Rogers TMM13i 2-layer 20mil Laminate ENIG Finish High Frequency PCB for RF Microwave Satellite Communication Applications

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

1. Product Introduction

Rogers TMM13i 2-layer high frequency PCB is a premium isotropic thermoset microwave circuit board engineered for high-reliability radio frequency and microwave electronic applications. Manufactured with professional ceramic thermoset polymer composite materials, Rogers TMM13i printed circuit board perfectly combines the superior performance characteristics of ceramic substrates and PTFE substrates, delivering stable isotropic dielectric constant performance. Compatible with standard soft substrate processing technologies,  TMM13i  20mil microwave PCB supports precise plated thru-hole stripline and microstrip circuit designs, ensuring excellent processing feasibility and long-term operational stability for high-frequency circuit systems. Adhering to IPC-Class-2 manufacturing standards and adopting reliable ENIG surface finishing, the board undergoes 100% electrical testing before delivery to guarantee consistent product quality for global commercial and industrial high-frequency projects.

2. Core Product Features

1. Stable Dielectric Performance: Equipped with a fixed dielectric constant (Dk) of 12.85 +/- 0.35 and an extremely low dissipation factor of 0.0019 at 10GHz, TMM13i laminate ensuring minimal signal loss and stable high-frequency signal transmission.
2. Excellent Temperature Stability: Boasts a low thermal coefficient of Dk at -70 ppm/°K, effectively avoiding dielectric parameter drift caused by temperature changes and maintaining consistent circuit performance in variable thermal environments.
3. Copper-Matched Thermal Expansion: Features thermal expansion coefficients highly matched with copper materials within the temperature range of -55°C to 288°C, with X-axis and Y-axis at 19 ppm/°C and Z-axis at 20 ppm/°C, preventing board deformation and circuit failure caused by thermal expansion and contraction.
4. High Safety & Process Compatibility: Fully compatible with lead-free manufacturing processes and meets 94V-0 flammability standards, complying with mainstream environmental protection and safety specifications for electronic products.

3. Product Performance Benefits

1. Superior Mechanical Durability: The professional thermoset resin structure effectively resists creep and cold flow phenomena, maintaining stable mechanical dimensions and structural integrity during long-term service and repeated temperature cycling.
2. Strong Fabrication Resistance: The special composite material formula provides excellent resistance to various processing chemicals, greatly reducing board damage and performance attenuation during the PCB manufacturing process.
3. Simplified Plating Process: The substrate material eliminates the need for sodium napthanate pretreatment before electroless plating, simplifying the production process, improving production efficiency, and reducing manufacturing costs while ensuring plating quality.
4. Reliable Bonding Performance: Built on high-quality thermoset resin base material, TMM13i PCB board supports stable and reliable wire bonding processing, meeting the assembly requirements of high-precision electronic components.

4. PCB Construction Details

5. PCB Stackup Structure

This product adopts a standard 2-layer rigid PCB stackup structure with stable layered configuration, and the specific structure is as follows:

1. Copper_layer_1: 35 μm
2. TMM13i Substrate: 20mil (0.508mm)
3. Copper_layer_2: 35 μm

6. PCB Statistical Parameters

1. Total Components: 32
2. Total Pads: 54
3. Thru Hole Pads: 29
4. Top SMT Pads: 26
5. Bottom SMT Pads: 0
6. Total Vias: 38
7. Total Nets: 2

7. Production & Manufacturing Standards

1. Artwork Supply Format: Gerber RS-274-X
2. Manufacturing Acceptance Standard: IPC-Class-2
3. Supply Scope: Worldwide Supply & Service

8. Typical Application Scenarios

Benefiting from its ultra-low signal loss, stable dielectric performance and high structural reliability, Rogers TMM13i 2-layer high frequency PCB is widely used in various high-precision RF and microwave fields, including chip testers, dielectric polarizers, microwave lenses, radio frequency filters, couplers, RF and microwave circuitry systems, as well as satellite communication systems.

