1. Introduction of TLX-8

TLX-8 is a type of PTFE fiberglass laminate, recognized for its reliability across various RF applications. This versatile material is available in a range of thicknesses and copper cladding options, making it ideal for low layer count microwave designs. It provides mechanical reinforcement in substrates that must withstand harsh environments, such as:

- Resistance to creep in printed wiring boards (PWBs) that are bolted to housings subject to high vibration during space launches

- Endurance against high temperatures in engine modules

- Radiation resistance for use in space (refer to NASA’s guidelines on low outgassing materials)

- Durability in extreme marine conditions for warship antennas

- Resilience across a wide temperature range for altimeter substrates during flight.

2. Benefits

- Outstanding PIM values in PCBs, measured at less than -160 dBc

- Exceptional mechanical and thermal properties

- Low and stable dielectric constant (Dk)

- Dimensionally stable

- Minimal moisture absorption

- Tightly controlled dielectric constant

- Low dielectric loss (DF)

- UL 94 V0 rated

- Ideal for low layer count microwave designs

3. Main Properties

- Electrical Properties

Dielectric Constant @ 10 GHz - 2.55 ± 0.04 - IPC-650 2.5.5.3

Dissipation Factor @ 10 GHz - 0.0018 - IPC-650 2.5.5.5.1

Surface Resistivity Elevated Temp. 6.605 x 10^8 Mohm IPC-650 2.5.17.1 Sec. 5.2.1

Surface Resistivity Humidity Cond. 3.550 x 10^6 Mohm IPC-650 2.5.17.1 Sec. 5.2.1

Volume Resistivity Elevated Temp. 1.110 x 10^10 Mohm/cm IPC-650 2.5.17.1 Sec. 5.2.1

Volume Resistivity Humidity Cond. 1.046 x 10^10 Mohm/cm IPC-650 2.5.17.1 Sec. 5.2.1

- Dimensional Stability

MD After Bake 0.06 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.4

CD After Bake 0.08 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.4

MD Thermal Stress 0.09 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.5

CD Thermal Stress 0.10 mm/M (mils/in) IPC-650 2.4.39 Sec. 5.5

- CTE (25-260 °C)

X - 21 ppm/°C - IPC-650 2.4.41/ASTM D 3386

Y - 23 ppm/°C - IPC-650 2.4.41/ASTM D 3386

Z - 215 ppm/°C - IPC-650 2.4.41/ASTM D 3386

- Td

2% Weight Loss - 535 °C - IPC-650 2.4.24.6 (TGA)

5% Weight Loss - 553 °C - IPC-650 2.4.24.6 (TGA)

-Chemical / Physical Properties

Moisture Absorption - 0.02 % IPC-650 2.6.2.1

Dielectric Breakdown - > 45 Kv - IPC-650 2.5.6

Flammability Rating - V-0 - UL-94

4. PCB Stackup: 2-layer rigid PCB

Copper_layer_1 - 35 μm

Taconic TLX-8 Core - 0.762 mm (30mil)

Copper_layer_2 - 35 μm

6. PCB Statistics:
Components: 26

Total Pads: 48

Thru Hole Pads: 25

Top SMT Pads: 23

Bottom SMT Pads: 0

Vias: 32

Nets: 2