TF300 Low Loss PCB 2-Layer 0.7mm Immersion Gold Circuit Board for Phase-sensitive Antennas and Phased Array Antennas

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

1. Introduction

Wangling TF300 PCB is a professional 2-layer rigid high frequency printed circuit board built on premium 0.635mm Wangling TF300 ceramic-filled PTFE core material. This 0.7mm finished high frequency PCB adopts advanced fiberglass-free composite dielectric structure composed of high-performance PTFE resin and ceramic fillers, delivering exceptional microwave stability and reliable thermal endurance. The TF300 core material features precisely calibrated dielectric constant and ultra-low dissipation factor at 10 GHz, making it a top-tier substrate for millimeter-wave and high-frequency RF circuit designs. Manufactured with exclusive specialized production techniques, the Wangling TF300 high frequency PCB maintains stable electrical performance across varying temperature and frequency conditions. Finished with immersion gold surface treatment and certified to IPC-Class-2 quality standards, each Wangling TF300 PCB undergoes 100% electrical testing before shipment, ensuring consistent quality and worldwide availability for aerospace, radar, satellite communication and antenna system applications.

 

2. Core Features

Wangling TF300 high frequency PCB inherits the full-spectrum superior characteristics of original TF300 ceramic-filled PTFE copper clad laminate. Firstly, the TF300 substrate supports adjustable dielectric constant ranging from 3 to 16 with outstanding stability, covering mainstream Dk values including 3.0, 6.0, 9.2, 9.6, 10.2 and 16, paired with extremely low dielectric loss for minimal high-frequency signal attenuation. Secondly, tailored for microwave and millimeter-wave circuit fabrication, the TF300 PCB delivers superior signal integrity and frequency stability for high-precision RF devices. Thirdly, it boasts an extended continuous operating temperature range from -80℃ to +200℃, providing reliable thermal stability for long-term high-temperature operation. Fourthly, the TF300 material supports flexible thickness customization from 0.635mm to 2.5mm, meeting diverse ultra-thin and standard high-frequency PCB design requirements. Fifthly, the substrate features excellent radiation resistance and low outgassing performance, perfectly adapting to harsh aerospace and space environment conditions. Sixthly, Wangling TF300 PCB supports standard thermoplastic processing methods, ensuring convenient fabrication, high production yield and lower manufacturing difficulty compared with traditional high-frequency substrates.

3. Product Benefits

Powered by authentic 0.635mm Wangling TF300 PTFE ceramic core material, this 2-layer high frequency PCB offers remarkable technical and commercial advantages for modern high-frequency electronic systems. The ultra-stable Dk/DF performance of TF300 material effectively reduces microwave and millimeter-wave signal loss, significantly improving signal transmission accuracy and consistency for radar, antenna and satellite communication devices. Its wide temperature resistance range and anti-radiation, low outgassing properties greatly enhance equipment reliability and service life in extreme aerospace and airborne working scenarios. Customizable thickness options enable flexible product design for lightweight and compact high-frequency equipment. Compatible with standard thermoplastic PCB fabrication processes, the TF300 PCB achieves higher production efficiency and yield rate while cutting overall manufacturing costs. With strict IPC-Class-2 quality compliance and comprehensive pre-shipment electrical testing, Wangling TF300 high frequency PCB provides stable, standardized and globally accessible high-frequency circuit solutions for industrial, military and aerospace fields.

4. PCB Construction Details

The complete structural, dimensional and process specifications of the Wangling TF300 2-layer high frequency PCB are summarized in the table below, covering substrate material, processing accuracy, surface treatment and quality inspection standards:

Specification Item	Detailed Parameters
Base Material	Wangling TF300 High Frequency Substrate
Layer Count	2 Layers (Rigid PCB)
Board Dimensions	70mm x 49mm (1PCS), Tolerance: +/- 0.15mm
Minimum Trace/Space	5/5 mils
Minimum Hole Size	0.3mm
Blind Vias Design	No Blind Vias
Finished Board Thickness	0.7mm
Finished Copper Weight (Outer Layers)	1oz (1.4 mils)
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Pre-Shipment Testing	100% Electrical Test

5. PCB Stackup Structure

This Wangling TF300 high frequency PCB adopts a standardized 2-layer rigid stackup structure with high-performance 0.635mm (25mil) TF300 core dielectric material, ensuring balanced electrical performance and structural stability for high-frequency signal transmission:

1. Copper_layer_1: 35 μm
2. TF300 Core: 0.635 mm (25mil)
3.  Copper_layer_2: 35 μm

6. PCB Statistical Parameters

Detailed component, pad and circuit network statistics of the finished Wangling TF300 high frequency PCB are listed below:

Components: 25

Total Pads: 66

Thru Hole Pads: 39

Top SMT Pads: 27

Bottom SMT Pads: 0

Vias: 16

Nets: 2

7. Artwork Supply Type

The design artwork for this TF300 high frequency PCB is provided in standard Gerber RS-274-X format, which is universally compatible with global professional PCB manufacturing equipment to ensure precise pattern replication and consistent production accuracy.

