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4-Layer 1.8mm Rigid Polyimide PCB High-Temperature Circuit Board with HASL for Aerospace and Military Applications
4-Layer 1.8mm Rigid Polyimide PCB High-Temperature Circuit Board with HASL for Aerospace and Military Applications
Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.
1. Rigid Polyimide PCB Material Properties
Rigid Polyimide PCB represents the pinnacle of high-performance circuit board materials, delivering exceptional thermal stability and mechanical strength for demanding applications. This advanced polymer maintains outstanding peel strength values of 1.42 N/mm after thermal stress and 1.13 N/mm following process solution exposure, demonstrating remarkable durability. The material exhibits superior electrical insulation characteristics with volume resistivity measuring 6.6×10⁶ MΩ·cm (C-96/35/90) and 6.2×10⁶ MΩ·cm (E-24/204), complemented by surface resistivity values of 3.4×10⁶ MΩ and 2.3×10⁶ MΩ under identical conditions.
Further enhancing its reliability, Rigid Polyimide PCB features excellent moisture resistance with only 0.11% absorption rate and high dielectric strength of 44.3 kV breakdown voltage. The material maintains stable dielectric properties with a constant of 4.12 and dissipation factor of 0.0072 at 1MHz. Mechanically, it demonstrates robust bending strength of 410.2 N/mm² (machine direction) and 355.1 N/mm² (cross direction), while withstanding extreme thermal conditions including 288°C stress testing without delamination or blistering, supported by a high glass transition temperature (Tg) of 257°C.
2. PCB Construction & Specifications
Board Type: 4-Layer Rigid PCB
Base Material: Rigid Polyimide
Quality Standard: IPC-Class-2
Board Dimensions: 325mm x 83mm (±0.15mm)
Finished Thickness: 1.8mm
Copper Weight: 1oz (35μm) outer layers
Minimum Trace/Space: 5/5 mils
Minimum Hole Size: 0.3mm
Blind Vias: Not Applicable
Via Plating Thickness: 20μm
Surface Finish: HASL Lead Free
Solder Mask: Black (Top & Bottom)
Silkscreen: White (Top & Bottom)
Special Features: 0.3mm vias resin filled and capped, Countersunk holes from top
Electrical Test: 100% tested prior to shipment
3. PCB Stackup Configuration
Layer 1: Copper - 35μm
Core: Polyimide - 0.32mm
Layer 2: Copper - 35μm
Prepreg: Polyimide - 0.1mm
Core: Polyimide - 0.8mm
Prepreg: Polyimide - 0.1mm
Layer 3: Copper - 35μm
Core: Polyimide - 0.32mm
Layer 4: Copper - 35μm
4. PCB Statistics
Components: 68
Total Pads: 102
Thru Hole Pads: 47
Top SMT Pads: 39
Bottom SMT Pads: 16
Vias: 121
Nets: 12
5. Artwork & Standards
Type of artwork supplied: Gerber RS-274-X
Quality standard: IPC-Class-2
Availability: worldwide
6. Material Properties
Excellent high-frequency dielectric performance
High-temperature resistance
Good radiation resistance
Exceptional thermal stability
Superior mechanical strength
Outstanding electrical insulation
7. Applications
Aerospace electronic equipment
Aviation systems
Military electronics
Downhole oil extraction equipment
High-temperature resistant applications
High-frequency circuits
Specialized industrial electronics
8. Global Availability
This Rigid Polyimide PCB solution is available for worldwide manufacturing and distribution, supporting both prototype development and production requirements across global markets with comprehensive technical support.
9. Quality Assurance
100% electrical testing prior to shipment
IPC-Class-2 quality standards compliance
Comprehensive thermal and mechanical validation
Reliability testing for extreme environments
10. Technical Support
Complete engineering support services for design optimization, manufacturing consultation, and application-specific solutions to ensure optimal performance in demanding operating conditions.