9. Rogers TMM13i Copper Clad Laminate (CCL) Knowledge

9.1 Rogers TMM13i CCL Introduction

Rogers TMM13i Copper Clad Laminate belongs to the premium thermoset microwave laminate series, adopting innovative ceramic-hydrocarbon-thermoset polymer composite formulation tailored for high-frequency PCB manufacturing. As the core base material of Rogers TMM13i 2-layer high frequency PCB, this professional microwave CCL is exclusively optimized for high-reliability plated thru-hole stripline and microstrip circuit applications in RF and microwave systems. It integrates the ultra-stable electrical performance of traditional ceramic substrates and the flexible, cost-effective processing advantages of soft substrates, effectively avoiding the complex, specialized production procedures required by conventional PTFE and pure ceramic dielectric materials. Featuring excellent process adaptability and consistent structural stability, the TMM13i thermoset CCL lays a solid material foundation for low-loss, high-precision microwave PCB circuits.

9.2 Rogers TMM13i CCL Core Properties

1. Balanced Composite Structure: Adopts a unique ceramic-hydrocarbon-thermoset composite structure that perfectly balances outstanding electrical insulation performance and durable mechanical stability, fully meeting strict high-frequency circuit operating requirements.
2. Superior Thermal Dielectric Stability: Comes with an ultra-low thermal coefficient of dielectric constant (below 30 ppm/°C), effectively suppressing dielectric parameter fluctuation caused by ambient temperature changes and ensuring long-term stable signal transmission of microwave PCBs.
3. Copper-Isotropic Thermal Expansion: Features isotropic thermal expansion coefficients highly matched with copper foil materials, greatly improving the reliability of plated through-hole structures and minimizing circuit shrinkage and deformation during etching and processing.
4. Efficient Thermal Conductivity: Delivers thermal conductivity nearly twice higher than traditional PTFE and ceramic composite laminates, enabling rapid heat dissipation for high-frequency operating circuits and preventing performance degradation caused by overheating.
5. Diversified Customization Options: Supports multiple dielectric constant specifications and diversified copper cladding configurations, covering electrodeposited copper foil weights from 1/2 oz/ft² to 2 oz/ft², and compatible with brass or aluminum base plate matching solutions.
6. Wide Thickness Adaptability: Provides substrate thickness ranging from 0.015 inches to 0.500 inches, flexibly adapting to diverse structural design and assembly demands of different microwave and RF PCB products.
7. Excellent Process Resistance: Possesses strong resistance to common PCB etching agents and organic solvents, fully compatible with mainstream printed wiring board (PWB) manufacturing processes to reduce processing damage.
8. 

9.3 Rogers TMM13i CCL Key Advantages

1. Universal High-Frequency Adaptability: Equipped with a complete range of stable dielectric constant options, it serves as an ideal single-material system solution for various high-frequency RF, microwave, and satellite communication circuit applications.
2. Permanent Mechanical Reliability: Premium thermoset composite structure effectively resists creep and cold flow under long-term high-temperature and high-load working conditions, maintaining stable board dimensions and structural integrity.
3. High PTH Structural Stability: Copper-matched CTE design eliminates thermal stress mismatch between the substrate and copper layer, significantly improving plated through-hole reliability and reducing circuit open/short failure risks.
4. Strong Fabrication Compatibility: Outstanding chemical resistance against PCB process chemicals minimizes material corrosion and surface damage during fabrication and component assembly, improving finished PCB yield.
5. Reliable Wire Bonding Performance: The thermoset resin base avoids substrate softening, pad lifting and structural deformation during wire bonding processes, supporting high-precision component packaging and assembly.
6. Simplified Production Process: No sodium napthanate pretreatment is required before electroless plating, eliminating complex pre-processing steps, shortening production cycles, and reducing manufacturing costs.
7. Superior Cost-Performance Replacement: TMM13i and TMM10i series laminates can perfectly replace traditional alumina substrates, delivering equivalent high-frequency performance with lower processing difficulty and comprehensive application costs.

9.4 TMM13i DataSheet

10. Product Summary

Rogers TMM13i 20mil high frequency PCB is a high-performance microwave circuit board customized for high-reliability RF and microwave application scenarios. With a 0.6mm finished thickness, 20mil TMM13i substrate and premium ENIG surface treatment, TMM13i PCB features stable Dk value, ultra-low dissipation factor and copper-matched thermal expansion performance. It combines excellent mechanical stability, chemical corrosion resistance and convenient processing characteristics, supporting lead-free production and reliable wire bonding. Compliant with IPC-Class-2 standards and fully tested electrically, this board provides durable, low-loss and high-precision circuit solutions for global high-frequency electronic and satellite communication equipment.