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Rogers CuClad 250 2-Layer 0.4mm Thick Immersion Gold High Frequency PCB Low DK Laminate for Radar and Microwave Components

Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.

 

1. Product Introduction

Rogers CuClad 250 PCB is a professional 2-layer rigid high frequency circuit board engineered for high-precision microwave and radio frequency electronic applications. CuClad 250 0.4mm finished thickness PCB adopts premium cross-plied woven fiberglass and PTFE composite laminate materials, featuring a optimized fiberglass and PTFE ratio to balance outstanding mechanical stability and consistent electrical performance. Manufactured in compliance with IPC-Class-2 quality standards and tested with 100% electrical testing before delivery, Rogers CuClad 250 PCB board applies reliable immersion gold surface finish to ensure excellent surface conductivity, oxidation resistance and assembly compatibility. With stable dielectric constant ranging from 2.40 to 2.55 at 10GHz, Rogers CuClad 250 2-layer PCB delivers minimal signal loss and uniform dielectric performance, making it a reliable worldwide available solution for modern high-frequency electronic circuit designs.

2. Core Product Features

Rogers CuClad 250 high frequency PCB integrates superior material characteristics and precise manufacturing processes to maintain stable performance in high-frequency working environments, with core technical features as follows:

  1. Stable Dielectric Constant (DK) of 2.4 to 2.55 at both 10GHz and 1MHz, ensuring consistent signal transmission performance across different frequency bands
  2. Ultra-low Dissipation Factor of 0.0017 at 10GHz, effectively reducing high-frequency signal attenuation
  3. Extremely low moisture absorption rate of 0.03%, avoiding performance changes caused by environmental humidity
  4. Reliable peel strength up to 14 lbs/in, ensuring firm bonding between copper layers and substrate
  5. Ultra-low outgassing performance with Total Mass Loss (TML) of 0.01%, Collected Volatile Condensable Material (CVCM) of 0.0% and zero Water Vapor Regain (WVR)
  6. Adopts cross-plied woven fiberglass structure with adjacent plies arranged at 90 degrees alternately for balanced structural performance
  7. High PTFE to glass ratio, optimizing the comprehensive electrical and mechanical properties of the substrate

3. Product Performance Benefits

Benefiting from the unique material formula and structural design of CuClad 250 substrate, CuClad 250 2-layer rigid PCB provides prominent practical advantages for high-frequency circuit design and production:

  1. The professional cross-plied structural design achieves balanced electrical and mechanical properties, avoiding unilateral performance deviation of the circuit board
  2. Low DK value supports wider line width design, effectively reducing signal insertion loss in high-frequency transmission
  3. Excellent low-loss characteristics greatly minimize circuit power loss and signal attenuation under high-frequency operating conditions
  4. Delivers more uniform dielectric constant performance than traditional non-woven fiberglass reinforced laminates, improving circuit stability
  5. Perfectly adaptable to dielectric constant-sensitive circuits, meeting the precision requirements of high-end microwave and RF electronic equipment

4. PCB Construction Details

Rogers CuClad 250 RF circuit board adopts standardized precision manufacturing parameters, with detailed construction specifications listed in the table below:

PCB Electrical Properties Tables
Click to expand/collapse the table
Item Specification
Board Dimensions 48.6 mm x 76.9 mm (1PCS), Tolerance: +/- 0.15mm
Minimum Trace/Space 4/6 mils
Minimum Hole Size 0.3mm
Blind Vias No Blind Vias Design
Finished Board Thickness 0.4 mm
Finished Copper Weight (Outer Layers) 1oz (1.4 mils)
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Top Silkscreen White
Bottom Silkscreen No Silkscreen
Top Solder Mask Blue
Bottom Solder Mask No Solder Mask
Pre-Shipment Inspection 100% Electrical Test

5. PCB Stackup Structure

This product is a 2-layer rigid PCB with stable and standardized stackup structure, adopting high-performance Rogers CuClad 250 core material, and the detailed layer structure is as follows:

  1. Copper_layer_1: 35 μm
  2. Rogers CuClad 250 Core: 0.254 mm (10mil)
  3. Copper_layer_2: 35 μm

6. PCB Statistical Parameters

Rogers CuClad 250 2-layer high frequency PCB has complete and standardized circuit layout parameters, covering components, pads, vias and nets:

  1. Components: 12
  2. Total Pads: 34
  3. Thru Hole Pads: 18
  4. Top SMT Pads: 16
  5. Bottom SMT Pads: 0
  6. Vias: 9
  7. Nets: 2

7. Artwork & Quality Standard

CuClad 250 high frequency PCB adopts standard Gerber RS-274-X artwork format, which is compatible with mainstream PCB processing and testing equipment in the industry. All products are manufactured and inspected in strict accordance with IPC-Class-2 quality standards, ensuring stable product quality, high dimensional accuracy and excellent working reliability. With global supply availability, CuClad 250 PCB can provide stable and compliant circuit board solutions for electronic manufacturers worldwide.

8. Typical Applications

With low dielectric loss, stable high-frequency performance and high structural stability, Rogers CuClad 250 PCB is widely used in high-precision microwave and radio frequency electronic fields:

  1. Radar Systems, Electronic Countermeasures, Electronic Support Measures Equipment
  2. Microwave Components including LNAs, Filters, Couplers and other high-frequency electronic parts

9.Knowledge of CuClad 250 Copper Clad Laminate

9.1 Brief Introduction of CuClad 250 Laminate

Rogers CuClad 250 laminate belongs to the premium PTFE and woven fiberglass composite copper clad laminate series, which is professionally developed and produced for high-frequency printed circuit board substrate applications. As a core substrate material for high-performance RF and microwave PCBs, CuClad® series laminates adopt accurate fiberglass and PTFE proportion control technology, enabling diversified performance matching for high-frequency circuit design. It covers multiple performance gradients from ultra-low dielectric constant and loss tangent to high-rigidity reinforced substrates with superior dimensional stability, perfectly adapting to different high-frequency electronic application scenarios.

Different from ordinary non-woven fiberglass reinforced PTFE laminates, the woven fiberglass reinforcement structure of CuClad 250 laminates delivers outstanding dimensional stability under the same dielectric constant specifications. Rogers’ precise processing technology for PTFE-coated fiberglass cloth realizes controllable and consistent material properties, endowing CuClad 250 PCB substrates with more uniform dielectric constant performance than peer non-woven fiberglass composite laminates. This unique material advantage makes the CuClad 250 substrate the preferred material for manufacturing high-precision microwave components such as radio frequency filters, couplers and low noise amplifiers (LNAs).

The most distinctive structural feature of CuClad 250 laminates is the cross-plied design, where adjacent PTFE-coated fiberglass plies are arranged at a 90° alternating orientation. This exclusive structure brings genuine electrical and mechanical isotropy in the XY plane, a core performance advantage that cannot be achieved by other woven or non-woven fiberglass reinforced PTFE laminates. This excellent isotropy performance is particularly critical for the design and production of high-end phased array antenna equipment, effectively improving the stability and accuracy of signal transmission.

Rogers CuClad 250 high-frequency laminates feature a relatively high fiberglass-to-PTFE ratio, bringing mechanical properties close to traditional mainstream PCB substrates. Rogers CuClad 250 material achieves all-round optimized performance with enhanced dimensional stability and reduced multi-directional thermal expansion, effectively avoiding circuit board deformation and performance deviation caused by temperature changes during operation. For ultra-high-precision and critical performance applications, CuClad 250 supports optional LX testing grade customization. LX-grade products undergo independent destructive testing for each substrate sheet with official test reports provided, ensuring ultra-reliable batch consistency for high-end industrial and military electronic projects (with a corresponding premium for customized LX-grade products).

