| |
|
|
|
|
|
|
|
|
| |
|
| Rigid-flex PCB |
| |
|
Rigid-flex PCBs are a remarkable innovation in the field of electronics. They merge the stiffness of rigid PCBs and the pliability of flexible circuits. This combination allows for complex designs that can conform to the unique shapes and requirements of modern electronic devices. Rigid-flex PCBs offer enhanced durability as they can better withstand vibrations and impacts. They also enable more efficient space utilization within devices. In aerospace applications, these boards contribute to weight reduction and improved reliability. In the medical field, they can be integrated into wearable devices, providing both functionality and comfort. Additionally, their ruggedness makes them highly valued in military applications, where resilience in harsh environments is critical. |
|
|
.JPG) |
|
| |
|
 |
| 1.5mm-FR4-and-0.16mm-Polyimide-4-Layer-Flex-Rigid-PCB-With-Immersion-Gold-and-Green-Solder-Mask-for-Control-Modules
|
| Tg170℃ FR-4 is a high-performance 4-layer rigid-flex PCB that integrates the strengths of rigid PCBs and flexible FPCs. It is specifically engineered for applications requiring high-density wiring, vibration and bending resistance, and compact space utilization. The board features a composite structure of Tg170℃ FR-4 rigid substrate and Polyimide (PI) flexible substrate, complemented by electroless nickel immersion gold (ENIG) surface treatment to ensure high reliability, high-temperature resistance, and superior electrical performance. |
Tags:
1.5mm FR4 PCB |
Tg170 FR-4 ENIG PCB |
Tg170℃ FR-4 Rigid Substrate |
4-Layer Flex Rigid PCB |
Tg170 FR-4 Datasheet |
|
|
| |
|
 |
| 6-Layer-Rigid-Flex-PCB-Built-on-FR-4-and-Polyimide-With-Immersion-Gold-and- 90ohm-Impedance-Control-from-Shengyi |
| FR-4 and poyimide rigid-flexible printed circuit board is specifically designed for automotive GPS tracking devices, featuring a 6-layer construction with a total thickness of 1.4mm. The inner layers utilize half-ounce copper foil, while the outer layers employ 1-ounce copper. The design incorporates impedance-controlled routing on both the outer layers and the internal flexible circuitry to ensure signal integrity. |
Tags:
90ohm Impedance Control PCB |
Shengyi FR-4 and polyimide Laminate |
6-Layer FR-4 and Polyimide |
1.4mm Rigid Flex PCB |
Tg170 FR-4 Substrate |
|
|
| |
|
.jpg) |
| Low-Cost-FR-4-and-Polyimide-Based-8-Layer-Rigid-Flex-PCB-with-Immersion-Gold-and-50ohm- Impedance-Control |
| This FR-4 and polyimide based rigid - flex PCB is specifically designed for car tracker GPS applications. It features an 8 - layer build - up structure. The rigid part has a thickness of 2.0mm, while the flexible part is 0.24mm thick. The inner layers use half - ounce copper, and the outer layers are made of 1 - ounce copper. In the inner flexible circuit, an impedance - controlled design is adopted to ensure stable electrical performance.The base laminates of this PCB are sourced from Shengyi and Thinflex. |
Tags:
FR-4 and Polyimide Based PCB |
50ohm Impedance Control PCB |
PCB for GPS Applications |
High Tg FR-4 PCB |
8-Layer Rigid Flex PCB |
|
|
| |
|
 |
| 10-Layer-Rigid-Flex-PCBs-Tg170-FR-4-and-50μm-Polyimide-with-Matte-Black-Solder-Mask-and-Immersion-Gold-for-Telemetry-Systems |
This 10-layer rigid-flex PCB employs a robust architecture, integrating high-Tg170 FR-4 rigid substrates with 50μm polyimide flexible layers. Engineered for high-density interconnections and extreme environmental stability, it delivers reliable performance in demanding applications including industrial automation, telecom infrastructure, and aerospace systems. |
Tags:
Multi-Layer Rigid Flex PCBs |
High-Tg FR-4 High Frequency PCB |
Tg170 FR-4 and 50um Polyimide |
FR-4 Black Solder Mask PCB |
10-layer FR-4 Substrate |
|
|
| |
|
 |
| Innovative-50um-Polyimide-Tg170-FR4-12-Layer-Flex-Rigid-PCB-with-Immersion-Gold-for-Efficient-WiFi-Router-Design |
| This high-performance circuit board utilizes non-flowing 1080 Prepreg combined with high Tg170℃ FR4 substrate to deliver exceptional thermal stability and mechanical reliability in demanding operating conditions. The integration of Panasonic R-F777 Polyimide ensures superior flexibility in the bending sections while maintaining precise board thickness control and consistent impedance characteristics, making it ideal for applications requiring uncompromising signal integrity. |
Tags:
12-Layer Flex Rigid PCB |
FR-4 High Speed PCB |
High Tg170℃ FR4 Laminate |
Tg170 FR-4 Online Purchase |
Tg170 FR-4 Material |
|
|
| |
|
.jpg) |
| 14-Layer-Rigid-Flex-PCB-R-F777-Polyimide-and-S1000-2M-FR-4-High-Density-and-High-Reliability-for-Demanding-Robotic-Applications |
| This 14-layer rigid-flex PCB integrates polyimide (PI) flexible substrates with FR-4 rigid boards, engineered for high-density interconnects, dynamic flexing, and complex spatial configurations. Featuring an optimized symmetrical structure with three independent flex zones, it delivers both the mechanical stability of rigid PCBs and the adaptable mounting benefits of flexible circuits. The design meets stringent reliability requirements for industrial automation systems, medical devices, automotive electronics, and aerospace applications. |
Tags:
14-Layer Rigid Flex PCB |
R-F777 Polyimide and S1000-2M FR-4 |
PCB for ADAS systems |
High-reliability PCB |
R-F777 and S1000-2M FR-4 Substrate |
|
|
| |
|
|
|
|
|
|
|
|
|
|
