(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

Tg170℃ FR-4 is a high-performance 4-layer rigid-flex PCB that integrates the strengths of rigid PCBs and flexible FPCs. It is specifically engineered for applications requiring high-density wiring, vibration and bending resistance, and compact space utilization. The board features a composite structure of Tg170℃ FR-4 rigid substrate and Polyimide (PI) flexible substrate, complemented by electroless nickel immersion gold (ENIG) surface treatment to ensure high reliability, high-temperature resistance, and superior electrical performance. It is ideal for use in precision electronic devices, wearable technology, and medical instruments.

1. Structural Design

• 4-layer Rigid-Flex PCB: 2 layers of rigid PCB (FR-4) + 2 layers of flexible FPC (PI).

• Thickness:

• Rigid PCB part: 1.50mm (finished board thickness).

• Flexible FPC part: 0.16mm.

• Copper Thickness: 1oz (35μm) per layer to ensure high current-carrying capacity.

2. Surface Treatment and Appearance

Solder Mask: Green (reflective finish, enhancing aesthetics).

Silkscreen Marking: White (clear and legible markings).

FPC Coverlay: Yellow (protective layer with bend resistance and anti-oxidation properties).

Surface Finish: Electroless nickel immersion gold (ENIG) (provides strong oxidation resistance and supports high-precision soldering).

3. Dimensions and Panelization

Unit Size: 125.60mm × 45.60mm (single piece).

Panel Layout:

Panel Dimensions: 191.20mm × 116.60mm (including process margin).

Units per Panel: 3 pieces (1 set).

Process Margin Specifications:

Incorporates 3 optical positioning points (to facilitate automated placement).

4. Via Filling and Capping Process Via Diameter: 0.2mm (micro-via design, optimized for high-density circuits).

Via Plating Method: Resin filling + electroplating (ensures a smooth surface and prevents solder penetration).

1. Serial Number Marking

Format: Week/Year + Serial Number (e.g., 1025-0001, representing production in the 10th week of 2025).

Location: Placed on the process margin or in a designated area to ensure traceability.

2. Quality Control

100% Electrical Testing (ET Testing): Ensures conductivity and insulation performance meet specifications.

Compliance: Adheres to IPC-A-600 Class 2 standards (industrial-grade reliability).

• Consumer Electronics: Foldable screen devices, smartwatches, TWS earphones.

• Industrial Equipment: Sensors in high-vibration environments, robot control modules.

• Medical Instruments: Portable monitoring devices, endoscopes.

• Automotive Electronics: Onboard cameras, flexible display modules.

• Standard Delivery: 1SET (3 pcs/panel), vacuum anti-static packaging.

• Customization Options: Support batch panelization optimization and special marking customization.