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Rogers TMM6 PCB 2-Layer 0.5mm Thermoset Microwave PCB for RF and Satellite Communications
Rogers TMM6 PCB 2-Layer 0.5mm Thermoset Microwave PCB for RF and Satellite Communications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Rogers TMM6 PCB Introduction
Rogers TMM6 PCB is a ceramic thermoset polymer composite specifically engineered for high-reliability stripline and microstrip applications in microwave frequencies. The advanced TMM6 material combines the performance advantages of ceramic and traditional PTFE laminates while eliminating the need for specialized production techniques. With its unique dielectric constant within the product family, TMM6 PCB delivers consistent performance and excellent plated through-hole reliability for demanding RF and microwave circuits.
2. PCB Construction Details
Specification Category |
Details |
Base Material |
Rogers TMM6 |
Layer Count |
2 Layers |
Board Dimensions |
40mm x 70mm (±0.15mm) |
Finished Thickness |
0.5mm |
Copper Weight |
1 oz Outer Layers |
Min. Trace/Space |
4/5 mils |
Min. Hole Size |
0.2mm |
Blind Vias |
None |
Surface Finish |
Immersion Silver |
Solder Mask |
None |
Silkscreen |
None |
Electrical Test |
100% |
3. Stackup Structure
This ultra-thin 2-layer configuration employs a Rogers TMM6 core with 0.381mm (15mil) thickness, positioned between two 35μm copper layers to create a compact 0.5mm profile ideal for space-constrained microwave applications.
4. Board Statistics
Components: 11
Total Pads: 37 (25 Thru-Hole, 12 Top SMT)
Vias: 18
Nets: 2
Files: Gerber RS-274-X
Standard: IPC-Class-2
Availability: Worldwide
5. TMM6 Material Features
Dielectric Constant: 6.0±0.08 @ 10GHz
Dissipation Factor: 0.0023 @ 10GHz
Thermal Coefficient of Dk: -11 ppm/°K
CTE: X 18/Y 18/Z 26 ppm/K
Thermal Conductivity: 0.72 W/mK
Decomposition Temperature: 425°C
Thickness Range: 0.0015-0.500 inches
6. Key Benefits
Excellent mechanical properties resisting creep and cold flow
Strong resistance to chemical damage during fabrication
Reliable wire-bonding capability with thermoset resin base
Compatibility with all standard PCB manufacturing processes
Thermal expansion matched to copper for enhanced reliability
No specialized production techniques required
7. Typical Applications
RF and Microwave Circuits
Power Amplifiers and Combiners
Filters and Couplers
Satellite Communication Systems
GPS Antennas
Patch Antennas
Dielectric Polarizers and Lenses
Chip Testing Equipment