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4-Layer-12mil-Rogers-RO4003C-and-FR-4-High-Frequency-Hybrid-PCB-Mixed-Material-Board-for-Antenna-Combiner |
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(As PCBs are custom - produced goods, the picture and parameters shown are only intended for reference.) |
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Hi Everyone,
Today, we’ll explore a 4-layer high-frequency PCB constructed using a combination of 12mil RO4003C and FR-4 materials.
This board is designed as a 4-layer structure, as it offers a balance of simplicity and cost-effectiveness, making it an ideal choice for opening up new market opportunities.
Now, let’s take a closer look at today’s first board. |
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From the stack-up, we can observe that the 1st to 2nd layers and the 4th to 3rd layers consist of a 12mil RO4003C core. The fixed thickness of this core is critical for maintaining the electrical length of RF lines on the circuit board. The remaining layers are made of FR-4 materials. Both the inner and outer layers feature a copper weight of 1 ounce.
In the second board, the FR-4 material is positioned between the 3rd and 4th layers. Depending on specific application requirements, the thickness of the dielectric material and FR-4 can be customized to meet design needs. |
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The 12mil RO4003C hybrid PCB finds extensive applications across various fields, including modular oscilloscopes, antenna combiners, balanced amplifiers, 4G antennas, and more.
The advantages of the 12mil RO4003C hybrid PCB are highlighted in the following three key points:
1. Stable Dielectric Constant: RO4003C maintains a consistent dielectric constant across a wide frequency range, making it an excellent choice for broadband applications.
2. Reduced Signal Loss: It minimizes signal loss in high-frequency applications, aligning with the evolving demands of modern communication technology.
3. Cost Efficiency: By combining RO4003C with FR-4, it offers a cost-effective solution compared to stack-ups using entirely low-loss materials, without compromising performance. |
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Currently, the well-established hybrid lamination material combinations include:
RO4350B and FR4
RO4003C and FR4
F4B and FR4
RT/duroid 5880 and RO4350B
RT/duroid 5880 and FR4 |
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Our PCB Capability (Hybrid Design) |
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PCB Type: |
Hybrid PCB, Mixed PCB |
Hybrid type: |
RO4350B + FR4; |
RO4003C + FR4; |
F4B + FR4; |
RT/duroid5880 + FR4; |
RT/duroid5880 + RO4350B |
RO3000 Series + FR4 |
RT/duroid +FR4 |
Solder mask: |
Green, Red, Blue, Black, Yellow |
Layer count: |
4 Layer, 6 Layer, Multilayer |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
1.0-10mm |
PCB size: |
≤400mm X 500mm |
Surface finish: |
Bare copper, HASL, ENIG, Immersion tin, Immersion silver, OSP, ENEPIG, Pure gold |
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In addition, we specialize in providing advanced PCB solutions, including blind via boards, buried via boards, and HDI boards. Every PCB manufactured by our company undergoes rigorous quality control processes, such as AOI testing, open and short circuit testing, solderability testing, and 288℃ thermal stress testing, to ensure that only high-quality products reach your hands.
Thank you for taking the time to read this. For any RF PCB inquiries, feel free to reach out to us—we’re here to assist you! |
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Appendix: RO4003C Data Sheet |
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RO4003C Typical Value |
Property |
RO4003C |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.38±0.05 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3.55 |
Z |
|
8 to 40 GHz |
Differential Phase Length Method |
Dissipation Factortan,δ |
0.0027
0.0021 |
Z |
|
10 GHz/23℃
2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
+40 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
1.7 x 1010 |
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MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
4.2 x 109 |
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MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
31.2(780) |
Z |
Kv/mm(v/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
Tensile Modulus |
19,650(2,850)
19,450(2,821) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
Tensile Strength |
139(20.2)
100(14.5) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
Flexural Strength |
276
(40) |
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MPa
(kpsi) |
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IPC-TM-650 2.4.4 |
Dimensional Stability |
<0.3 |
X,Y |
mm/m
(mil/inch) |
after etch+E2/150℃ |
IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion |
11
14
46 |
X
Y
Z |
ppm/℃ |
-55℃to288℃ |
IPC-TM-650 2.4.41 |
Tg |
>280 |
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℃ TMA |
A |
IPC-TM-650 2.4.24.3 |
Td |
425 |
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℃ TGA |
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ASTM D 3850 |
Thermal Conductivity |
0.71 |
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W/M/oK |
80℃ |
ASTM C518 |
Moisture Absorption |
0.06 |
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% |
48hrs immersion 0.060"
sample Temperature 50℃ |
ASTM D 570 |
Density |
1.79 |
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gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
1.05
(6.0) |
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N/mm
(pli) |
after solder float 1 oz.
EDC Foil |
IPC-TM-650 2.4.8 |
Flammability |
N/A |
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UL 94 |
Lead-free Process Compatible |
Yes |
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Hot Tags:
| 4 Layer RO4003CHybrid PCB |
12mil RO4003C and FR-4 laminate |
12mil FR-4 PCB |
Rogers RO4003C Hybird Material |
Multi-layer Board Designs |
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