8. Quality Standard

All Wangling TF300 high frequency PCBs are manufactured and inspected in strict accordance with IPC-Class-2 industry quality standards, meeting the reliability requirements of industrial, aerospace and military high-frequency electronic devices.

9. Product Availability

Wangling TF300 2-layer high frequency PCB supports worldwide supply and distribution, delivering reliable high-frequency circuit board solutions for global electronic manufacturers and high-tech engineering projects.

10. Wangling TF Series Material Overview

Wangling TF series represents a high-end fiberglass-free high frequency substrate lineup, formulated with a premium composite of microwave-grade PTFE resin and high-purity ceramic materials. Without fiberglass cloth reinforcement, the TF series eliminates signal distortion caused by glass fiber weaving, achieving exceptional dielectric uniformity. The dielectric constant can be precisely tuned by adjusting the mixing ratio of ceramic fillers and PTFE resin. Adopting proprietary specialized manufacturing processes, Wangling TF series substrates deliver outstanding dielectric stability, ultra-low high-frequency loss and long-term working reliability, among which TF300 is the mainstream Dk3.0 grade widely applied in aerospace and radar high-frequency PCB fabrication.

11. Typical Applications

Benefiting from the ultra-low loss and high stability of Wangling TF300 core material, this 2-layer high frequency PCB is widely deployed in high-precision microwave and aerospace fields, including aerospace and airborne equipment, in-cabin aviation devices, microwave circuits, high-precision antennas, phase-sensitive antennas, early warning radars, airborne radar systems, phased array antennas, beamforming networks, satellite communication and navigation systems, and RF power amplifiers.

 

 

12. Wangling TF & TF300 Copper Clad laminate Knowledge

Wangling TF series copper clad laminate is a professional ceramic and PTFE composite dielectric substrate tailored for high-end high-frequency PCB manufacturing. This high-performance CCL is compounded with premium polytetrafluoroethylene (PTFE) resin featuring excellent microwave transmission performance and thermal resistance, paired with high-purity ceramic fillers. The substrate adopts a fiberglass-free structural design, completely avoiding signal distortion and performance fluctuations caused by glass fiber weaving. Through precise adjustment of the mixing proportion between ceramic components and PTFE resin, the TF series CCL achieves accurate and customizable dielectric constant, delivering outstanding dielectric stability and long-term operational reliability with exclusive specialized production technology. In terms of material classification, TF represents unclad smooth dielectric substrate without copper foil, TF-1 stands for single-sided copper clad laminate, and TF-2 refers to double-sided copper clad laminate, covering diverse customization demands for high-frequency PCB production. TF300 is the classic Dk3.0 mainstream grade of the TF series, widely used in microwave and aerospace high-frequency circuit fabrication.

 

 

1. Stable and Adjustable Dielectric Performance: The TF series CCL supports a dielectric constant range of 3 to 16 with extremely stable electrical performance. Commonly used fixed Dk specifications include 3.0, 6.0, 9.2, 9.6, 10.2, and 16, paired with ultra-low dielectric loss, ensuring minimal signal attenuation in high-frequency working environments.

2. Professional High-Frequency Application Orientation: As a dedicated high-frequency substrate, TF and TF300 copper clad laminate are specially developed for the fabrication of microwave and millimeter-wave printed circuits, perfectly adapting to high-precision RF and millimeter-wave electronic device requirements.

3. Superior Wide Temperature Resistance: Compared with conventional TP series substrates, TF series materials feature upgraded continuous operating temperature resistance. It can work stably for a long time within the temperature range from -80℃ to +200℃, providing more reliable thermal stability for high-temperature industrial and aerospace scenarios.

4. Diversified Thickness Customization: The TF300 substrate supports multiple thickness options ranging from 0.635mm to 2.5mm, covering ultra-thin, conventional and thick-board high-frequency PCB design needs.

5. Excellent Environmental Adaptability: The TF series CCL possesses reliable radiation resistance and low outgassing properties, making it suitable for harsh working conditions such as space, aviation and military environments.

6. Simple and Efficient PCB Processing: Wangling TF and TF300 copper clad laminate belong to thermoplastic materials, which can be processed by standard thermoplastic PCB manufacturing processes. The processing operation is simple and mature, with high production yield and low processing difficulty, greatly improving the production efficiency of high-frequency PCBs.

 

13. Product Summary

Wangling 2-layer TF300 high frequency PCB is a high-performance 0.7mm rigid circuit board based on 0.635mm TF300 ceramic-filled PTFE core copper clad laminate, engineered for microwave, millimeter-wave and aerospace-grade RF applications. Featuring stable Dk3.0 dielectric performance, ultra-low 10GHz dissipation factor, wide temperature adaptability and excellent radiation resistance, this immersion gold-finished TF300 PCB complies with IPC-Class-2 quality specifications. It overcomes the performance limitations of conventional FR-4 and ordinary high-frequency substrates, offering high machinability, low production cost and high yield rate. It serves as a reliable core circuit solution for radar, satellite communication, phased array antenna and aerospace electronic systems with stable global supply capacity.

 

14.Data Sheet of TF300