"Via plating thickness" refers to the thickness of the copper plating on vias. The walls of vias need to be copper - plated. This is because copper is an excellent conductive material. Copper plating ensures that vias have good electrical conductivity, thus guaranteeing that signals and power can be smoothly transmitted between different layers.
Minimum Space refers to the minimum distance between adjacent copper traces, adjacent pads, or between pads and traces, typically measured in mils or millimeters.Factors Affecting Minimum Space: Signal Crosstalk Smaller spacing increases the risk of crosstalk due to electromagnetic field coupling, especially in high-frequency or high-speed digital circuits.
Minimum trace width refers to the minimum width of the copper conductor on a PCB. The dimension of the copper conductor is measured on the horizontal plane and is usually in units of mils or millimeters.Trace width determines safe current - carrying. Empirical formula shows 1oz copper, 1mm inner - layer width ≈ 1A.
TCK, namely Trace Characteristic Key, refers to the key indicators of circuit characteristics, covering multiple professional parameters such as impedance matching, signal transmission rate, and attenuation characteristics. These parameters work in concert to precisely control the transmission behavior of high-frequency signals on PCB circuits.
In the field of high-frequency PCBs, specific gravity is a crucial and specialized physical parameter. It specifically refers to the ratio of the mass of a PCB material to its occupied volume, which directly reflects the material's density characteristics and the performance it exhibits as a result.
Specific Heat Capacity generally refers to the ability of PCB materials to absorb, conduct, and release heat under specific conditions. This ability is not only determined by the material's physical properties such as thermal conductivity and coefficient of thermal expansion, but is also influenced by the PCB's structure, layout, and operating environment.
The question "What is Arc Resistance in high-frequency PCB?" delves into the heart of the electronics industry. Arc resistance, in simple terms, is the ability of a PCB to resist arc discharge during high-frequency signal transmission, which is crucial for the stability and safety of high-speed signal processing.
In high-frequency PCBs, the flexural modulus is crucial. It’s a material mechanics parameter quantifying material rigidity, showing the inherent ability to resist bending under force. It dictates PCB stability, and insufficient modulus leads to bending, harming high-frequency signal transmission, which is vital especially in 5G.
Flexural strength refers to the ability of a PCB to withstand bending forces without breaking or deforming. It is a fundamental property that ensures the physical integrity of the PCB during handling, installation, and operation.
Tensile modulus measures a material's stiffness under tensile stress and reflects its deformation ability. In high-frequency PCBs, it's a crucial parameter for evaluating material performance, influencing the mechanical and electrical performance of the board.
April 24. 2025
