TF300 Double-Sided High Frequency PCB Wangling 25mil TF300 Substrate with ENEPIG Finish for Aerospace Radar & Satellite Communication

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

1. Introduction

This TF300 PCB is a 2-layer rigid printed circuit board built on 25mil (0.635 mm) Wangling TF300 high-frequency laminates. This fiberglass-free PTFE-ceramic composite circuit board delivers stable dielectric performance, ultra-low dissipation factor, radiation resistance and low outgassing characteristics, well suited for microwave and millimeter-wave PCB designs. The TF300 printed circuit board can be processed with standard thermoplastic manufacturing workflows for high-reliability aerospace and radar projects.

2. Features

• 2-layer rigid PCB built on Wangling TF300 laminate, board dimension 46.3mm x 55.01 mm=1PCS, +/- 0.15mm
• 25mil (0.635mm) core substrate, finished board thickness of 0.7mm, 1oz (1.4 mils) outer copper weight
• Minimum Trace/Space: 6/8 mils; Minimum Hole Size: 0.35mm, no blind vias
• Via plating thickness: 20 μm; ENEPIG surface finish
• No top and bottom silkscreen, no top and bottom solder mask
• TF300 Dk of 3.0±0.06 @10 GHz, dissipation factor of 0.001 @10 GHz
• TCDK of -60 ppm/℃ from -55℃~150℃; X/Y/Z CTE: 60 ppm/℃, 60 ppm/℃, 80 ppm/℃
• Radiation resistance and low outgassing properties, continuous operating temperature from -80℃ to +200℃
• 100% Electrical test used prior to shipment, available for worldwide supply

3. Benefits

• Fiberglass-free dielectric construction eliminates glass weave effect and delivers uniform dielectric constant across the substrate
• Ultra-low dissipation factor minimizes signal attenuation for high-frequency microwave and millimeter-wave circuits
• Wide operating temperature range supports stable electrical performance under extreme thermal environments
• Radiation resistance and low outgassing performance meet strict requirements for space and aerospace-grade equipment
• Compatible with standard thermoplastic PCB fabrication methods, simplifying manufacturing and improving production yield
• Tunable Dk series options from 3.0 to16, supporting diversified high-frequency impedance design requirements

4. PCB Construction Details

5. PCB Stackup

• Copper_layer_1 - 35 μm
• Wangling TF300 Core - 0.635 mm (25mil)
• Copper_layer_2 - 35 μm

6. PCB Statistics

• Components: 16
• Total Pads: 46
• Thru Hole Pads: 31
• Top SMT Pads: 15
• Bottom SMT Pads: 0
• Vias: 21
• Nets: 2

7. Type of artwork supplied

Gerber RS-274-X

8. Quality standard

IPC-Class-2

9. Availability

worldwide

10. Wangling TF Series Copper Clad Laminate (CCL) Introduction: TF300

10.1 TF Series Laminates Product Introduction

• Wangling TF series high frequency material is a composite made of temperature-resistant PTFE resin and ceramic filler. No glass fiber cloth is contained in the material composition.
• The dielectric constant can be precisely calibrated by adjusting the mixing ratio of ceramic powder and PTFE resin. With proprietary manufacturing techniques, TF laminates provide stable dielectric performance and long-term reliability for high-frequency circuits.
• TF300 is the representative grade of TF series laminates, featuring Dk 3.0±0.06 at 10 GHz. This fiberglass-free substrate avoids electromagnetic deviation caused by glass fiber weave and maintains consistent signal integrity.
• TF series CCL supports customizable thickness from 0.635mm to 2.5mm, available with standard electrolytic copper foil options of 0.5oz and 1oz.

10.2 TF300 Typical Material Properties

• Dielectric Constant (DK): 3.0±0.06 @10 GHz
• Dissipation Factor (DF): 0.001 @10 GHz
• Thermal Coefficient of Dielectric Constant (TCDK): -60 ppm/℃, -55℃~150℃
• Peel Strength (1oz Copper): >0.6 N/mm
• Coefficient of Thermal Expansion (CTE), X/Y/Z Axis: 60 ppm/℃, 60 ppm/℃, 80 ppm/℃
• Water Absorption: ≤0.05% (20±2℃, 24 h)
• Density: 2.41 g/cm³
• Thermal Conductivity: 0.3 W/m·K
• Standard Electrolytic Copper Foil: 0.5oz, 1oz

10.3 Core Material Advantages

• Wide tunable dielectric constant range from 3 to16. Common Dk values include 3.0, 6.0, 9.2, 9.6, 10.2 and 16 with low dielectric loss.
• Designed specifically for microwave and millimeter-wave printed circuit fabrication.
• Supports continuous operation within -80℃ to +200℃, suitable for harsh aerospace thermal environments.
• Excellent radiation resistance and low outgassing properties, qualified for vacuum and space working conditions.
• Easy to process. TF laminates can be fabricated using standard thermoplastic PCB manufacturing processes.
• Fiberglass-free structure eliminates glass weave induced phase variation, ideal for phase-sensitive antenna designs.

10.4 Environmental & Reliability Performance

• TF300 PTFE ceramic composite material exhibits low outgassing and radiation-resistant characteristics, which are critical attributes for space and airborne electronic hardware.
• Low water absorption below 0.05% ensures stable electrical performance under high humidity conditions.
• Balanced X/Y axis thermal expansion reduces dimensional shift during PCB processing and thermal cycling.
• The material retains stable dielectric properties across broad frequency bands, supporting broadband antenna and phased array designs.

10.5 Fabrication & Surface Finish Compatibility

• TF300 copper clad laminate supports multiple surface finishes including ENEPIG, ENIG, immersion silver, immersion tin and OSP to meet different assembly requirements.
• ENEPIG finish selected for this PCB offers excellent corrosion resistance, reliable wire bonding capability and long-term shelf life for high-reliability aerospace assemblies.
• This laminate is compatible with conventional mechanical drilling, routing and patterning processes for thermoplastic PTFE materials.

11. Some Typical Applications

• Aerospace equipment, space hardware, in-cabin equipment and aircraft electronics
• Microwave circuits, antennas and phase-sensitive antennas
• Early warning radars and airborne radars
• Phased array antennas and beamforming networks
• Satellite communications and navigation systems
• RF power amplifiers

12. Product Summary

TF300 2-Layer high-frequency rigid PCB is a 0.7mm printed circuit board built on 25mil TF300 high-frequency circuit laminates. TF300 RF circuit board features ENEPIG surface finish and no solder mask or silkscreen on both sides. TF300 PCB laminate is a fiberglass-free PTFE ceramic composite material with ultra-low dielectric loss, radiation resistance and low outgassing performance, suitable for aerospace, airborne radar, phased array antenna and satellite communication projects. Manufactured following IPC-Class-2 standards, TF300 microwave material accepts global orders.