 

9.2 Core Features & Advantages of CuClad 250 Laminates

  1. Unique cross-plied woven fiberglass structure with 90° alternating ply orientation for balanced overall performance
  2. Optimized high PTFE to glass ratio for ultra-low high-frequency signal loss
  3. Superior dielectric constant uniformity compared with conventional non-woven fiberglass reinforced laminates
  4. Genuine X-Y plane electrical and mechanical isotropy for stable omnidirectional signal transmission
  5. Extremely low dissipation loss, ideal for high-frequency microwave and RF circuit operation
  6. High adaptability for dielectric constant-sensitive precision circuits

9.3 Application Scenarios of CuClad 250 Laminates

  1. Military electronic equipment including radar systems, electronic countermeasures (ECM), and electronic support measures (ESM)
  2. High-precision microwave components such as low noise amplifiers (LNAs), radio frequency filters, and signal couplers

 

10.Rogers CuClad 250 Datasheet

Click to expand/collapse the table
Properties Test Method Condition Typical Value (Cuclad 250)
Dielectric Constant @10 GHz IPC TM-650 2.5.5.5 C23/50 2.40 to 2.55
Dielectric Constant @1MHz IPC TM-650 2.5.5.3 C23/50 2.40 to 2.60
Dissipation Factor @10 GHz IPC TM-650 2.5.5.5 C23/50 0.0017
Thermal Coefficient of Er (ppm/°C) IPC TM-650 2.5.5.5 Adapted -10°C to +140°C -153
Peel Strength (lbs per inch) IPC TM-650 2.4.8 After Thermal Stress 14
Volume Resistivity (MΩ·cm) IPC TM-650 2.5.17.1 C96/35/90 8.0 × 10⁹
Surface Resistivity (MΩ) IPC TM-650 2.5.17.1 C96/35/90 1.5 × 10⁸
Arc Resistance (seconds) ASTM D-495 D48/50 >180
Tensile Modulus (kpsi) ASTM D-638 A, 23°C 725, 572
Tensile Strength (kpsi) ASTM D-882 A, 23°C 26.0, 20.5
Compressive Modulus (kpsi) ASTM D-695 A, 23°C 342
Flexural Modulus (kpsi) ASTM D-790 A, 23°C 456
Dielectric Breakdown (kV) ASTM D-149 D48/50 > 45
Specific Gravity (g/cm³) ASTM D-792 Method A A, 23°C 2.31
Water Absorption (%) MIL-S-13949H 3.7.7 / IPC TM-650 2.6.2.2 E1/105 + D24/23 0.03
Coefficient of Thermal Expansion X-axis (0°C to 100°C) IPC TM-650 2.4.24 (Mettler 3000 TMA) 0°C to 100°C 18 ppm/°C
Coefficient of Thermal Expansion Y-axis (0°C to 100°C) IPC TM-650 2.4.24 (Mettler 3000 TMA) 0°C to 100°C 19 ppm/°C
Coefficient of Thermal Expansion Z-axis (0°C to 100°C) IPC TM-650 2.4.24 (Mettler 3000 TMA) 0°C to 100°C 177 ppm/°C
Thermal Conductivity ASTM E-1225 100°C 0.25 W/m·K
Outgassing – Total Mass Loss (%) NASA SP-R-0022A 125°C, ≤ 10⁻⁶ torr 0.01 (Max 1.00%)
Outgassing – Collected Volatile Condensable Material (%) NASA SP-R-0022A 125°C, ≤ 10⁻⁶ torr 0.00 (Max 0.10%)
Outgassing – Water Vapor Regain (%) NASA SP-R-0022A 125°C, ≤ 10⁻⁶ torr 0.00
Visible Condensate NASA SP-R-0022A 125°C, ≤ 10⁻⁶ torr NO
Flammability UL 94 Vertical Burn / IPC TM-650 2.3.10 C48/23/50, E24/125 Meets UL94-V0 requirements

 

11. Product Summary

Rogers  CuClad 250 2-Layer high frequency PCB is a high-performance rigid circuit board customized for high-frequency microwave and RF applications. Featuring 0.4mm ultra-thin finished thickness, immersion gold surface treatment, low DK (2.40-2.55) and ultra-low dissipation factor, CuClad 250 PCB board achieves balanced electrical and mechanical performance through cross-plied fiberglass structure. Rogers  CuClad 250 printed circuit board effectively reduces high-frequency signal loss, ensures excellent dimensional stability and environmental adaptability, and fully meets the strict quality requirements of IPC-Class-2. As a globally available high-frequency substrate solution, it is the ideal choice for precision radar devices and microwave component manufacturing.