temperature lead-free solder processing and harsh operating environments.
6. Low TCDk (<40 ppm/°C) ensures consistent circuit performance across a wide temperature range, maintaining signal integrity in variable conditions.
7. Specially formulated thermoset resin system and filler enable ease of fabrication, including reliable PTH process capability, reducing manufacturing complexity and costs.
8. Environmentally friendly design with lead-free process compatibility and RoHS compliance, meeting global environmental standards.
9. Compatibility with conventional FR-4 processing eliminates the need for special equipment or treatments, streamlining manufacturing and reducing production costs.
10. Affordable alternative to conventional PTFE-based antenna materials, allowing designers to optimize cost and performance without sacrificing reliability.
11. Meets IPC-Class 2 quality standards, balancing cost and performance with minimal cosmetic imperfections that do not affect functionality.

4. PCB Construction Details

Construction Item	Specification
Base Material	RO4730G3
Layer Count	2 layers
Board Dimensions	85.6mm x 103mm = 1PCS, +/- 0.15mm
Minimum Trace/Space	4/6 mils
Minimum Hole Size	0.3mm
Blind Vias	No
Finished Board Thickness	0.6mm
Finished Cu Weight (Outer Layers)	1oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	ENEPIG
Top Silkscreen	White
Bottom Silkscreen	No
Top Solder Mask	Blue
Bottom Solder Mask	No
Electrical Test (Prior to Shipment)	100% Electrical Test

5. PCB Stackup

2-layer rigid PCB, with the following structure (from top to bottom):

1. Copper_layer_1 - 35 μm
2. Rogers RO4730G3 Core - 0.508 mm (20mil)
3. Copper_layer_2 - 35 μm

6. PCB Statistics

1. Components: 32
2. Total Pads: 42
3. Thru Hole Pads: 26
4. Top SMT Pads: 16
5. Bottom SMT Pads: 0
6. Vias: 14
7. Nets: 2

7. Type of Artwork Supplied

Gerber RS-274-X

8. Quality Standard

IPC-Class-2 (meets industry-set quality standards for industrial and antenna applications, balancing cost and performance with minimal cosmetic imperfections that do not affect functionality).

9. Availability

Worldwide

10. Typical Applications

Cellular Base Station Antennas

Summary

Rogers RO4730G3 2-Layer High Frequency PCB is a cost-effective, reliable circuit board engineered for cellular base station antennas and high-frequency applications, leveraging Rogers RO4730G3 antenna grade laminates to deliver exceptional performance. With a 0.6mm thickness, 2-layer rigid construction, and compliance with IPC-Class 2 quality standards, RO4730G3 laminate PCB offers low dielectric loss, reduced PIM, light weight, and excellent thermal stability—making it ideal for demanding cellular base station environments. Compatible with conventional FR-4 and lead-free solder processing, easy to fabricate, and RoHS compliant, RO4730G3 PCB serves as an affordable alternative to PTFE-based laminates, enabling designers to optimize cost and performance while meeting global environmental and industry standards. Supported by worldwide availability, it provides a dependable solution for high-frequency antenna applications.

 

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen, China, serving customers worldwide.

 

We are devoted to delivering high-frequency PCB products and solutions of the highest quality, along with customized service. Get in touch with us to start your project !

Visit https://www.bicheng-enterprise.com to learn more.