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| Hybrid PCB |
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Hybrid PCBs constitute a remarkable integration of diverse PCB technologies by integrating the strengths of both rigid and flexible PCBs. This innovative combination enhances flexibility and durability, making hybrid PCBs ideal for a wide range of applications across various industries, including automotive, aerospace, and medical sectors. Their ability to efficiently manage high-speed signals and power makes them particularly suitable for complex electronic systems that demand reliability and performance. What’s more, hybrid PCBs enable designers to create more compact and efficient devices, effectively reducing both size and weight. This capability is crucial in today's market, where miniaturization and efficiency are paramount. |
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| 1.2mm-Hybrid-PCB-Mixed-Material-Circuit-Board-Combining-RO4350B, FR4-and-RT-Duroid- 5880-with-Immersion-Gold |
we’re diving into the world of hybrid PCBs, which primarily involve combining high-frequency materials with traditional epoxy glass. This unique mix allows for optimized performance in advanced applications.The hybrid PCB features Layer 1 to Layer 2 made from RO4350B high-frequency material for optimal signal performance, while Layer 3 to Layer 4 utilizes FR-4 epoxy glass for structural support. These two cores are securely bonded together using a layer of adhesive prepreg, ensuring a durable and reliable connection. |
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| RO4350B FR4 Hybrid PCB |
Hybrid RO4350B FR4 Circuit Board |
Hybrid Design Blind Via Circuit Board |
Hybrid PCB Mixed Circuit Board |
RO4350B 5880 Blind Via PCBManufacturing |
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| 13.3mil-RO4350B-and-31mil-RT/Duroid-5880-3-Layer-Hybrid-RF-PCB-High-Frequency-with-Advanced-Performance-and-Reliability |
| Hybrid PCBs can combine FR-4 with high-frequency materials or mix high-frequency materials with different dielectric constants (DK), such as RT/duroid 5880 PCB and RO4350B PCB. We’ll focus on a specific hybrid high-frequency PCB constructed using 13.3mil (0.338mm) RO4350B and 31mil (0.787mm) RT/duroid 5880, a design specifically tailored for multi-coupler antenna applications. |
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Microwave Printed Circuit Boards |
Hybrid PCB Material |
Multilayer Printed Circuit Board |
RT/Duroid 5880 Hybrid PCB |
RO4350B Frequency PCB |
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| 0.2mm-FR-4-and-8mil-0.203mm-Rogers-RO4003C-Hybrid-Multilayer-High-Frequency-PCB-with-Superior-Capabilities |
| A 4-layer hybrid PCB with a total thickness of 1.1mm, built using 8mil (0.203mm) RO4003C and FR-4 materials, features a blue solder mask, immersion silver finish on the pads, and 1oz copper on each layer. This is a straightforward multilayer PCB with a hybrid structure, manufactured in compliance with IPC 6012 Class 2 standards based on provided Gerber files. Each board undergoes 100% electrical testing before delivery, and shipments are packed in sets of 25 boards. |
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Hybrid PCB Board |
RO4003C High Frequency PCB |
8mil RO4003C PCB |
8mil FR-4 PCB |
4 Layer Hybrid PCB |
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| 4-Layer-12mil-Rogers-RO4003C-and-FR-4-High-Frequency-Hybrid-PCB-Mixed-Material-Board-for-Antenna-Combiner |
| This 4-layer high-frequency PCB is constructed using a combination of 12mil RO4003C and FR-4 materials, offering a balance of simplicity and cost-effectiveness, making it an ideal choice for expanding into new market opportunities. The 12mil RO4003C hybrid PCB is widely used in various applications, including modular oscilloscopes, antenna combiners, balanced amplifiers, 4G antennas, and more. |
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| 4 Layer RO4003C Hybrid PCB |
12mil RO4003C PCB |
12mil FR-4 PCB |
Rogers RO4003C Hybird Material |
Multi-layer Board Designs |
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| 20mil-Rogers-RO4003C-PCB-and-0.75mm-FR-4-Hybrid-Multi-layer-PCB-Precision-Engineered-for-RF-Applications |
This Hybrid PCB features a 4-layer structure. The 1st to 2nd layers consist of a 20mil RO4003C core, serving as the primary wiring layer for signal lines. The 3rd to 4th layers are built on an FR-4 core, with both cores bonded together using 0.2mm prepreg. Each layer is interconnected via plated through holes, and both inner and outer layers have a copper weight of 1 ounce. This design ensures a cost-effective solution without compromising performance. |
