TF300 High Frequency PCB Material Introduction TF series laminates is a composite of microwave and temperature-resistant polytetrafluoroethylene (PTFE) resin material and ceramics. It does not contain fiberglass cloth. The dielectric constant is precisely adjusted by adjusting the ratio between ceramics and PTFE resin. It has special production processes and exhibits excellent dielectric performance and high reliability. As a representative and highly sought-after model in the TF series, TF300 laminate fully inherits all the core advantages of the TF series, while being optimized for mainstream high-frequency application scenarios, making it a preferred choice for many high-end electronic product manufacturers. Specifically, TF300 high frequency circuit material features a precisely controlled dielectric constant of 3.0 (with a tight tolerance of ±0.04), which is achieved through the scientific and precise ratio of ceramics and temperature-resistant PTFE resin in its dielectric layer — a core characteristic of the entire TF series. Consistent with the series' design, TF300 high frequency PCB material contains no fiberglass cloth, ensuring excellent dielectric stability and signal integrity even in complex working environments. It also boasts an ultra-low dissipation factor of 0.0013 at 10 GHz, minimizing signal loss in high-frequency transmission and enhancing the overall performance of electronic devices. With its special production process, TF300 laminate maintains the high reliability of the TF series, featuring excellent temperature resistance and mechanical properties that adapt to various harsh application conditions, including industrial processes, wireless communication and satellite navigation fields. Like other products in the TF series, TF300 laminate is available in different copper cladding specifications to meet diverse application needs: TF refers to the smooth surface material without copper cladding, TF-1 refers to the material with copper cladding on one side, and TF-2 refers to the material with copper cladding on both sides. This versatility, combined with its outstanding electrical performance, further enhances the applicability of the TF300 laminate in high-frequency PCB manufacturing. TF series Product Features: The dielectric constant ranges from 3 to 16 and is stable. Common dielectric constants include 3.0, 6.0, 9.2, 9.6, 10.2, and 16, with low dielectric loss. Used for the fabrication of microwave and millimeter-wave printed circuit boards. Long-term working temperature is higher than TP materials and can be used in the range of -80°C to +200°C. Thickness options range from 0.635mm to 2.5mm. Resistant to radiation and low outgassing. Convenient for PCB processing, can be processed using methods suitable for thermoplastic materials. Product Models & Data Sheet The data sheet contains technical parameters and product features for the specified product models. Let's explore the details: Dielectric Constant: The dielectric constant is a measure of a material's ability to store electrical energy in an electric field. The test conditions vary based on the dielectric constant value. For dielectric constants ≤11, the test condition is 10GHz, while for dielectric constants >11, the test condition is 5GHz. The product models TF, TF-1, and TF-2 have different dielectric constant values as follows: TF300: 3.0±0.06 TF440: 4.4±0.09 TF600: 6.0±0.12 TF615: 6.15±0.12 TF920: 9.2±0.18 TF960: 9.6±0.19 TF1020: 10.2±0.2 TF1600: 16.0±0.4 It's worth noting that the dielectric constant can be customized within the range of 3.0 to 16. Tolerance of Dielectric Constant: The tolerance of the dielectric constant is specified based on the range. For dielectric constants ranging from 3.0 to 11.0, the tolerance is ±2%. For dielectric constants ranging from 11.1 to 16.0, the tolerance is ±2.5%. Loss Tangent: The loss tangent measures the dissipation of energy in a dielectric material. It is provided for different dielectric constant ranges and test conditions. The values are as follows: Dielectric Constant 3.0 to 9.5 at 10GHz: 0.0010 Dielectric Constant 9.6 to 11.0 at 10GHz: 0.0012 Dielectric Constant 11.1 to 16.0 at 5GHz: 0.0014 Dielectric Constant Temperature Coefficient: The dielectric constant temperature