When it comes to Polyimide, we have to mention Rigid Flex PCB. Let's take the 14-Layer R-F777 Polyimide and S1000- 2M FR-4 PCB as an example to conduct an advantage analysis.
4.1 Outstanding High-Temperature Resistance
This PCB material incorporates Polyimide, and the Tg value of the board material reaches 170℃. This demonstrates its ability to maintain stable performance in high-temperature environments, fulfilling the demands of application scenarios requiring high heat resistance.
4.2 Rigid-Flex Design Advantages
With a board thickness combining a 2.0mm rigid part and a 0.21mm flexible part (Rigid-Flex PCB), it balances rigid support and flexible bending properties. This makes it suitable for complex electronic devices with strict requirements for spatial layout and structural flexibility.
4.3 Superior Surface Finishing
Using the Immersion Gold surface finish, the gold thickness reaches 0.03μm (minimum), and the nickel thickness is 2–4μm. These parameters effectively enhance the electrical conductivity, corrosion resistance, and soldering reliability of electrical connections.
4.4 Compliant Flame-Retardant Performance
With a flammability rating of 94-V0, it meets the stringent fire-safety requirements for electronic devices, reducing fire risks during operation.
4.5 Robust Reliability Verification
It has passed the Thermal Shock Test (-25℃±125℃, 1,000 cycles) and Thermal Stress Test (300±5℃, 10 seconds, 3 cycles, with no delamination or blistering). These results prove its structural stability under extreme temperature fluctuations and strong durability. |