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| High Performance RO4003C PCB |
4-layer RO4003C Substrate |
20mil Rogers High Frequency PCB |
Rogers RO4003C Datasheet |
Rogers RO4003C Hybrid PCB |
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| 10mil-Rogers-RO4350B-and-FR-4-Hybrid-Mixed-Material-PCB-with-Depth-Controlled-Drill-for-GPS-Antenna |
| The 10mil RO4350B hybrid PCB has a broad range of applications, including preamplifiers, radar sensors, digital transmitters, and splitter modules; GPS antennas, communication relays, analog transmitters, and 4G antennas; as well as RF transmitters, WiFi amplifiers, RFID systems, and attenuators. RO4350B delivers stable dielectric performance, superior signal integrity, cost efficiency, and expert manufacturing support, making it the ideal choice for high-quality, reliable PCBs tailored to your needs. |
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10 Mil Multilayer Hybrid PCB |
Mixed Material RO4350B FR-4 PCB |
4 Layer Rogers RO4350B FR4 Hybrid Board |
RO4350B FR4 Hybrids Printed Circuit Board |
Hybrid PCB Mixed Structure PCB |
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| 20mil-Rogers-RO4350B-and-FR4-4-Layer-Hybrid-Mixed-Material-PCB-with-Blind-Via-and-Immersion-Gold |
| The 20mil RO4350B FR4 4-Layer Hybrid PCB combines exceptional thermal stability, broadband performance, and enhanced signal integrity, making it ideal for temperature-sensitive and high-frequency applications. With a stable dielectric constant across a wide frequency range, it outperforms traditional FR4 stack-ups, ensuring superior signal performance. Manufactured in ISO9001, ISO14001, IATF16949, and UL-certified facilities, it guarantees top-tier quality. From prototyping to mass production, this PCB offers scalable solutions to meet diverse project demands. |
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20 mil RO4350B FR4 Hybrid PCB |
Hybrid PCB Mixed Circuit Board |
RO4350B Blind Via PCB Manufacturing |
Hybrid RO4350B FR4 PCB |
Hybrid Design Blind Via Circuit Board |
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| 5-Layer-10mil-Rogers-RO4350B-and-FR-4-Hybrid-RF-Circuit-Board-High-Frequency-PCB-for-2.4 Ghz-Antenna |
| This 5-layer PCB crafted with a combination of RO4350B high-frequency material and epoxy glass FR-4. Designed specifically for 2.4 GHz antenna applications, this board features a 1.0 mm thickness with plated through holes. Both sides are coated with a green solder mask, while the pads are finished with immersion gold for enhanced durability. Manufactured in compliance with IPC 6012 Class 2 standards using provided Gerber files, each shipment is carefully packed in sets of 25 boards. |
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Rogers RO4350B PCB Datasheet |
5-Layer Rogers RO4350B Hybird PCB |
Multilayer Hybrid RO4350B FR-4 PCB |
Hybrid RO4350B PCB Online Purchase |
Hybrid RO4350B Substrate |
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| 4-Layer-16mil-Rogers-RO4003C-and-FR4-Hybrid-RF-and-High-Frequency-Circuit-Boards-with-Immersion-Tin |
| The 16mil RO4003C and FR-4 hybrid PCB leverages the stable dielectric constant of RO4003C across a wide frequency range, making it an excellent choice for broadband applications. By minimizing signal loss in high-frequency scenarios, it aligns perfectly with the evolving demands of modern communication technology. Additionally, the hybrid stack-up combines RO4003C with cost-effective FR-4 materials, significantly reducing overall expenses compared to designs that rely entirely on low-loss materials. |
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Hybrid High Frequency PCB |
RO4003C FR4 Hybrid PCB |
16 Mil Hybrid RF Circuit Boards |
Hybrid Immersion Tin Circuit Boards PCB |
16 Mil Mutilayer4-Layer Hybrid PCB |
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| 6-Layer-Rogers-RO3003-RF-PCB-with-FastRise-28-Prepreg--Superior-High-Speed-Signal-Transmission, Cost-Effective-Solution |
| Rogers RO3003 high-frequency PCB materials are advanced ceramic-filled PTFE composites specifically engineered for commercial microwave and RF applications. Designed to deliver outstanding electrical and mechanical stability at cost-effective prices, these materials ensure consistent mechanical properties, enabling designers to create multi-layer board designs without issues like warping or reliability concerns. |
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FastRise-28 Prepreg Circuit Board |
6-Layer Rogers RO3003 PCB |
RO3003 FR-28 Prepreg PCB |
FastRise-28 Prepreg Printed Circuit Board |
FastRise™28 Multilayer PCB Board |
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