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Newly Shipped RF PCB |
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The newly shipped PCB column is a collection of our various RF printed circuit boards (PCBs) that have been recently shipped to companies or individuals. In this column, you will find our latest PCB product series, newest technologies, and dynamic market trends. It provides opportunities for individuals or companies to discover new and interesting RF PCB products or technologies that may be useful for their own projects or applications. Hopefully you enjoy it and good luck. |
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| 6-Layer 1.6mm High Tg180°C ISOLA 370 HR High Frequency PCB FR-4 Material |
| Polyclad's 370HR laminates and prepregs employ a patented FR-4 epoxy resin system (Tg 180°C). Made with high-quality E-glass fabric, they offer superior CAF resistance, excellent thermal performance (low CTE), and good mechanical, chemical, and moisture resistance. Incorporated into many PCB designs, 370HR excels in thermal reliability, CAF performance, processing ease, and sequential lamination consistency. |
Tags:
| ISOLA 370 HR PCB |
ISOLA 370HR Datasheet |
ISOLA 370HR vs FR4 |
ISOLA 370HR Prepreg |
ISOLA 370HR Core Thickness |
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| 1.524mm 2-layer Fiberglass Cloth and PTFE Composites Wangling F4BM300 for Satellite Communications |
| Wangling's F4BM300 laminates enhance electrical performance over F4B300 with lower dielectric loss, higher insulation resistance, and improved stability. It can replace foreign equivalents. F4BM300 uses ED copper foil for non-PIM applications, while F4BME300 uses RTF copper foil for excellent PIM performance and lower conductor loss. Both control the dielectric constant precisely, balancing fiberglass for stability and slight loss increase. |
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| Wangling's F4BM300 Laminate |
Wangling's F4BM300 Material |
F4BM300 1.524mm Thickness |
F4BM300 Processing Guide |
F4BM300 PCB Density |
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| Customized Double Sided Wangling 5.08mm F4BTMS615 Material PCB HASL Surface Finish |
| The F4BTMS series improves upon the F4BTM with advanced materials and techniques. Ceramic and ultra-thin glass fiber cloth enhance performance, making it ideal for aerospace. It minimizes electromagnetic wave issues, reduces dielectric loss, and boosts electrical strength and thermal conductivity. RTF low roughness copper foil minimizes conductor loss, compatible with copper and aluminum bases. |
Tags:
| F4BTMS615 Core Thickness |
The F4BTMS Series PCB |
F4BTMS615 DK 6.15 |
Double Sided Wangling PCB |
5.08mm F4BTMS615 Laminate |
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| High Tg 175℃ 4-layer 1.6mm IT-180ATC Rigid PCB with Lead Free Assembly Process |
| The IT-180ATC is an advanced multifunctional filled epoxy boasting a high glass transition temperature of 175℃ as measured by DSC. It provides high thermal reliability and CAF resistance. This material is appropriate for various applications and can endure 260℃ lead-free assembly processes. |
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| IT-180ATC Dielectric Constant |
4-layer IT-180ATC PCB |
IT-180ATC Material |
1.6mm High Tg 175℃ Laminate |
IT180ATC Datasheet |
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| PTFE High Frequency PCB 2-layer 0.508mm 20mil RF-60TC DK6.15 Immersion Gold |
| RF-60TC, a high-frequency ceramic-filled, glass-reinforced PTFE laminate, has high thermal conductivity and is designed for high power RF/microwave applications. It cuts operating temps in high power cases and boosts gains/efficiencies in mini 6.15 DK antennas via better dielectric heat dissipation and low losses. Its enhanced heat transfer offers more design choices, extends component life, and lifts long-term reliability. Good adhesion to treated copper slashes insertion loss. Low CTE and improved stability let it build high-layer-count PCBs with reliable plated through-holes. |
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| RF-60TC PTFE laminate |
RF-60TC for RF//Microwave Application |
Taconic RF-60TC PCB |
RF-60TC RF PCB Design |
RF PCB Material |
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| Rogers RO3003 High Frequency PCB PTFE RF PCB 2.4mm Thick 1oz Copper Immersion Gold |
| Rogers RO3003 high-frequency laminates are ceramic-filled PTFE composites tailored for commercial microwave and RF applications. They offer excellent stability in dielectric constant (Dk) across various temperatures and frequencies, eliminating the step change typical in PTFE glass materials. This makes them ideal for automotive radar (77 GHz), advanced driver assistance systems (ADAS), and 5G wireless infrastructure (mmWave). |
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| HighTd500°C RO3003 |
Ceramic-filled PTFE Composites |
Rogers RO3003 Datasheet |
Low Dielectric Loss PCB |
Stable DK Laminate |
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| RF PCB 5mil Rogers RO3006 Ceramic-filled PTFE Composites Coating with Immersion Silver |
| The Rogers RO3006 laminates are ceramic-reinforced PTFE composites specifically designed for commercial microwave and RF uses. They exhibit exceptional electrical and mechanical stability, maintaining a uniform dielectric constant (Dk) across various temperature ranges. This prevents the abrupt change in Dk often seen in PTFE glass materials near room temperature. |
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| 5mil Rogers RO3006 PCB |
RO3006 RF Circuit Board |
Rogers RO3006 Price |
Rogers RO3006 Core Thickness |
Rogers 3006 DK |
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| Double layer 8mil RO4003C DK3.38 Woven Glass Reinforced Hydrocarbon/Ceramics Laminate |