coefficient indicates the change in dielectric constant with temperature. It is provided for different dielectric constant ranges and temperature conditions. The values are expressed in parts per million per degree Celsius (PPM/℃). Here are the values: Dielectric Constant 3.0 to 4.5: -55ºC to 150ºC, -60 PPM/℃ Dielectric Constant 6.0 to 6.5: -55ºC to 150ºC, -210 PPM/℃ Dielectric Constant 9.0 to 11.0: -55ºC to 150ºC, -260 PPM/℃ Dielectric Constant 12.0 to 16.0: -55ºC to 150ºC, -205 PPM/℃ Peel Strength: Peel strength measures the strength of adhesion between layers of the product. The values are provided for two different states: 1 OZ Normal State: >0.6 N/mm 1 OZ After AC Humidity Test: >0.4 N/mm Volume Resistivity: Volume resistivity measures the resistance to electrical current through the volume of the material. The value in the normal state with a voltage of 500V is greater than 1×10^9 MΩ.cm. Surface Resistivity: Surface resistivity measures the resistance to electrical current across the surface of the material. The value in the normal state with a voltage of 500V is greater than 1×10^7 MΩ. Coefficient of Thermal Expansion (XY Z): The coefficient of thermal expansion indicates the change in size of the material with temperature. It is provided for different dielectric constant ranges and temperature conditions. The values are expressed in PPM/℃. Here are the values: Dielectric Constant 3.00 to 6.15: -55ºC to 150ºC, 60, 60, 80 PPM/℃ Dielectric Constant 6.16 to 11.0: -55ºC to 150ºC, 50, 50, 65 PPM/℃ Dielectric Constant 11.1 to 16.0: -55ºC to 150ºC, 40, 40, 55 PPM/℃ Water Absorption: Water absorption measures the amount of water absorbed by the material. The test is conducted at a temperature of 20±2℃ for 24 hours, and the value is reported to be ≤0.05%. Long-Term Operating Temperature: The long-term operating temperature range is tested in a high-low temperature chamber and spans from -80ºC to 200ºC. Material Composition: TF PCB material is composed of Polytetrafluoroethylene (PTFE), ceramic, and paired with ED copper foil. Product Technical Parameter Product Models & Data Sheet Product Features Test Conditions Unit TF TF-1 TF-2 Dielectric Constant When the dielectric constant is ≤11, the test condition is 10GHz. / 3.0±0.06 4.4±0.09 6.0±0.12 6.15±0.12 9.2±0.18 9.6±0.19 10.2±0.2 16.0±0.4 The dielectric constant can be customized within the range of 3.0～16 Tolerance of Dielectric Constant Dielectric Constant 3.0～11.0 / ±2% Dielectric Constant 11.1～16.0 / ±2.5% Loss Tangent Dielectric Constant 3.0～9.5 10GHz / 0.0010 Dielectric Constant 9.6～11.0 10GHz / 0.0012 Dielectric Constant 11.1～16.0 5GHz / 0.0014 Dielectric Constant Temperature Coefficient Dielectric Constant 3.0～4.5 -55 º~150ºC PPM/℃ -60 Dielectric Constant 6.0～6.5 -55 º~150ºC PPM/℃ -210 Dielectric Constant 9.0～11.0 -55 º~150ºC PPM/℃ -260 Dielectric Constant 12.0～16.0 -55 º~150ºC PPM/℃ -205 Peel Strength 1 OZ Normal State N/mm >0.6 1 OZ ?After AC Humidity Test N/mm >0.4 Volume Resistivity Normal State 500V MΩ.cm >1×10^9 Surface Resistivity Normal State 500V MΩ >1×10^7 Coefficient of Thermal Expansion Dielectric Constant 3.00～6.15 -55 º~150ºC PPM/℃ 60,60,80 Dielectric Constant 6.16～11.0 -55 º~150ºC PPM/℃ 50,50,65 Dielectric Constant 11.1～16.0 -55 º~150ºC PPM/℃ 40,40,55 Water Absorption 20±2℃, 24 hours % ≤0.05 Long-Term Operating Temperature High-Low Temperature Chamber ℃ -80～200ºC Material Composition Polytetrafluoroethylene (PTFE), ceramic, paired with ED copper foil. The density and thermal conductivity data for materials with different dielectric constants are as follows: Product Features Unit Dielectric Constant 3.0 4.4 6.0 6.15 9.2 9.6 10.2 16.0 Density g/cm3 2.41 2.58 2.78 2.79 3.0 3.02 3.07 3.27 Thermal Conductivity W/(M.K) 0.30 0.32 0.45 0.46 0.66 0.68 0.7 0.75 A TF Laminate and Applications Displayed on the screen is a TF300 high-frequency laminate. TF high-frequency PCB materials are utilized in applications of microwave and millimeter-wave printed circuit boards, such as millimeter-wave radar sensors, antennas, transceivers, modulators, multiplexers, as well as power supply equipment and automatic control equipment.
When the dielectric constant is >11, the test condition is 5GHz.
(XY Z)
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