| The Rogers RO4003C laminates are woven glass reinforced hydrocarbon/ceramics, combining PTFE performance with epoxy/glass manufacturability. Offered in 1080 and 1674 glass fabric, they provide precise dielectric constant control and low loss, cutting costs without special treatments.Non-brominated and not UL 94 V-0 rated, RO4003C matches copper's thermal expansion, ensuring stability and reliable plated through-holes, with a Tg over 280°C (536°F). |
Tags:
| RO4003C Dielectric Constant |
Rogers RO4003C Low Tangent |
RO4003C Material |
Rogers RO4003C Substrate |
RO4003C Datasheet |
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| Rogers RO4350B High-frequency Laminate 0.338 mm 13.3mil Immersion Gold Circuit Board |
| The Rogers RO4350B materials are woven glass reinforced hydrocarbon/ceramics that provide electrical performance similar to PTFE while being easily manufacturable like epoxy/glass. Cost-effective and requiring no special treatments, these UL 94 V-0 rated laminates ensure tight control over dielectric constant and low loss. With a thermal coefficient of expansion matching copper, they offer excellent dimensional stability and reliable plated through-hole quality, maintaining stability with a Tg over 280°C (536°F). |
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| Rogers RO4350B Price |
High Tg 280°C RO4350B PCB |
RO4350B Thickness |
RO4350B PCB Material |
RO4350B Lopro |
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| RO4535 PCB 20mil Rogers 2-layer Substrates High Frequency Laminate for Microstrip Antennas |
| RO4535 High Frequency Laminates from Rogers Corporation are tailored for the antenna market, enhancing the RO4000 series. This ceramic-filled, glass-reinforced hydrocarbon material offers low loss and excellent passive intermodulation response for microstrip antennas. Compatible with FR-4 and high-temperature lead-free solder, they require no special PTFE treatments, providing a cost-effective alternative. Additionally, they feature RoHS-compliant flame-retardant technology for UL94 V-0 certification. |
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| RO4535 PCB Density |
2-layer RO4535 Substrates |
RO4535 PCB Layout |
20mil RO4535 laminate |
Rogers RO4535 Prepreg |
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| Rogers High Frequency Made on RT/duroid5880 2-layer 0.381mm 15mil DK2.2 PCB |
| Rogers RT/duroid 5880 high-frequency laminates are PTFE composites reinforced with glass microfibers for stripline and microstrip applications. The microfibers provide excellent dielectric constant uniformity, stable across panels and frequencies. With a low dissipation factor, they suit Ku-band and beyond. Easy to cut and machine, they resist solvents and reagents used in circuit etching and plating. |
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| RT/duroid 5880 Substrate |
RT/duroid 5880 Online Purchase |
RT/duroid 5880 Thickness |
Rogers RT/duroid 5880 Datasheet |
RT/duroid 5880 Price |
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| RT/duroid 6035HTC High Frequency PCB with Green Solder Mask Coating Immersion Silver |
| Rogers RT/duroid 6035HTC high-frequency circuit materials are ceramic-filled PTFE composites designed for high-power RF and microwave applications. With thermal conductivity nearly 2.4 times that of standard RT/duroid 6000 products, they feature copper foil (ED and reverse treat) for excellent long-term thermal stability. Additionally, Rogers' advanced filler system enhances drillability, lowering drilling costs compared to standard laminates using alumina fillers. |
Tags:
| Rogers RT/duroid 6035HTC |
6035HTC for RF/Microwave |
Loss Tangent 6035HTC |
RT/duroid 6035HTC Specifications |
6035HTC Laminate |
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| Customized Double Sided 0.127 mm 5mil TFA294 Material PCB ENEPIG Surface Finish |
| The TFA series Polytetrafluoroethylene ceramic composite substrate features a PTFE resin and ceramic dielectric layer made via a novel lamination process, avoiding traditional glass fiber methods. This yields superior electrical, thermal, and mechanical properties, achieving aerospace-grade dielectric constants. Lacking glass fiber, it uses uniform nano-ceramics mixed with resin, ensuring excellent frequency stability and minimal dielectric loss. The material also has low X/Y/Z anisotropy and a thermal expansion coefficient akin to copper foil. |
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| Minimal Dielectric Loss PCB |
TFA294 Laminate Datasheet |
The TFA series substrate |
5mil TFA294 Thickness |
High Frequency PCB |
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| TLX Serie 2-layer Low DK2.55 Taconic TLX-8 High Frequency PCB 30mil Immersion Gold |
| TLX-8, a PTFE fiberglass laminate, is reliable in RF applications. Versatile with various thicknesses and copper cladding options, it's ideal for low layer count microwave designs. It reinforces substrates in harsh environments like high-vibration space launches, high-temperature engine modules, space radiation, extreme marine conditions, and wide temperature ranges in flight. |
Tags:
| TaconicTLX-8 Thickness |
TLX-8 RF Microwave PCB |
The TLX Serie PCBs |
TLX-8 Immersion Gold Laminate |
TLX-8 PCB Layout |
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| TU-768 High Tg180 High Frequency 60mil Double Sided PCB with HASL and Green Solder Mask |
| TUC's TU-768 and TU-768P laminates/prepregs are made of high-quality woven E-glass and epoxy resin. They have UV-blocking and AOI compatibility. Ideal for boards in harsh conditions. TU-768 shows excellent CTE, chemical resistance, thermal stability, and CAF resistance. |
Tags:
| TU-768 Datasheet |
TUC's TU-768 PCB Material |
TU-768 High Tg180 |
TU-768 Material Datasheet |
TU-768 vs FR4 |
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